• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2002년도 하계학술대회 논문집 Vol.3 No.2
• /
• pp.735-738
• /
• 2002

Single crystal 3C-SiC(cubic silicon carbide) thin-films were deposited on Si(100) substrate up to a thickness of $4.3{\mu}m$ by APCVD method using HMDS(hexamethyildisilane) at $1350^{\circ}C$. The HMDS flow rate was 0.5 sccm and the carrier gas flow rate was 2.5 slm. The HMDS flow rate was important to get a mirror-like crystal surface. The growth rate of the 3C-SiC films was $4.3{\mu}m/hr$. The 3C-SiC epitaxical films grown on Si(100) were characterized by XRD, AFM, RHEED, XPS and raman scattering, respectively. The 3C-SiC distinct phonons of TO(transverse optical) near $796cm^{-1}$ and LO(longitudinal optical) near $974{\pm}1cm^{-1}$ were recorded by raman scattering measurement. The heteroepitaxially grown films were identified as the single crystal 3C-SiC phase by XRD spectra$(2{\theta}=41.5^{\circ})$.

• 반도체디스플레이기술학회지
• /
• 제12권1호
• /
• pp.29-33
• /
• 2013

We have fabricated transparent polymer composite films with high thermal emissivity, which can be used for heat dissipation of transparent electronics. PMMA (poly(methyl methacrylate)) solution with high transparency and thermal emissivity is mixed with various fillers (carbon nanotubes (CNTs), aluminum nitride (AlN), or silicon carbide (SiC)) with high thermal conductivity. We have achieved the thermal emissivity as high as 0.94 by the addition of CNTs. Compared with the PMMA film on glass, however, the addition of AlN or SiC is shown to rather decrease the thermal emissivity. It is also observed that the thickness of the PMMA film does not affect its thermal emissivity. To avoid any degradation of the thermal conductivity, therefore, the PMMA film thickness is desirable to be $1{\mu}m$. There also exists a tradeoff between the optical transmittance and thermal conductivity on the selection of the amount of fillers.

• 한국진공학회지
• /
• 제5권2호
• /
• pp.133-138
• /
• 1996

단일 선구물질인 1, 3 -디실라부탄을 사용하여 고진공 하의 온도 영역 900-$1000^{\circ}C$에서 탄화규소 환충층이 형성된 Si(001) 기질 위에 입방형 탄화규소 박막을 적층 성장시켰다. 얻어진 탄화규소 박막의 화학량론적 비, 양질의 결정성 및 표면형태의 특성을 반사 고에너지 전자 회절, Xtjs 광전자 분광법, X선 회절, Xtjs 극접도, 주사 전자 현미경 및 투과 전자 현미경으로 확인하였다. 이들 결과로부터 단일 선구물질인 1, 3-디실라부탄이 입방구조를 가지는 탄화규소 박막의 적층 성장에 적절한 물질임을 밝혔다.

• 전자통신동향분석
• /
• 제29권6호
• /
• pp.53-62
• /
• 2014

본고는 최근 화두가 되고 있는 에너지 절감을 위해 고효율, 친환경의 WBG(Wide Band-Gap) 화합물반도체인 SiC(Silicon Carbide), GaN(Gallium Nitride) 전력반도체 소자 및 전력변환 모듈의 기술동향과 ETRI에서 연구개발 진행 중인 GaN 전력반도체 관련 기술에 대해 기술한다. WBG 전력반도체는 기존의 실리콘 전력반도체와 비교하여 열 특성 향상, 고속 스위칭, 고전압/고전류 특성 및 스위칭 손실 최소화 등이 가능하고 이에 따른 시스템의 소형화 및 전력효율 향상 효과를 얻을 수 있다. 특히, GaN 전력반도체 소자는 시장이 가장 넓게 형성되어 있는 900V 이하에 적용이 가능하며, 앞으로 시장이 커질 것으로 예상되는 HEV(Hybrid Electric Vehicle)/EV(Electric Vehicle)의 친환경 자동차에도 활용될 것으로 기대되고 있다. 본고는 최근의 일본과 미국에서의 WBG 전력반도체에 대한 관심 및 투자 방향과 GaN 전력반도체 소자에 대한 해외 기업의 업계동향에 대해서도 함께 살펴본다. 이러한 WBG 전력반도체에 대한 해외 선진업체의 산업동향과 더불어 ETRI에서 연구개발 중인 GaN 전력반도체 기술현황에 대해 전력소자 설계 및 제조공정, 패키징, 전력모듈 설계 제작 기술을 포함하여 기술한다.

• 한국결정학회지
• /
• 제5권1호
• /
• pp.39-50
• /
• 1994

Hot Tungsten Filament법에 의해 실리콘(Si), 몰리브데늄(Mo), 타이타늄(Ti), 텅스텐(W) 기판 위에 다이아몬드 박막을 증착시시키고 SEM, X선 회절분석 및 Raman spectroscopy로 분석하였다. 증착시간에 따른 증착실험의 결과로부터 내열금속위에 증착한 다이아몬드박막의 경우에는 먼저 탄화물 층이 형성되고, 그 이후에 다이아몬드가 핵형성되어 성장함을 알 수 있었다. 내열금속에 증착한 다이아몬드 박막은 5기판 위에 증착한 것과 비교할 때, 핵이 많이 형성되었고 facet이 잘 발달된 입자가 적었다. 5기판 뿐만 아니라 내열금속 기판 위에 다이아몬드막을 증착시킬 경우, 다이아몬드의 Raman 피크는 천연 다이아몬드에 비해 높은 주파수쪽으로 이동되었다. 이와같은 Raman 피크의 이동은 다이아몬드와 기판 사이의 열충격보다는 완충층의 역활을 하는 탄화물과 다이아몬드 사이의 열충격을 고려할 때 효과적으로 설명이 가능하였다. 생성된 탄화물의 형태와 다이아몬드 사이에 열충격이 가장 큰 Mo기판의 경우, 다이아몬드 Rarirm 피크의 이동이 가장 크게 나타났으며 Ti, W, Si기판의 순서로 이동이 적게 관찰되었다.

• 한국세라믹학회지
• /
• 제31권11호
• /
• pp.1307-1314
• /
• 1994

The aim of this work is to show the way of manufacturing the SiC mechanical seal at the low temperature of 130$0^{\circ}C$ using clay and frit as source of secondary phase. $\alpha$-SiC and $\beta$-SiC powder which showed different distribution of particle were used as starting materials, i.e. average particle size of $\alpha$-SiC was larger than that of $\beta$-SiC. The mechanical and tribological properties of two groups of specimen, i.e. one contained mainly larger $\alpha$-SiC powder and the other mainly fine particle $\beta$-SiC, were measured. The specimen consisted of larger $\alpha$-SiC exhibited lower density flexural strength and wear resistance is comparison with these of sample containning mainly $\beta$-SiC . This difference could be originated from the dependence of capillary force on the particle size. For the larger SiC particle, the liquid phase may not fill the whole pores during sintering, due to low capillary force, whereas the liquid phase can infiltrate into the small ores surrounded small $\beta$-SiC particle. Thus, the course of high flexural strength and high wear resistance of specimen prepared using small particles can be explaced from the easy infiltration of liquid phase.

• 한국세라믹학회지
• /
• 제21권1호
• /
• pp.27-32
• /
• 1984

During the last decade there have been many studies on the new ceramics especially engineering ceramics. Sintered silicon carbide is one of the main materials in engineering ceramics. This study shows the effects of surface treatment and microstructure especially the abnormal grain growth on the strength of sintered SiC. Surface of sintered SiC and treated with 400, 800 and 1200 grit diamond wheel. Grain growth is introduced by increasing the sintering times at 205$0^{\circ}C$. The $\beta$longrightarrow$\alpha$ transformation occurs during the sintering of $\beta$-starting materials and is often accompanied by abnormal grain growth. The overall strength distribution are estimated using the Weibull statistics. The results show that the strength of sintered SiC is limited by extrinsic surface flaws in normal-sintered specimens. And it is sound that the finer the surface finishing and the grain size the higher the strength results. But the strength of abnormal sintering specimens is limited by the abnormally-grown large tabular grains. The Weibull modulus increases with the decreasing grain size and the decreasing grit size of grinding.

• 한국세라믹학회지
• /
• 제45권2호
• /
• pp.132-137
• /
• 2008

The main purpose of this study is enhancing the filtering efficiency, performance and durability of filter by growing SiC whiskers on cordierite honeycomb substrate. The experiment was performed by Chemical Vapor Infiltration (CVI) in order to control pore morphology of substrate. Increasing the mechanical strength of porous substrate is one of important issues. The formation of "networking structure" in the pore of porous substrate increased mechanical strength. The high pressure gas injection to the specimen showed that a little of whiskers were separated from substrate but additional film coating enhanced the stability of whisker at high pressure gas injection. Particle trap test was performed. More nano-particle was trapped by whisker growth at the pore of substrate. Therefore it is expected that the porous cordierite which deposited the SiC whisker will be the promising material for the application as filter trapping the nano-particles.

• 한국결정성장학회:학술대회논문집
• /
• 한국결정성장학회 1999년도 PROCEEDINGS OF 99 INTERNATIONAL CONFERENCE OF THE KACG AND 6TH KOREA·JAPAN EMG SYMPOSIUM (ELECTRONIC MATERIALS GROWTH SYMPOSIUM), HANYANG UNIVERSITY, SEOUL, 06월 09일 JUNE 1999
• /
• pp.285-303
• /
• 1999

Thin films of hydrogenated amorphous silicon carbide compounds (a-SixC1x:H) of different compositions were deposited on Si substrate by RF plasma-enhanced chemical vapor deposition (PECVD). Experiments were carried out using silane(SiH4) and methane(CH4) as the gas precursors at 1 Torr and at low substrate temperature (25$0^{\circ}C$). The gas flow rate was changed with every other parameters (pressure, temperature, RF power) fixed. The substrate was Si(100) wafer and all of the films obtained were amorphous. The bonding structure of a-SixC1x:H films deposited was investigated by X-ray photoelectron spectroscopy (XPS) for the film compositions. In addition, the surface morphology of films was investigated by atomic force microscopy (AFM).

• 한국전기전자재료학회논문지
• /
• 제15권11호
• /
• pp.953-957
• /
• 2002

Single crystal 3C-SiC (cubic silicon carbide) thin-films were deposited on Si(100) wafer up to the thickness of 4.3 ${\mu}{\textrm}{m}$ by APCVD (atmospheric pressure chemical vapor deposition) method using HMDS (hexamethyildisilane; ｛CH$_{3}$｝$_{6}$ Si$_{2}$) at 135$0^{\circ}C$. The HMDS flow rate was 0.5 sccm and the carrier gas flow rate was 2.5 slm. The HMDS flow rate was important to get a mirror-like crystal surface. The growth rate of the 3C-SiC film was 4.3 ${\mu}{\textrm}{m}$/hr. The 3C-SiC epitaxial film grown on Si(100) wafer was characterized by XRD (X-ray diffraction), AFM (atomic force microscopy), RHEED (reflection high energy electron diffraction), XPS (X-ray photoelecron spectroscopy), and Raman scattering, respectively. Two distinct phonon modes of TO (transverse optical) near 796 $cm^{-1}$ / and LO (longitudinal optical) near 974$\pm$1 $cm^{-1}$ / of 3C-SiC were observed by Raman scattering measurement. The heteroepitaxially grown film was identified as the single crystal 3C-SiC phase by XRD spectra (2$\theta$=41.5。).).