• Title/Summary/Keyword: short through ratio

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A Study on Estimation of Forest Burn Severity Using Kompsat-3A Images (Kompsat-3A호 영상을 활용한 산불피해 강도 산정에 관한 연구)

  • Minsun Yang;Min-A Kim
    • Korean Journal of Remote Sensing
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    • v.39 no.6_1
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    • pp.1299-1308
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    • 2023
  • Forest fires are becoming more frequent and larger around the world due to climate change. Remote sensing such as satellite images can be used as an alternative or assistance data because it reduces various difficulties of field survey. Forest burn severity (differenced normalized burn ratio, dNBR) is calculated through the difference in normalized burn ratio (NBR) before and after a forest fire. The images used in the NBR formula are based on Landsat's near-infrared (NIR) and short-wavelength infrared (SWIR) bands. South Korea's satellite images don't have a SWIR band. So domestic studies related to forest burn severity calculated dNBR using overseas images or indirectly using the normalized difference vegetation index (NDVI) using South Korea's satellite images. Therefore, in this study, dNBR was calculated by substituting the mid-wavelength infrared (MWIR) band of Kompsat-3A (K3A) instead of the SWIR band in the NBR formula. The results were compared with the dNBR results obtained through Landsat which is the standard for dNBR formula. As a result, it was shown that dNBR using K3A's MWIR band has a wider range of values and can be expressed in more detail than dNBR using Landsat's SWIR band. Therefore, it is considered that K3A images will be highly useful in surveying burn areas and severity affected by forest fires. In addition, this study used the K3A's MWIR band images degraded to 30 m. It is considered that much better results will be obtained if a higher-resolution MWIR band is used.

Effective Cu Filling Method to TSV for 3-dimensional Si Chip Stacking (3차원 Si칩 실장을 위한 효과적인 Cu 충전 방법)

  • Hong, Sung Chul;Jung, Do Hyun;Jung, Jae Pil;Kim, Wonjoong
    • Korean Journal of Metals and Materials
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    • v.50 no.2
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    • pp.152-158
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    • 2012
  • The effect of current waveform on Cu filling into TSV (through-silicon via) and the bottom-up ratio of Cu were investigated for three dimensional (3D) Si chip stacking. The TSV was prepared on an Si wafer by DRIE (deep reactive ion etching); and its diameter and depth were 30 and $60{\mu}m$, respectively. $SiO_2$, Ti and Au layers were coated as functional layers on the via wall. The current waveform was varied like a pulse, PPR (periodic pulse reverse) and 3-step PPR. As experimental results, the bottom-up ratio by the pulsed current decreased with increasing current density, and showed a value of 0.38 on average. The bottom-up ratio by the PPR current showed a value of 1.4 at a current density of $-5.85mA/cm^2$, and a value of 0.91 on average. The bottom-up ratio by the 3-step PPR current increased from 1.73 to 5.88 with time. The Cu filling by the 3-step PPR demonstrated a typical bottom-up filling, and gave a sound filling in a short time.

Investment strategy using AESG rating: Focusing on a Korean Market

  • KIM, Eunchong;JEONG, Hanwook
    • The Journal of Industrial Distribution & Business
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    • v.13 no.1
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    • pp.23-32
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    • 2022
  • Purpose: This study used ESG grade, but defined AESG, adjusted to the size of a company and examines whether it can be used as an investment strategy. Research design, data and methodology: The analysis sample in this study is a company that has given an ESG rating among companies listed on the Korea Stock Exchange. We examine the results through portfolio analysis and Fama-macbeth regression analysis. Results: As result of examining the long-only performance and the long-short performance by constructing quintile portfolios, it was observed that a significant positive return was shown. It was observed that there was an alpha that could not be explained in asset pricing models. Also, AESG had a return prediction effect in the result of a Fama-Macbeth regression that controlled corporate characteristic variables in individual stocks. Next, we confirmed AESG's usage through various portfolio composition. In the portfolio optimization, the Risk Efficient method was the most superior in terms of sharpe ratio and the construct multi-factor model with Value, Momentum and Low Vol showed statistically significant performance improvement. Conclusions: The results of this study suggest that it can be helpful in ESG investment to reflect the ESG rating of relatively small companies more through the scale adjustment of the ESG rating (i.e.AESG).

Water Leaching of Tungsten and Vanadium through Mechanochemical Reaction of Their Oxides and Alkali-Compounds (알칼리화합물과 텅스텐/바나듐산화물의 기계화학반응을 이용한 수 침출 연구)

  • Kim, Byoungjin;Kim, Suyun;Lee, Jaeryeong
    • Resources Recycling
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    • v.27 no.4
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    • pp.57-64
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    • 2018
  • Water leaching of tungsten(W) and vanadium(V) was researched from their oxides through mechanochemical (MC) reaction with alkali compounds. Intensive grinding for the mixture of tungsten/vanadium oxide and alkali compounds (NaOH, $Na2CO_3$) was carried out with change of their mixing ratios and grinding duration. Water soluble compounds, $Na_2WO_4$ and $NaVO_3$, were synthesized through MC reaction and their solubilities increased in proportion to the mixing ratio of sodium compound and grinding times. Whereas vanadium leachability was less affected by the mixting ratio and grinding times. The leachabilities of 99.0% were accomplished by a short period of MC treatment, W (30 min.) and V (5 min.). This process enable us to extract W and V from their oxides via a water leaching, and can be applied to the selective recovery of W and V from $DeNO_x$ spent catalysts.

Normalized Difference Vegetation Index based on Landsat Images Variations between Artificial and Natural Restoration Areas after Forest Fire (산불 지역 인공·자연복원에 따른 Landsat영상 기반 식생지수 비교)

  • Noh, Jiseon;Choi, Jaeyong
    • Journal of the Korean Society of Environmental Restoration Technology
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    • v.25 no.5
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    • pp.43-57
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    • 2022
  • This study aims to classify forest fire-affected areas, identify forest types by the intensity of forest fire damage using multi-time Landsat-satellite images before and after forest fires and to analyze the effects of artificial restoration sites and natural restoration sites. The difference in the values of the Normalized Burned Ratio(NBR) before and after forest fire damage not only maximized the identification of forest fire affected and unaffected areas, but also quantified the intensity of forest fire damage. The index was also used to confirm that the higher the intensity of forest fire damage in all forest fire-affected areas, the higher the proportion of coniferous forests, relatively. Monitoring was conducted after forest fires through Normalized Difference Vegetation Index(NDVI), an index suitable for the analysis of effects by restoration type and the NDVI values for artificial restoration sites were found to no longer be higher after recovering the average NDVI prior to the forest fire. On the other hand, the natural restoration site witnessed that the average NDVI value gradually became higher than before the forest fires. The study result confirms the natural resilience of forests and these results can serve as a basis for decision-making for future restoration plans for the forest fire affected areas. Further analysis with various conditions is required to improve accuracy and utilization for the policies, in particular, spatial analysis through forest maps as well as review through site checks before and immediately after forest fires. More precise analysis on the effects of restoration will be available based on a long term monitoring.

A Study on the Cobalt Electrodeposition of High Aspect Ratio Through-Silicon-Via (TSV) with Single Additive (단일 첨가제를 이용한 고종횡비 TSV의 코발트 전해증착에 관한 연구)

  • Kim, Yu-Jeong;Lee, Jin-Hyeon;Park, Gi-Mun;Yu, Bong-Yeong
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2018.06a
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    • pp.140-140
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    • 2018
  • The 3D interconnect technologies have been appeared, as the density of Integrated Circuit (IC) devices increases. Through Silicon Via (TSV) process is an important technology in the 3D interconnect technologies. And the process is used to form a vertically electrical connection through silicon dies. This TSV process has some advantages that short length of interconnection, high interconnection density, low electrical resistance, and low power consumption. Because of these advantages, TSVs could improve the device performance higher. The fabrication process of TSV has several steps such as TSV etching, insulator deposition, seed layer deposition, metallization, planarization, and assembly. Among them, TSV metallization (i.e. TSV filling) was core process in the fabrication process of TSV because TSV metallization determines the performance and reliability of the TSV interconnect. TSVs were commonly filled with metals by using the simple electrochemical deposition method. However, since the aspect ratio of TSVs was become a higher, it was easy to occur voids and copper filling of TSVs became more difficult. Using some additives like an accelerator, suppressor and leveler for the void-free filling of TSVs, deposition rate of bottom could be fast whereas deposition of side walls could be inhibited. The suppressor was adsorbed surface of via easily because of its higher molecular weight than the accelerator. However, for high aspect ratio TSV fillers, the growth of the top of via can be accelerated because the suppressor is replaced by an accelerator. The substitution of the accelerator and the suppressor caused the side wall growth and defect generation. The suppressor was used as Single additive electrodeposition of TSV to overcome the constraints. At the electrochemical deposition of high aspect ratio of TSVs, the suppressor as single additive could effectively suppress the growth of the top surface and the void-free bottom-up filling became possible. Generally, copper was used to fill TSVs since its low resistivity could reduce the RC delay of the interconnection. However, because of the large Coefficients of Thermal Expansion (CTE) mismatch between silicon and copper, stress was induced to the silicon around the TSVs at the annealing process. The Keep Out Zone (KOZ), the stressed area in the silicon, could affect carrier mobility and could cause degradation of the device performance. Cobalt can be used as an alternative material because the CTE of cobalt was lower than that of copper. Therefore, using cobalt could reduce KOZ and improve device performance. In this study, high-aspect ratio TSVs were filled with cobalt using the electrochemical deposition. And the filling performance was enhanced by using the suppressor as single additive. Electrochemical analysis explains the effect of suppressor in the cobalt filling bath and the effect of filling behavior at condition such as current type was investigated.

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Design of a Frequency Offset Corrector and Analysis of Noises due to Quantization Angle in OFDM LAN Systems (OFDM 시스템에서 주파수편차 교정기의 설계와 각도 양자화에 의한 잡음의 분석)

  • 황진권
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.29 no.7A
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    • pp.794-806
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    • 2004
  • This paper deals with correction of frequency offset and analysis of quantization angle noise in the IEEE 802.1la OFDM system. The rotation phase per symbol due to the carrier frequency offset is estimated from auto-correlation of the short Preambles, which are over-sampled for the reduction of noise in OFDM signals. The pilot signals are introduced to estimate the rotation phase per OFDM symbol due to estimation error of the carrier frequency offset and the sampling frequency onset. During the estimation and correction of the frequency onsets, a CORDIC processor and a look-up table are used for the conversion between a rotation phase and its complex number. Being calculated by a limited number of bits in the CORDIC processor and the look-up table, the rotation phase and its complex number have quantization angle errors. The quantization errors are analyzed as SNR (signal to noise ratio) due to the quantization bit numbers. The minimum bit number is suggested to meet the specification of IEEE 802.1la properly. Finally, the quantization errors are evaluated through simulations on number of quantization bits and SNR of received signals.

Implementation of curved type a metallic plate system at the Bone contact (골 접촉 곡선형 금속 고정 시스템 구현)

  • Kim, Jeong-Lae
    • Journal of the Korea Society of Computer and Information
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    • v.12 no.5
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    • pp.285-292
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    • 2007
  • This study was developed the metallic plate for fixation in the femur fracture for the orthopedic region and rigid fixation with plates has a firm place in fracture treatment. Most plates can be used for rigid as well as biological and dynamical fracture fixation. The device's designation and sizing has a specific with bending structural stiffness and strength, known meaning that is reliable regardless of the plate by the short type and long type. Short plate have a wrapping of femur and long plate have to preserve a pole of femur. The bending strength of the curved metallic long plate has to evaluate a 11,000N and The bending strength of the curved metallic short plate has to evaluate a 6,525N. The tensile stress through to press a plate is $1573N/m^2\;and\;1539N/m^2$. The device can be used to support Revision case of Hip Implant and to use a case of Hip screw compression of Hip Neck Fracture.

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Design of the 140W level-small sized LED Power Control Circuit (140W 급-저면적 LED 전원 제어 회로 설계)

  • An, Ho-Myoung;Lee, Juseong;Kim, Byungcheul
    • The Journal of Korea Institute of Information, Electronics, and Communication Technology
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    • v.11 no.5
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    • pp.586-592
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    • 2018
  • In this paper, HIC with various functions is proposed for the design 140W LED power control circuit. The proposed HIC integrates constant voltage/constant current circuit, short circuit protection circuit, internal constant voltage circuit, and dimmer circuit, thereby reducing the horizontal length of the PCB by 16% comparing with the conventional system. Through various experiments, we verified the performance of each block implemented inside of HIC with numerical results. (Constant voltage variation ratio: 2.9%, dimmer circuit duty variation within 5%, stable short protection at 720 mA) Since the PCB area can be significantly reduced by applying the proposed HIC. It is possible to reduce the PCB manufacturing time which takes up most of the manufacturing time, however, It is expected that the faulted power module can be replaced without replacing the whole PCB, so that maintenance / repair can be made easier.

Application of deep convolutional neural network for short-term precipitation forecasting using weather radar-based images

  • Le, Xuan-Hien;Jung, Sungho;Lee, Giha
    • Proceedings of the Korea Water Resources Association Conference
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    • 2021.06a
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    • pp.136-136
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    • 2021
  • In this study, a deep convolutional neural network (DCNN) model is proposed for short-term precipitation forecasting using weather radar-based images. The DCNN model is a combination of convolutional neural networks, autoencoder neural networks, and U-net architecture. The weather radar-based image data used here are retrieved from competition for rainfall forecasting in Korea (AI Contest for Rainfall Prediction of Hydroelectric Dam Using Public Data), organized by Dacon under the sponsorship of the Korean Water Resources Association in October 2020. This data is collected from rainy events during the rainy season (April - October) from 2010 to 2017. These images have undergone a preprocessing step to convert from weather radar data to grayscale image data before they are exploited for the competition. Accordingly, each of these gray images covers a spatial dimension of 120×120 pixels and has a corresponding temporal resolution of 10 minutes. Here, each pixel corresponds to a grid of size 4km×4km. The DCNN model is designed in this study to provide 10-minute predictive images in advance. Then, precipitation information can be obtained from these forecast images through empirical conversion formulas. Model performance is assessed by comparing the Score index, which is defined based on the ratio of MAE (mean absolute error) to CSI (critical success index) values. The competition results have demonstrated the impressive performance of the DCNN model, where the Score value is 0.530 compared to the best value from the competition of 0.500, ranking 16th out of 463 participating teams. This study's findings exhibit the potential of applying the DCNN model to short-term rainfall prediction using weather radar-based images. As a result, this model can be applied to other areas with different spatiotemporal resolutions.

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