• Journal of Welding and Joining
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• 제15권6호
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• pp.57-65
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• 1997

A study was undertaken to determine the influence of welding variables such as shielding and plasma gases, torch standoff, travel speed and heat input, etc. on the quality of plasma arc welds in Zircaloy-4 sheet, 2mm thick. Effect of shielding gases and their flow rates on the mechanical properties of Zircaloy-4 welds by plasma arc welding were determined in terms of tensile, bardness and bend tests. The microstructure and fracture surface of Zircaloy-4 welds were investigated by optical and scanning electron microscopies. In addition, the causes of porosity and undercut in plasma arc welds of Zircaloy-4 were also investigated. Zircaloy-4 weld bead width and depth by helium shielding gas showed a wider and deeper than those by argon. It was found that Zircaloy-4 welds with shielding gas of helium did dxhibit a little smoother and uniform weld beads than those with shielding gas of argon. It was also found that the optimum gas flow rates for Zircaloy-4 welding were 0.45l/min for plasma gas with Ar and 4.5 - 6 l/min for shielding gas with He. In addition, there was no big difference in the microstructure and fracture surface of the weld metals made by either Ar shielding gas or He shielding gas.

• 한국분말재료학회지
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• 제27권3호
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• pp.256-267
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• 2020

Metal additive manufacturing (AM) technologies are classified into two groups according to the consolidation mechanisms and densification degrees of the as-built parts. Densified parts are obtained via a single-step process such as powder bed fusion, directed energy deposition, and sheet lamination AM technologies. Conversely, green bodies are consolidated with the aid of binder phases in multi-step processes such as binder jetting and material extrusion AM. Green-body part shapes are sustained by binder phases, which are removed for the debinding process. Chemical and/or thermal debinding processes are usually devised to enhance debinding kinetics. The pathways to final densification of the green parts are sintering and/or molten metal infiltration. With respect to innovation types, the multi-step metal AM process allows conventional powder metallurgy manufacturing to be innovated continuously. Eliminating cost/time-consuming molds, enlarged 3D design freedom, and wide material selectivity create opportunities for the industrial adoption of multi-step AM technologies. In addition, knowledge of powders and powder metallurgy fuel advances of multi-step AM technologies. In the present study, multi-step AM technologies are briefly introduced from the viewpoint of the entire manufacturing lifecycle.

• 한국재료학회지
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• 제16권6호
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• pp.386-393
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• 2006

Increasing environmental concerns require to solve the problem produced due to the use of heavy metals in coating formulations. Therefore, it is necessary to develop new coating strategy employing inherently conducting polymers such as polyaniline. Polyaniline is a conductive polymer that is synthesized by oxidation polymerization, and the electrochemical and chemical polymerization are possible for the oxidation of aniline. Electrochemical oxidation polymerization produces a fine surface and although voltage control is more convenient, it require electrolytic cells, and elaborate thin film can be acquired with the polymerization. Polyaniline films were electro-polymerized on cold rolled sheets using the galvanostat mode in the oxalic acidaniline-sodium molybdate electrolyte. The structure and properties of polyaniline film were studied using Potentiostat/Galvanostat 263A, FE-SEM,, AFM, SST, Colorimetry. A high corrosion resistance of polyaniline film was observed with an increase of corrosion potential by $500{\sim}600$ mV for the substrate covered with polyaniline.

• Advances in aircraft and spacecraft science
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• 제3권1호
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• pp.29-43
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• 2016

Composite materials are rapidly gaining popularity as an alternative to metals for structural and load bearing applications in the aerospace, automotive, alternate energy and consumer industries. With the advent of thermoplastic composites and advances in recycling technologies, fully recyclable composites are gaining ground over traditional thermoset composites. Stamp forming as an alternative processing technique for sheet products has proven to be effective in allowing the fast manufacturing rates required for mass production of components. This study investigates the feasibility of using the stamp forming technique for the processing of thermoplastic, recyclable composite materials. The material system used in this study is a self-reinforced polypropylene composite material (Curv$^{(R)}$). The investigation includes a detailed experimental study based on strain measurements using a non-contact optical measurement system in conjunction with stamping equipment to record and measure the formability of the thermoplastic composites in real time. A Design of Experiments (DOE) methodology was adopted to elucidate the effect of process parameters that included blank holder force, pre heat temperature and feed rate on stamp forming. DOE analyses indicate that feed rate had negligible influence on the strain evolution during stamp forming and blank holder force and preheat temperature had significant effect on strain evolution during forming.

• Design & Manufacturing
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• 제16권4호
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• pp.46-51
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• 2022

The piercing process of creating holes in sheet metals for mechanical fastening generates high shear force. Real-time monitoring technology could predict tool damage and product defects due to this severe condition, but there are few applications for piercing high-strength aluminum. In this study, we analyzed the load signal to predict the punch's wear level during the process with a piezoelectric sensor installed piercing tool. Experiments were conducted on Al6061 T6 with a thickness of 3.0 mm using piercing punches whose edge angle was controlled by reflecting the wear level. The piercing load increases proportionally with the level of tool wear. For example, the maximum piercing load of the wear-shaped punch with the tip angle controlled at 6 degrees increased by 14% compared to the normal-shaped punch under the typical clearance of 6.7% of the aluminum piercing tool. In addition, the tool wear level increased compression during the down-stroke, which is caused by lateral force due to the decrease in the diameter of pierced holes. Our study showed the predictability of the wear level of punches through the recognition of changes in characteristic elements of the load signal during the piercing process.

• 대한금속재료학회지
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• 제48권5호
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• pp.456-461
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• 2010

We investigated the In-based ohmic contacts on Nitrogen-face (N-face) n-type GaN, as well as Ga-face n-type GaN, for InGaN-based vertical Light Emitting Diodes (LEDs). For this purpose, we fabricated Circular Transfer Length Method (CTLM) patterns on the N-face n-GaN that were prepared by using a laser-lift off method, as well as on the Ga-face n-GaN that were prepared by using a dry etching method. Then, In/transparent conducting oxide (TCO) and In/TiW schemes were deposited on the CTLM in order for low resistance ohmic contacts to form. The In/TCO scheme on the Ga-face n-GaN showed high specific contact resistance, while the minimum specific contact resistance was only 3${\times}$10$^{-2}$ $\Omega$-cm$^{2}$ after annealing at 300${^{\circ}C}$, which can be attributed to the high sheet resistance of the TCO layer. In contrast, the In/TiW scheme on the Ga-face n-GaN produced low specific contact resistance of 2.1${\times}$10$^{5}$ $\Omega$-cm$^{2}$ after annealing at 500${^{\circ}C}$ for 1 min. In addition, the In/TiW scheme on the N-face n-GaN also resulted in a low specific contact resistance of 2.2${\times}$10$^{-4}$ $\Omega$-cm$^{2}$ after annealing at 300${^{\circ}C}$. These results suggest that both the Ga-face n-GaN and N-face n-GaN.

• 대한기계학회논문집A
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• 제37권7호
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• pp.841-849
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• 2013

본 연구에서는, 핵연료 지지격자 딤플 굴곡부에 성형결함을 줄이고자, 1차 스탬핑 금형이 추가된 2-step 스탬핑모델을 제시한다. 우선 순수굽힘 변형률과의 비교로, 딤플 굴곡부 변형률의 특성을 조사한다. 이어 2 차원 1-step 기준 스탬핑 유한요소모델을 정하고 이에 상응하는 최대변형률을 구한다. 1 차 스탬핑 금형의 설계변수들을 각각 변화시켜 변형률에 대한 목적함수를 구하고, 반응표면법을 이용해 1차 스탬핑 금형의 최적 변수값을 선정한다. 다음으로 이를 3차원 모델에 적용해 2-step 스탬핑 모델의 향상된 성형성을 확인한다.

• Corrosion Science and Technology
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• 제12권1호
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• pp.27-33
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• 2013

According to its merits about high curing speed and low emission of volatile organic compounds, UV curable inorganic-organic coating technology has been developed as an alternative for toxic and carcinogenic chromate-based treatments for years. It is consistently observed that ultra-thin films offer excellent corrosion protection as well as paint adhesion to metals. Based on the tetra-ethylorthosilicate(TEOS) and methacryloxypropyl trimethoxysilane(MPTMS), inorganic sol was synthesized and formed hybrid networks with UV curable acrylic monomer, 6-hexanediol diacrylate(HDDA), trimethylolpropane triacrylate(TMPTA), pentaerylthritol triacrylate(PETA). Several methods were used to test their properties such as salt spray test, potentiodynamic measurement, tape peel test, etc. It was shown that anti-corrosive property and stability of storage were affected by the molecular ratios of inorganic and organic compounds. It was not only the stability of storage, but had a excellent anti-corrosive, paint adhesive, and anti-solvent properties in a final molar ratios of 0.6/0.04/0.86/0.005 (TEOS/MPTMS/Acetone/HNO3) and 0.08/0.106/0.081/0.02 (TMPTA/HDDA/PETA/photo initiator).

• 한국진공학회:학술대회논문집
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• 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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• pp.293.1-293.1
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• 2016

Various materials including conductive, dielectric, and semi-conductive materials, constitute suitable candidates for printed electronics. Metal nanoparticles (e.g. Ag, Cu, Ni, Au) are typically used in conductive ink. However, easily oxidized metals, such as Cu, must be processed at low temperatures and as such, photonic sintering has gained significant attention as a new low-temperature processing method. This method is based on the principle of selective heating of a strongly absorbent film, without light-source-induced damage to the transparent substrate. However, Cu nanoparticles used in inks are susceptible to the growth of a native copper-oxide layer on their surface. Copper-oxide-nanoparticle ink subjected to a reduction mechanism has therefore been introduced in an attempt to achieve long-term stability and reliability. In this work, a flash-light sintering process was used for the reduction of an inkjet-printed Cu(II)O thin film to a Cu film. Using a photographic lighting instrument, the intensity of the light (or intense pulse light) was controlled by the charged power (Ws). The resulting changes in the structure, as well as the optical and electrical properties of the light-irradiated Cu(II)O films, were investigated. A Cu thin film was obtained from Cu(II)O via photo-thermal reduction at 2500 Ws. More importantly, at one shot of 3000 Ws, a low sheet resistance value ($0.2527{\Omega}/sq.$) and a high resistivity (${\sim}5.05-6.32{\times}10^{-8}{\Omega}m$), which was ~3.0-3.8 times that of bulk Cu was achieved for the ~200-250-nm-thick film.

• 대한기계학회논문집A
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• 제34권10호
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• pp.1463-1470
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• 2010

미세성형 기술은 다양한 소재의 활용, 높은 생산성과 적은 재료의 손실, 고품질 생산과 같은 기존 소성가공의 장점을 실현할 수 있기 때문에 마이크로 크기의 부품생산에 매우 유망한 기술로 간주되고 있다. 하지만 기존의 매크로 영역에서 축적된 많은 기술과 노하우들은 소재의 크기가 마이크로 단위에 줄어듦에 따라 나타나는 소위 "크기효과"로 인해 미세성형 공정에 그대로 적용될 수는 없다. 따라서, 본 연구에서는 마이크로 영역에서 나타나는 재료거동의 크기효과를 이론적, 실험적 연구를 통하여 고찰하였다. 다양한 두께의 구리시편에 열처리를 실시하여 결정립의 크기를 다양화 하였고, 인장시험을 통하여 시편의 두께와 결정립의 크기가 유동응력에 미치는 영향을 고찰하였다. 또한 이러한 크기효과의 정량적인 분석을 위하여 마이크로 및 매크로 영역에서 적용 가능한 소재의 유동응력 모델을 이론적으로 도출하였다.