• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.15 no.2
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• pp.67-73
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• 2009

The introduction of radio frequency identification (RFID) technology into cold chain system will be essentials for the better quality preservation of chilled products in the near future. The object of this study is to analyze the trends of international standardization activity for cold chain system and RFID packaging. The standardization of RFID technology is related to SC31 of ISO/IEC JTC1. The established standard from EPCglobal includes the air interface of UHF substitute actors, the control of EPC tag data and the event collected from RFID readers, the directory services and information storage of ONS and EPCIS, and securities. Also, EPC standards include the sensor functions of the cold chain. In Korea, the RFID packaging related techniques and their engineering standard are less studied as compared with Europe or North America. For effective application of RFID in the cold chain and packaging, scientific and systematic researches on RFID, including technical standards for domestic RFID frequency, will be key elements for preoccupation of these application techniques.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.557-558
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• 2010

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.4 no.3
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• pp.167-173
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• 2011

Since many blood pressure pulse analyzer made to measurement of a pulse wave in quantitative way has been started, some sorts of pressure sensors are being developed. The result could differ and this cause either type of sensor or module shape, when pulse wave is measured. In this paper, calculate and compare the pressure sensor's stress distribution according to thickness of PDMS coating and existence of guide through Finite Element Method. As a result, the center of pressure sensor's stress increase as much as 24% as it is reduced as much as 0.3 mm that the PDMS coating thichness of pulse diagnostic sensor module, on the other hand the surrouding censor of center sensor's stress is reduced as much as 4.9%, and transmissive proportion of stress is small as little as 2.7%, When coating has guide.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.3
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• pp.37-41
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• 2002

In this research, we investigate the properties of membrane and thin film sensor which is using magnetic resonance properties. we expect to $Si_xN_y$ and SiC materials as membrane materials, we measured thin film stress and properties to find the best membrane fabrication condition. Of the two membrane, $Si_xN_y$ thin film is the better than SiC thin film. because of an adequate tensile stress and lower thermal expansion coefficient as sensor structure layer. After performing deposition and patterning thin film sensor material on $Si_xN_y$, we analyzed the magnetic hysteresis and magnetic resonance frequency of sensor. If the magnetic field which is applied in sensor material is removed, magnetization made by magnetic field is transited to elastic mode. moreover. energy radiation is induced during the transition and voltage generates in sensor by energy radiation. At this moment, If voltage generation period is longer, mechanical vibration is induced and signal is generated by mechanical vibration. we also see that as the increase of thin film sensor' length and width, magnetic resonance frequency is decreased.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.4
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• pp.21-27
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• 2003

The copolymers with various composition of methyl methacrylate (MMA), ethyl methacrylate (EMA), methacrylic acid (MA) and hydroxyethyl methacrylate (HEMA) were synthesized for capacitive humidity sensitive materials. The capacitive humidity sensor consisted of a polymethacrylate film coated on both sides with gold electrode. Capacitance versus relative humidity increased with HEMA content in the copolymer. In the case of self-crosslinkable MMA/MA/HEHA= 40/10/10, the average capacitance at 30%RH, 60%RH and 90%RH are 102, 134 and 166 pF, respectively. And also, the hysteresis, temperature cycle and long-term stability were evaluated as a capacitance humidity sensor.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.4
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• pp.65-70
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• 2006

Carbon nanotubes (CNT) grown by chemical vapor deposition (CVD) and plasma enhanced chemical vapor deposition (PECVD), and followed by annealing at $400{\sim}500^{\circ}C$ were investigated for gas sensing under 1.5ppm $NO_{2}$ concentration at an operating temperature of $200^{\circ}C$. The electrical resistance of CNT sensor decreased with temperature, indicating a semiconductor type. The resistance of CNT sensor decreased with $NO_{2}$ adsorption. It was found that the sensitivity of sensor was affected by humidity and decreased under microwave irradiation for 3 minutes. The CNT sensor grown by PECVD had a higher sensitivity than that of CVD.

• Journal of the Korean Society for Precision Engineering
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• v.24 no.10
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• pp.83-90
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• 2007

The vehicle dynamic control system needs to detect the yaw rate of vehicle and a yaw rate sensor is required as a central component. Therefore, A sensor on the basic of the "tuning fork method" for automotive controls is being developed. The sensor was fabricated by the surface micro machining process to miniaturize its size. The sensor output offset is ${\pm}0.37^{\circ}/sec$ in the room temperature. The resonance frequency of the fabricated yaw rate sensor is measured to 5.29kHz for the drive mode. Tests of the sensor demonstrate that its performance is equivalent to that required for implementation of a yaw control system. Vehicle handling and safety are substantially improved using the sensor to implement yaw control.

• Food Science and Preservation
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• v.23 no.3
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• pp.422-431
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• 2016

To investigate the causes of the thermal deformations of packaging materials when microwave-heating ready-to-eat sauce products packaged in stand-up pouches, patterns of temperature changes were determined using an infra-red thermal imaging camera, a thermo-sensitive tape, and a fiver-optic thermometer. The temperature distributions of spicy chicken sauce and Indian curry samples in a stand-up pouch were found to be uneven during micrewave heating. A sharp increase in the temperature was detected, especially above the filling layers and in the corners of sealing layers of the package. The temperature measurements using an infra-red thermal imaging camera are restricted to the surface, and therefore might underestimate the actual temperature. Using a thermo-sensitive tape, temperature up to $200^{\circ}C$ were measured in the spicy chicken sauce sample showing package deformation. When the temperature is measured using a fiber-optic thermometer, it is crucial to have precise sensor performance to accurately measure the temperature in a narrow hot-spot area of the package. In this experiment, the fiber-optic thermometer was attached to a GaAs crystal sensor, which obtained more sensitive and accurate temperature measurements than those by a convectional sensor.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.30A no.7
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• pp.82-88
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• 1993

This paper describes fabrication of relative type capacitive pressure sensor to be in great demand for many fields. The fabricated sensor consists of two parts` a sensing diaphragm and a pyrox glass cover. The sensor size is 4.5${\times}3.4mm$^{2})$ and 400$\mu$m thick. To improve the nonlinearity, this sensor is designed a rectangular silicon diaphragm with a center boss structure, and in order to improve the temperature characteristics of the sensor in a packaging process, the sensing element is mounted on the pyrex glass support. Some suggestions toward the design and fabrication of improved sensors have been presented. The zero pressure capacitance, Co of sensor is 26.57pF, and the change of capacitance, ${\Delta}$C is 1.55pF from 0Kgf/Cm$^{2}$ to 1Kgf/Cm$^{2}$ at room temperature. The nonlinearity of the sensor output with center boss diaphragm is 1.29%F.S., and thermal zero shift and thermal sensitivity shift is less than 1.43%F.S./$^{\circ}C$and 0.14% F.S./$^{\circ}C$, respectively.

• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.1978.1_1979.1
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• 2009

In this paper, we have proposed and demonstrated a tonometry sensor array for measuring arterial pulse pressure. A sensor module consists of 7 piezoresistive pressure sensor array. Wire-bonded connection was provided between silicon chip and lead frame. PDMS(poly-dimethylsiloxane) was coated on the sensor array to protect fragile sensor while faithfully transmitting the pressure of radial artery to the sensor. Tonometric pulse pressure can be measured by this packaged sensor array that provides the pressure value versus the output voltage.