• Journal of Sensor Science and Technology
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• v.32 no.2
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• pp.105-109
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• 2023

In this study, we present a power-efficient driving method for gas sensor systems based on the analysis of input signal characteristics. The analysis of the gas sensor output signal characteristics in the frequency domain shows that most of the signal portions are distributed in a relatively low frequency region when extracting the gas sensor signal, which can lead to further performance improvement of the gas sensor system. Therefore, the proposed gas signal extracting technique changes the operating frequency of the read-out circuit based on the frequency characteristics of the output signal of the gas sensor, resulting in a reduction of power consumption at the whole system level. The proposed sensing technique, which can be applied to a general-purpose commercial gas sensor system, was implemented in a printed circuit board (PCB) to verify its effectiveness at the commercial level.

• Proceedings of the KSME Conference
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• 2004.11a
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• pp.1231-1235
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• 2004

The needs of micro scale thermal detecting technique are increasing in biology and chemical industry. For example, Thermal finger print, Micro PCR(polymer chain reaction), ${\mu}TAS$ and so on. To satisfy these needs, we developed a DTSA(Diode Temperature Sensor Array) for detecting and controlling the temperature on small surface. The DTSA is fabricated by using VLSI technique. It consists of 32 ${\times}$ 32 array of diodes (1,024 diodes) for temperature detection and 8 heaters for temperature control on a 8mm ${\times}$ 8mm surface area. The working principle of temperature detection is that the forward voltage drop across a silicon diode is approximately proportional to the inverse of the absolute temperature of diode. And eight heaters ($1K{\Omega}$) made of poly-silicon are added onto a silicon wafer and controlled individually to maintain a uniform temperature distribution across the DTSA. Flip chip packaging used for easy connection of the DTSA. The circuitry for scanning and controlling DTSA are also developed

• Journal of the Microelectronics and Packaging Society
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• v.12 no.3 s.36
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• pp.267-274
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• 2005

This paper presents the fabrication of surface acoustic wave (SAW)-based pressure sensor for long-term stable mechanical compression force measurement. SAW pressure sensor has many attractive features for practical pressure measurement: no battery requirement, wireless pressure detection especially at hazardous environments, and easy other functionality integrations such as temperature, humidity, and RFID. A $41^{\circ}$ YX $LiNbO_3$ piezoelectric substrate was used because of its high SAW propagation velocity and large values of electromechanical coupling factors $K^2$. A silicon substrate with $\~200{\mu}m$ deep cavity was bonded to the diaphragm with epoxy, in which gold was covered all over the inner cavity in order to confine electromagnetic energy inside the sensor, and provide good isolation of the device from its environment. The reflection coefficient $S_{11}$ was measured using network analyzer. High S/N ratio, sharp reflected peaks, and clear separation between the peaks were observed. As a mechanical compression force was applied to the diaphragm from top with extremely sharp object, the diaphragm was bended, resulting in the phase shifts of the reflected peaks. The phase shifts were modulated depending on the amount of applied mechanical compression force. The measured $S_{11}$ results showed a good agreement with simulated results obtained from equivalent admittance circuit modeling.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.1
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• pp.33-38
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• 2012

An in-plane thermoelectric sensor was processed on a glass substrate by evaporation of the n-type Bi-Te and p-type Sb-Te thin films, and its sensing characteristics were evaluated. The n-type Bi-Te thins film used to fabricate the inplane sensor exhibited a Seebeck coefficient of -165 ${\mu}V$/K and a power factor of $80{\times}10^{-4}W/K^2-m$. The p-type Sb-Te thin film used to fabricate the in-plane sensor exhibited a Seebeck coefficient of 142 ${\mu}V$/K and a power factor of $51.7{\times}10^{-4}W/K^2-m$. The in-plane thermoelectric sensor consisting of 15 pairs of the n-type Bi-Te and the p-type Sb-Te evaporated thin films exhibited a sensitivity of 2.8 mV/K.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.4
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• pp.83-87
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• 2022

Recently, as the thickness of the semiconductor package becomes thinner, warpage has become a major issue. Since the warpage is caused by differences in material properties between package components, it is essential to precisely evaluate the material properties of the EMC(Epoxy molding compound), one of the main components, to predict the warpage accurately. Especially, the cure shrinkage of the EMC is generated during the curing process, and among them, the effective cure shrinkage that occurs after the gelation point is a key factor in warpage. In this study, the gelation point of the EMC was defined from the dissipation factor measured using the dielectric sensor during the curing process similar with actual semiconductor package. In addition, DSC (Differential scanning calorimetry) test and rheometer test were conducted to analyze the dielectrometry measurement. As a result, the dielectrometry was verified to be an effective method for monitoring the curing status of the EMC. Simultaneously, the strain transition of the EMC during the curing process was measured using the FBG (Fiber Bragg grating) sensor. From these results, the effective cure shrinkage of the EMC during the curing process was measured.

• Journal of the Microelectronics and Packaging Society
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• v.31 no.1
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• pp.1-6
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• 2024

Spiders detect even tiny vibrations through their vibrational sensory organs. Leveraging their exceptional vibration sensing abilities, they can detect vibrations caused by prey or predators to plan attacks or perceive threats, utilizing them for survival. This paper introduces a nanoscale crack-based sensor mimicking the spider's sensory organ. Inspired by the slit sensory organ used by spiders to detect vibrations, the sensor with the cracks detects vibrations and pressure with high sensitivity. By controlling the depth of these cracks, they developed a sensor capable of detecting external mechanical signals with remarkable sensitivity. This sensor achieves a gauge factor of 16,000 at 2% strain with an applied tensile stress of 10 N. With high signal-to-noise ratio, it accurately recognizes desired vibrations, as confirmed through various evaluations of external force and biological signals (speech pattern, heart rate, etc.). This underscores the potential of utilizing biomimetic technology for the development of new sensors and their application across diverse industrial fields.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.110-110
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• 2000

Cantilever-shaped lateral field emitters were fabricated and their electrical characteristics were tested. As shown in Fig.1, poly-silicon cantilevers were fabricated by the surface micromachining and they were used to the vacuum magnetic field sensors. The tunneling devices were vacuum sealed with the tubeless packaging method, as shown in Fig.2 and Fig.3. The soda-lime glasses were used for better encapsulation, so the sputtered silicon and the glass layers on the soda-lime glasses were bonded together at 1x10$^{-6}$ Torr. The getter was activated after the vacuum sealing fur the stable emissions. The devices were tested outside of the vacuum chamber. Through vacuum packaging, the tunneling sensors can be utilized. Fig.4 shows that the sensor operates with the switching of the magnetic field. When the magnetic field was applied to the device, the anode currents were varied by the Lorentz force. The difference of anode currents can be varied with the strength of the applied magnetic field.

• Proceedings of the KIEE Conference
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• 2002.07c
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• pp.1979-1981
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• 2002

새로운 방식의 일체형 flexible sensor module을 제작하였다. MEMS공정을 이용하여 제작된이 센서 모듈은 배선기판은 물론 strain sensor 역시 임의의 곡면에 실장을 위해 자유로운 굽힘이 가능하도록 제작되었다. 실리콘웨이퍼에 구현된 piezoresistor 스트레인 센서는 release-etch 방법을 통해 웨이퍼로부터 분리되어, 폴리이미드를 기판으로 하는 Flexible Sensor Array Module로 완성되었다. 소자와 기판을 따로 제작한 후 조립하는 기존의 방식에 비해, 웨이퍼 위에서 flexible 기판을 형성하여 수율이 높고 사진공정의 정밀도를 그대로 보전한 기판과 센서 어레이의 패키징이 가능하였으며, 칩을 기판에 실장하기 위한 정밀한 조립공정도 불필요하였다. 폴리이미드 기판은 전기도금을 통해 회로를 구성하여 1단계 패키징 (die to chip carrier)과 2단계 패키징 (chip to substrate)을 웨이퍼 레벨에서 완성하였다. 마지막으로 불산 용액을 통해 희생층을 제거함으로서 웨이퍼로 부터 센서어레이 모듈을 분리 하였다.

• Journal of Sensor Science and Technology
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• v.24 no.3
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• pp.159-164
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• 2015

Solid state electrochemical and chemo-resistive gas sensors have been used widely but can operate only under high temperature. For reducing the power consumption and optimizing the structure of the substrate of these sensors, we conducted device and circuit simulations using the COMSOL Multiphysics simulator. For assessing the effective types of substrate and heat isolation, we conducted three-dimensional thermal simulations in two separate parts; (a) by changing the shape of the contacting holes and (b) punching additional holes on the substrate. Thus, it was possible to achieve high temperature in the sensor end of the substrate while maintaining low power consumption, and temperature in the circuit.

• Transactions on Electrical and Electronic Materials
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• v.7 no.4
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• pp.184-188
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• 2006

This work describes efforts in the fabrication and testing of robust microelectromechanical systems (MEMS). Robustness is typically achieved by investigating non-silicon substrates and materials for MEMS fabrication. Some of the traditional MEMS fabrication techniques are applicable to robust MEMS, while other techniques are drawn from other technology areas, such as electronic packaging. The fabrication technologies appropriate for robust MEMS are illustrated through laminated polymer membrane based pressure sensor arrays. Each array uses a stainless steel substrate, a laminated polymer film as a suspended movable plate, and a fixed, surface micromachined back electrode of electroplated nickel. Over an applied pressure range from 0 to 34 kPa, the net capacitance change was approximately 0.14 pF. An important attribute of this design is that only the steel substrate and the pressure sensor inlet is exposed to the flow; i.e., the sensor is self-packaged.