• 제목/요약/키워드: semiconductor work environment

검색결과 46건 처리시간 0.024초

반도체 공정 설비 정비 작업 안전보건 가이드: 증착, 식각, 이온주입 (Development of a General Occupational Safety and Health (OSH) Guide for Maintenance in Etching, Deposition, and Ion Implantation Facilities)

  • 조경이;한택현;문재진;정인균;황영우;권세영;고경윤;이민건;장재필;박동욱
    • 한국산업보건학회지
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    • 제34권2호
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    • pp.125-133
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    • 2024
  • Objectives: The aim of this study is to develop a comprehensive Occupational Safety and Health (OSH) guide for maintenance tasks in semiconductor processing, specifically focusing on etching, deposition, and ion implantation processes. Methods: The development of the OSH guide involved a literature review, consultations with industry experts, and field investigations. It concentrates on Maintenance Work (MW) operations in these specialized areas. Results: The result is a detailed OSH guide tailored to MW in etching, deposition, and ion implantation facilities within semiconductor processing. This guide is structured to assist maintenance workers through pre-, during and post-MW phases, ensuring easy comprehension and adherence to safety protocols. It highlights the necessity of safety and health measures throughout the MW process to protect personnel. The guide is enriched with real-life scenarios and visual aids, including cartoons and photographs, to aid in the understanding and implementation of safety and health principles. Conclusions: This OSH guide is designed to enhance the protection of workers engaged in maintenance activities in the electronics sector, particularly in semiconductor manufacturing. It aims to improve compliance with safety and health standards in these high-risk environments.

반도체 공정 근로자 직무 노출을 추정하기 위한 설문(Job-specific Questionnaire) 개발 (Job-specific Questionnaire for Estimating Exposure to Hazardous Agents among Semiconductor Workers)

  • 박동욱;최상준;허정진;노현석;박지훈;하권철;윤충식;김원;김승원;김형렬;권호장
    • 한국산업보건학회지
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    • 제26권1호
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    • pp.58-63
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    • 2016
  • Objectives: One major limitation encountered in retrospective exposure assessment for epidemiological study is the lack of exposure records and information maintained by companies which if they existed would allow the estimation of past exposure to hazardous operations and agents. This study developed a job-specific questionnaire(JSQ) to estimate exposure profiles among semiconductor workers, including operation and job. Methods: This JSQ can be directly applied to workers who work or have worked in a wafer fabrication or a chip packaging and assembly facility. Results and Conclusions: We used this JSQ to obtain past exposure information from semiconductor workers via face-to-face investigation. Major contents include questions on the facilities, operations and jobs to which they have been exposed since they entered employment in the semiconductor industry. The total number of questions in the JSQ is 18. Responses to this JSQ can be used not only to estimate retrospective exposure to operations and jobs in the semiconductor industry, but also to associate with the risk of all causes of death and risk of disease, including cancer.

제조시스템자동화에 있어서 BPEL 기반 워크플로우 관리시스템의 적용 (The Implementation of BPEL based Workflow Management System in Manufacturing System Automation)

  • 박동진;;장병훈;김수경
    • 한국IT서비스학회:학술대회논문집
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    • 한국IT서비스학회 2009년도 춘계학술대회
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    • pp.270-276
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    • 2009
  • This paper outlines opportunities and challenges in the Implementation of BPEL based WFMS(Work Flow Management System) for the MES(Manufacturing Execution Systems) level in semiconductor manufacturing. At present, the most MES that are composed of several hundreds of applications in semiconductor wafer fabrication shop have the same problems as others about flexibility and adaptability. When a plant has to produce new product mix, remodel the manufacturing execution process, or replace obsolete equipments, the principal road blocks for responding to new manufacturing environment are inflexible communication infrastructure among the manufacturing process components and the difficulty in porting existing application software to new configurations. In this paper, the issues about BPEL standard, used for the flexibility of Workflow Management System, are presented. We introduce the integrated development framework named nanoFlow which is optimized for developing the BPEL based WFMS application for automated manufacturing system. We describe a WFMS implemented with using nanoFlow framework, review and evaluate the system in terms of flexibility and adaptability.

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전리수를 이용한 Si 웨이퍼 세정의 IR 특성연구 (A Study on IR Characterization of Electrolyzed Water for Si Wafer Cleaning)

  • Byeongdoo Kang;Kunkul Ryoo
    • 한국산학기술학회:학술대회논문집
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    • 한국산학기술학회 2001년도 춘계학술대회 발표논문집
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    • pp.124-128
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    • 2001
  • A present semiconductor cleaning technology is based upon RCA cleaning technology which consumes vast amounts of chemicals and ultra pure water(UPW) and is the high temperature Process. Therefore, this technology gives rise to the many environmental issues, and some alternatives such as functional water cleaning are being studied. The electrolyzed water was generated by an electrolysis system which consists of anode, cathode, and middle chambers. Oxidative water and reductive water were obtained in anode and cathode chambers, respectively. In case of NH$_4$Cl electrolyte, the oxidation-reduction potential and pH for anode water(AW) and cathode water(CW) were measured to be +1050mV and 4.8, and -750mV and 10.0, respectively. AW and CW were deteriorated after electrolyzed, but maintained their characteristics for more than 40 minutes sufficiently enough for cleaning. Their deterioration was correlated with CO$_2$ concentration changes dissolved from air. It was known that AW was effective for Cu removal, while CW was more effective for Fe removal. The particle distributions after various particle removal processes maintained the same pattern. In this work, RCA consumed about 9$\ell$chemicals, while EW did only 400$m\ell$ HCI electrolyte or 600$m\ell$ NH$_4$Cl electrolyte. It was hence concluded that EW cleaning technology would be very effective for eliminating environment, safety, and health(ESH) issues in the next generation semiconductor manufacturing.

전리방사선 노출과 관리 (Exposure Assessment and Management of Ionizing Radiation)

  • 정은교;김갑배;송세욱
    • 한국산업보건학회지
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    • 제25권1호
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    • pp.27-35
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    • 2015
  • Objectives: To investigate safety and health management, conditions in factories or facilities handling radiation-generating devices and radioactive isotopes were reviewed in terms of regulations of radiation safety control in Korea. Radiation exposure levels generated at those facilities were directly measured and evaluated for establishing an effective safety and health management plan. Methods: Government organizations with laws and systems of radiation safety and health were investigated and compared. There are three laws governing radiation-related employment such as occupational safety and health acts, nuclear safety acts, and medical service acts. We inspected 12 workplaces as research objects:four workplaces that manufacture and assemble semiconductor devices, three non-destructive inspection workplaces that perform inspections on radiation penetration, and five workplaces in textile and tire manufacturing. Monitoring of radiation exposure was performed through two methods. Spatial and surface monitoring using real-time radiation instruments was performed on each site handling radiation generating devices and radioactive isotopes in order to identify radiation leakage. Results: According to the occupational safety and health act, there is no legal obligation to measure ionizing radiation and set dose limits. This can cause confusion in the application of the laws, because the scopes and contents are different from each other. Surface dose rates in radiation generating devices such as implanters, thickness gages and accelerators, which were registered according to nuclear safety acts, using surveymeters, and seven of 36 facilities(19.4%) exceeded the international standards for surface radiation dose of $10{\mu}Sv/hr$. Conclusions: The results showed that occupational health and safety acts require a separate provision for measuring and assessing the radiation exposure of workers performing radiation work. Like noise, ionizing radiation will also periodically be controlled by including it in the object factors of work-environment measurement.

반도체 산업환경에서의 방진복 디자인의 개발 (Development of Cleanroom Garment Design in Semiconductor Industrial Environment)

  • 이윤정;정찬주;정재은
    • 한국의류학회지
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    • 제26권2호
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    • pp.337-348
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    • 2002
  • Based upon literature survey and questionnaire survey, this research tries to develop four new Cleanroom Garment in semiconductor industrial environment. The designs emphasize to minimize workers disconmfort so that they can not only cover human body fully but also reduce dust as much as possible during work hour in clean room. The new designs characteristics and results from both function test and dust emission test are as follows: 1. In order to reduce dust-emission, we develop new designs with hood, kimono sleeve, and back zipper. The designs with hood face positive test results in term of motion suitability and dust-omission. The design with seam in front, in particular, is effective to control dust-emission. 2. For the purpose of reducing dust-emission, we also emphasize to minimize ease of dust-proof wear, with reference to previous research and clothing experiment. The experiment participants report that the new wears are not so comfortable as existing ones, but they accept the new wears positive as effective in reducing dust-emission owing to reduced ease of Cleanroom Garment and sleeves. 3. A1so to reduce dust-emission in inner wear, we put inner wear in both Cleanroom Garments and inner wear, resulting to remove discomfort of wearers when changing clothes and of tight waist due to inner-trousers. 4. We develop new designs with elastic bands in both waist through the side lines and with velcro only at the back side. To remove twist in front contributes to reduce emission arising out of friction, also to free the appearance minding woman workers from worrying about exposed stomach. The new designs need to be accepted as a valuable alternative of Cleanroom Garment, in that they are highly effective to reduce dust-emission, which is the most important factor in the wear, in spite of some drawbacks in terms of motion-suitability, ease and appearance as shown in wearing test.

반도체 클린룸용 배기 열회수식 외기공조시스템의 에너지절감에 관한 실험적 연구 (An Experimental Study on Energy Reduction of an Exhaust Air Heat Recovery Type Outdoor Air Conditioning System for Semiconductor Manufacturing Clean Rooms)

  • 송근수;유경훈;강신영;손승우
    • 설비공학논문집
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    • 제21권5호
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    • pp.273-281
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    • 2009
  • In recent semiconductor manufacturing clean rooms, the energy consumption of outdoor air conditioning systems represents about 45% of the total air conditioning load required to maintain a clean room environment. Meanwhile, there is a large amount of exhaust air from a clean room. From an energy conservation point of view, heat recovery from the exhaust air is therefore useful for reducing the outdoor air conditioning load for a clean room. In the present work, an energy-efficient outdoor air conditioning system was proposed to reduce the outdoor air conditioning load by utilizing an air washer to recover heat from the exhaust air. The proposed outdoor air conditioning system consisted mainly of a preheating coil, an air washer, two stage cooling coils, a reheating coil, a humidifier and two heat recovery cooling coils inserted into the air washer and connected to a wet scrubber. It was shown from the lab-scale experiment with outdoor air flow of $1,000\;m^3/h$ that the proposed system was more energy-efficient for the summer and winter operations than an outdoor air conditioning system with a simple air washer.

전자산업 공정 설비 작업 안전보건가이드 개발 (Development of a General Occupational Safety and Health (OSH) Guide for Maintenance Work at Electronics Industry Processing Facilities)

  • 김소연;이승희;박정연;한택현;문재진;정인균;조경이;권세영;정광재;박동욱
    • 한국산업보건학회지
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    • 제34권1호
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    • pp.18-25
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    • 2024
  • Objectives: The primary aim of this study is to create an Occupational Safety and Health (OSH) guide for high-risk maintenance tasks, specifically one designed for maintenance work (MW) in the electronics industry. Methods: The methodology involved a literature review, field investigations, and discussions. An initial draft of the OSH guide was created and then refined through consultations with experts possessing extensive experience in MW for electronic processes. Results: Specific MW tasks within electronics processing facilities identified as high-risk by the research were selected. A comprehensive OSH guide for these tasks was developed consisting of approximately 11 to 12 components and encompassing about 20-25 pages. Implementing safety and health measures before, during, and after MW is crucial for the protection of maintenance personnel. The guide is enriched with real-case scenarios of industrial accidents and occupational diseases to enhance maintenance workers' comprehension of the OSH principles. For a clearer understanding of and adherence to the safety protocols, the guide incorporates visual aids, including cartoons and photographs. Conclusions: This OSH guide is designed to ensure the protection of workers involved in maintenance activities in the electronics industry. It aligns with global standards set by the International Organization for Standardization (ISO) and Semiconductor Equipment and Material International (SEMI) to ensure a high level of safety and compliance.

Hydrogen and Ethanol Gas Sensing Properties of Mesoporous P-Type CuO

  • Choi, Yun-Hyuk;Han, Hyun-Soo;Shin, Sun;Shin, Seong-Sik;Hong, Kug-Sun
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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    • pp.222-222
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    • 2012
  • Metal oxide gas sensors based on semiconductor type have attracted a great deal of attention due to their low cost, flexible production and simple usability. However, most works have been focused on n-type oxides, while the characteristics of p-type oxide gas sensors have been barely studied. An investigation on p-type oxides is very important in that the use of them makes possible the novel sensors such as p-n diode and tandem devices. Monoclinic cupric oxide (CuO) is p-type semiconductor with narrow band gap (~1.2 eV). This is composed of abundant, nontoxic elements on earth, and thus low-cost, environment-friendly devices can be realized. However, gas sensing properties of neat CuO were rarely explored and the mechanism still remains unclear. In this work, the neat CuO layers with highly ordered mesoporous structures were prepared by a template-free, one-pot solution-based method using novel ink solutions, formulated with copper formate tetrahydrate, hexylamine and ethyl cellulose. The shear viscosity of the formulated solutions was 5.79 Pa s at a shear rate of 1 s-1. The solutions were coated on SiO2/Si substrates by spin-coating (ink) and calcined for 1 h at the temperature of $200{\sim}600^{\circ}C$ in air. The surface and cross-sectional morphologies of the formed CuO layers were observed by a focused ion beam scanning electron microscopy (FIB-SEM) and porosity was determined by image analysis using simple computer-programming. XRD analysis showed phase evolutions of the layers, depending on the calcination temperature, and thermal decompositions of the neat precursor and the formulated ink were investigated by TGA and DSC. As a result, the formation of the porous structures was attributed to the vaporization of ethyl cellulose contained in the solutions. Mesoporous CuO, formed with the ink solution, consisted of grains and pores with nano-meter size. All of them were strongly dependent on calcination temperature. Sensing properties toward H2 and C2H5OH gases were examined as a function of operating temperature. High and fast responses toward H2 and C2H5OH gases were discussed in terms of crystallinity, nonstoichiometry and morphological factors such as porosity, grain size and surface-to-volume ratio. To our knowledge, the responses toward H2 and C2H5OH gases of these CuO gas sensors are comparable to previously reported values.

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유도 열플라즈마 공정을 이용한 고순도 카본분말 합성 (Synthesis of high purity carbon powders using inductively thermal plasma)

  • 김경인;한규성;황광택;김진호
    • 한국결정성장학회지
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    • 제23권6호
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    • pp.309-313
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    • 2013
  • 실리콘카바이드(SiC)는 높은융점과 내마모성 및 열전도 특성으로 산업적으로 널리 활용되고 있다. 특히 고순도 SiC는 고효율 전력 변환용 SiC 반도체 및 LED 공정에 적용되는 미래소재로 각광받고 있다. 본 연구에서는 고순도 SiC를 합성하기 위한 원료인 고순도 카본(C)을 유도 열플라즈마(RF Inductively thermal plasma)를 이용하여 합성하였으며, 출발원료로서 탄화수소계 액상물질인 도데칸이 사용되었다. 유도 열플라즈마 합성된 고순도 카본은 반응관과 필터에서 포집되며, 필터에서 포집된 카본 분말은 반응관에서 포집된 카본 분말보다 작은 입도(10~20 nm)와 낮은 결정성을 갖는 것으로 확인하였다. 반응관과 필터부에서 포집된 카본 분말의 순도는 각각 99.9997 %(5N7)와 99.9993 %(5N3)로 측정되었으며, 카본 분말에서 검출되는 불순물은 열플라즈마 합성장비에서 기인한 것으로 확인되었다.