• 제목/요약/키워드: semiconductor simulation

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Radiation Therapy Using M3 Wax Bolus in Patients with Malignant Scalp Tumors (악성 두피 종양(Scalp) 환자의 M3 Wax Bolus를 이용한 방사선치료)

  • Kwon, Da Eun;Hwang, Ji Hye;Park, In Seo;Yang, Jun Cheol;Kim, Su Jin;You, Ah Young;Won, Young Jinn;Kwon, Kyung Tae
    • The Journal of Korean Society for Radiation Therapy
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    • v.31 no.1
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    • pp.75-81
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    • 2019
  • Purpose: Helmet type bolus for 3D printer is being manufactured because of the disadvantages of Bolus materials when photon beam is used for the treatment of scalp malignancy. However, PLA, which is a used material, has a higher density than a tissue equivalent material and inconveniences occur when the patient wears PLA. In this study, we try to treat malignant scalp tumors by using M3 wax helmet with 3D printer. Methods and materials: For the modeling of the helmet type M3 wax, the head phantom was photographed by CT, which was acquired with a DICOM file. The part for helmet on the scalp was made with Helmet contour. The M3 Wax helmet was made by dissolving paraffin wax, mixing magnesium oxide and calcium carbonate, solidifying it in a PLA 3D helmet, and then eliminated PLA 3D Helmet of the surface. The treatment plan was based on Intensity-Modulated Radiation Therapy (IMRT) of 10 Portals, and the therapeutic dose was 200 cGy, using Analytical Anisotropic Algorithm (AAA) of Eclipse. Then, the dose was verified by using EBT3 film and Mosfet (Metal Oxide Semiconductor Field Effect Transistor: USA), and the IMRT plan was measured 3 times in 3 parts by reproducing the phantom of the head human model under the same condition with the CT simulation room. Results: The Hounsfield unit (HU) of the bolus measured by CT was $52{\pm}37.1$. The dose of TPS was 186.6 cGy, 193.2 cGy and 190.6 cGy at the M3 Wax bolus measurement points of A, B and C, and the dose measured three times at Mostet was $179.66{\pm}2.62cGy$, $184.33{\pm}1.24cGy$ and $195.33{\pm}1.69cGy$. And the error rates were -3.71 %, -4.59 %, and 2.48 %. The dose measured with EBT3 film was $182.00{\pm}1.63cGy$, $193.66{\pm}2.05cGy$ and $196{\pm}2.16cGy$. The error rates were -2.46 %, 0.23 % and 2.83 %. Conclusions: The thickness of the M3 wax bolus was 2 cm, which could help the treatment plan to be established by easily lowering the dose of the brain part. The maximum error rate of the scalp surface dose was measured within 5 % and generally within 3 %, even in the A, B, C measurements of dosimeters of EBT3 film and Mosfet in the treatment dose verification. The making period of M3 wax bolus is shorter, cheaper than that of 3D printer, can be reused and is very useful for the treatment of scalp malignancies as human tissue equivalent material. Therefore, we think that the use of casting type M3 wax bolus, which will complement the making period and cost of high capacity Bolus and Compensator in 3D printer, will increase later.

An efficient interconnection network topology in dual-link CC-NUMA systems (이중 연결 구조 CC-NUMA 시스템의 효율적인 상호 연결망 구성 기법)

  • Suh, Hyo-Joong
    • The KIPS Transactions:PartA
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    • v.11A no.1
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    • pp.49-56
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    • 2004
  • The performance of the multiprocessor systems is limited by the several factors. The system performance is affected by the processor speed, memory delay, and interconnection network bandwidth/latency. By the evolution of semiconductor technology, off the shelf microprocessor speed breaks beyond GHz, and the processors can be scalable up to multiprocessor system by connecting through the interconnection networks. In this situation, the system performances are bound by the latencies and the bandwidth of the interconnection networks. SCI, Myrinet, and Gigabit Ethernet are widely adopted as a high-speed interconnection network links for the high performance cluster systems. Performance improvement of the interconnection network can be achieved by the bandwidth extension and the latency minimization. Speed up of the operation clock speed is a simple way to accomplish the bandwidth and latency betterment, while its physical distance makes the difficulties to attain the high frequency clock. Hence the system performance and scalability suffered from the interconnection network limitation. Duplicating the link of the interconnection network is one of the solutions to resolve the bottleneck of the scalable systems. Dual-ring SCI link structure is an example of the interconnection network improvement. In this paper, I propose a network topology and a transaction path algorism, which optimize the latency and the efficiency under the duplicated links. By the simulation results, the proposed structure shows 1.05 to 1.11 times better latency, and exhibits 1.42 to 2.1 times faster execution compared to the dual ring systems.