• Proceedings of the KIEE Conference
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• 1987.07a
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• pp.532-535
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• 1987

A laser interferometry of very high spatial resolution was built to study the solid phase epitaxial regrowth of furnace-annealed silicon wafers. As boron concentration increases up to $1.0E20/cm^3$, regrowth rate increases, but pre-exponential term and activation energy are decreased.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.663-666
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• 2000

Laser direct writing of micro-patterned copper lines has been achieved by pyrolytic decomposition of copper formate films (Cu(HCOO)$_2$$.$4H$_2$O), as a precursor, using a focused Ar$\^$+/ laser beam ($\lambda$= 514 nm) on PCB boards and glass substrates. The linewidth and thickness of the lines were investigated as a function of laser power and scan speed. The profiles of the lines were measured by scanning electron microscope (SEM), surface profiler (${\alpha}$-step) and atomic force microscopy (AFM). The electrical resistivities of the patterned lines were also investigated as a function of laser parameter using probe station and semiconductor analyzer. we compared resistivities of the patterned lines with that of the Cu bulk, respectively.

• Journal of Korean Society of Occupational and Environmental Hygiene
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• v.26 no.2
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• pp.188-197
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• 2016

Objectives: The purpose of this study was to evaluate the ozone exposure levels and the variations in ozone concentration in a semiconductor fabrication facility and office in relation to the ozone concentration in the outdoor air. Methods: This study was performed in an office, semiconductor fabrication facility(such as etching, diffusion, diffusion plenum), and outdoors from June to August, 2015. Measurements were taken six times at the same places using an active sampler(pumped) and real-time equipment. Ozone monitoring by the active sampler method and analysis were carried out by OSHA Method ID-214. Real-time measurement was carried out by ozone measuring equipment using a non-dispersive ultraviolet absorption method. Results: Ozone concentrations in the semiconductor fabrication facility and office were 0.7~7.1 ppb in area samples and 0.72~4.07 ppb in real-time measurement, which were 0.88~8.88% of the occupational exposure limit. The concentration of ozone generated by a laser printer in the office was less than 2 ppb. There was not a significant difference between ozone concentrations before and after using the laser printer. The indoor/outdoor concentration ratio(I/O ratio) in the semiconductor fabrication facility and office was 0.05 and 0.06, respectively. Conclusions: All the samples contained ozone levels lower than the occupational exposure limit and it was confirmed that the concentration of outdoor ozone had no significant effect on indoor ozone concentration.

• Laser Solutions
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• v.16 no.4
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• pp.17-23
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• 2013

The research for the development of roll-to-roll printing process is actively underway on behalf of the existing semiconductor process. The roll-to-roll printing system can make the electronic devices to low-cost mass production. This study is performed for developing the manufacturing technology of the printing roll used in the printing process of electronic devices. The indirect laser engraving technology is used to create printable roll and the printable roll is made out of the chrome coated roll after coating copper and polymer on the surface of steel roll, ablating the polymer on the surface of roll and etching the roll. The 3 dimensional laser scanner and roll rotating systems are constructed and the system control program is developed. We have used the fiber laser of 100 W grade, the 3 dimensional laser scanner and the 3 axes moving stage system with a rotating axis. We have found the optimal conditions by performing the laser patterning experiments and can make the minimum line width of $24{\mu}m$ by using the developed 3 dimensional laser scanner system.

• KIEE International Transactions on Electrophysics and Applications
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• v.4C no.3
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• pp.96-100
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• 2004

The Nd： YAG laser is commonly used throughout many fields such as accurate material processing, IC marking, semiconductor annealing, medical operation devices, etc., due to the fact that it has good thermal and mechanical properties and is easy to maintain. In materials processing, it is essential to vary the laser power density for specific materials. The laser power density can be mainly controlled by the current pulse width and pulse repetition rate. It is important to control the laser energy in those fields using a pulsed laser. In this paper we propose the constant-frequency current resonant half-bridge converter and monitoring of capacitor charging voltage. This laser power supply is designed and fabricated to have less switching loss, compact size, isolation with primary and secondary transformers, and detection of capacitor charging voltage. Also, the output stabilization characteristics of this Nd： YAG laser system are investigated. The test results are described as a function of laser output energy and flashlamp arc discharging constant. At the energy storage capacitor charges constant voltage, the laser output power is 2.3％ error range in 600[V].

• Laser Solutions
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• v.11 no.1
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• pp.7-11
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• 2008

Decapsulation technology is useful to inspect EMC of package device and the etching technology enable to check inside of device by removing plastic molding. Chemical etching method is used widely to fabricate a lot of semiconductor. But the method has some disadvantage due to wet process. Proposed method in this paper shows the application possibility such as fast processing time, processing accuracy and dry process. These result was obtained by directly removing of packed EMC using UV laser.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.36D no.6
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• pp.71-78
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• 1999

In this paper, a new model for optical phase-locked loop(OPLL) is proposed that includes VCO laser frequency response as well as loop propagation delay. It is found that both of them greatly affect the OPLL performance. Our model can be used for realizing high-performance microwave-range OPLL.

• Laser Solutions
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• v.10 no.1
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• pp.19-27
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• 2007

Previous studies demonstrated that laser ablation under transparent liquid can result in ablation enhancement and particle removal from the surface. Although the ablation enhancement by liquid is already known for semiconductor and metal, the phenomena of polymer ablation have not been studied. In this work, tile liquid-assisted excimer laser ablation process is examined for polymer materials, such as polyethylene terephthalate (PET), polymethyl methacrylate (PMMA) with emphasis on ablation enhancement and surface topography. In the case of PET and PMMA, the effect of liquid is analyzed both for thin water film and bulk water. The results show that application of liquid increases the ablation rate of PMMA while that of PET remains unchanged even in the liquid-assisted process. However, the surface roughness is generally deteriorated in the liquid-assisted process. The surface topography is found to be strongly dependent on the method of liquid application, i.e., thin film or bulk liquid.

• Journal of the Optical Society of Korea
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• v.13 no.3
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• pp.316-320
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• 2009

A novel broadband wavelength-swept Raman laser was used to implement Fourier-domain mode locked (FDML) swept-source optical coherence tomography (SS-OCT). Instead of a conventional semiconductor optical amplifier, this study used broadband optical fiber Raman amplification, over 50 nm centered around 1545 nm, using a multi-wavelength optical pumping scheme, which was implemented with the four laser diodes at the center wavelengths of 1425, 1435, 1455 and 1465 nm, respectively, and the maximum operating power of 150 mW each. The operating swept frequency of the laser was determined to 16.7 kHz from the FDML condition of 12 km optical fiber in the ring cavity. The OCT images were obtained using the novel broadband wavelengthswept Raman laser source.

• Proceedings of the Korean Society of Laser Processing Conference
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• 2004.10a
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• pp.50-61
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• 2004

Nowadays Laser Controllable Thermo-cleaving is the most promising method of cutting FPD(Flat Panel Display) glass in mass-production line. And this method can be used to cut other brittle materials such as quartz, sapphire, ceramic and semiconductor. The concept of this method is shown in Picture 1. Laser beam heats glass up to strain point not to melting point and cooling system chills glass to make maximum thermal stress in glass and then the thermal stress generates micro thermal crack in other words blind crack. Laser Controllable Thermo-cleaving controls the thermal stress to optimize the blind crack up to level of mass-production line.