• JSTS:Journal of Semiconductor Technology and Science
• /
• 제1권3호
• /
• pp.167-181
• /
• 2001

A stepwise driving method was used for reducing the AC power consumption in a TFT-LCD. The AC power takes the largest portion of the total power consumption of a TFT-LCD. Experimental results confirmed that the AC power saving efficiency reached up to 75% when a 5-stepwise driving with each step time of $2\mu$ sec was applied to a 14.1 inch-diagonal XGA TFT-LCD. The second largest component of power consumption called the DC power comes from the quiescent currents in Op-amps. A simple and efficient architecture was proposed in this work to reduce this DC power consumption: Half of the Op-amps have the 5V-supplies, and the rest half have the 10V-supplies, and two Op-amps are shared by adjacent two channels. Measurements of test circuits showed that this simple method could reduce over 40% of the DC power consumption..

• 한국반도체및디스플레이장비학회:학술대회논문집
• /
• 한국반도체및디스플레이장비학회 2007년도 춘계학술대회
• /
• pp.149-156
• /
• 2007

Non-contact transportation of the large-sized glass plate using air-cushion is considered for sputtering system of LCD panel. The Argon gas from second gas injection holes is injected to levitate and transport the glass plate. Low maximum pressure and uniform pressure distribution on the bottom surface of the glass plate must be maintained for stable levitation and transportation of the glass plate. Therefore, the analysis of fluid flow between the glass plate and the air-pad is numerically performed for varying space between the injection holes in this study. The pressure uniformity on the bottom surface of the glass plate is evaluated for overall glass plate. The distance between the injection holes must be designed below 90 mm for obtaining the low maximum pressure and uniform pressure distribution.

• 한국반도체및디스플레이장비학회:학술대회논문집
• /
• 한국반도체및디스플레이장비학회 2006년도 춘계학술대회
• /
• pp.269-272
• /
• 2006

Surface contacts between mold and target should be in parallel for the imprinting mechanism. However, the size of contacting area makes it difficult for both mating surfaces to be in all contact because of precision level of the imprinting machine and the waviness of mold and target. The gripping force for both mold and target with the vacuum chuck is also major effect to interrupt the full contact, which must be avoided in imprinting mechanism. In this study, the preliminary study for the causes of non-uniformity of contacting surfaces such as mold and target is performed with $470{\times}370mm^2$ LCD panel size.

• 한국정보디스플레이학회:학술대회논문집
• /
• 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
• /
• pp.1383-1385
• /
• 2009

This paper suggests that testing method and equipment structure to detect potential failures of LCD cells. LCD Cell Aging Tester is the unique process to detect failures related with ASG circuits. This system consists of four components that is Aging chamber, work table, probe contact unit, and pattern generator. The key factor of the concept is temperature aging and HVS driving. Complicated combination of test parameters including voltage, temperature and frequency provided practical burn-in conditions eligible for prediction of mass production.

• 반도체디스플레이기술학회지
• /
• 제6권1호
• /
• pp.59-64
• /
• 2007

Non-contact transportation of a large-sized glass plate using air cushion for the vertical sputtering system of liquid crystal display (LCD) panel was considered. The objective of the study was to design an air pad unit which was composed of multiple injection and exhaust holes and mass flow supplying pipe. The gas was injected through multiple small holes to maintain the force for levitating glass plate. After hitting the plate, the air was vented through exhaust holes. Complex flow field and resulting pressure distribution on the glass surface were numerically studied to design the air injection pad. The exhaust hole size was varied to obtain evenly distributed pressure distribution at fixed diameter of the injection hole. Considering the force for levitating glass plate, the diameter of the exhaust hole of 30 to 40 times of the gas injection hole was recommended.

• 반도체디스플레이기술학회지
• /
• 제16권2호
• /
• pp.98-105
• /
• 2017

In the display industry, the residual vibration of the transfer robot can increase the process time and cause the breakage of the glass substrate, which is critical to productivity of display manufacturing. In this paper, the natural frequencies of transfer robot are analyzed by finite element method. On the basis of the analyzed data, we investigated the response characteristics of input shaping control with or without the glass presence on the hand of the transfer robot using MATLAB program, and compared with the current response characteristics of input shaping control applied to the industry. Based on this, we suggest an optimal residual vibration control method for the practical application in display industry.

• 한국반도체및디스플레이장비학회:학술대회논문집
• /
• 한국반도체및디스플레이장비학회 2004년도 춘계학술대회 발표 논문집
• /
• pp.195-201
• /
• 2004

In design stage of high precision manufacture/inspect ion FAB building, it is necessary to investigate the vibration allowable limits of high precision equipment and to study a structure dynamic characteristics of C/R and Sub-structure in order to provide a structure vibration environment to satisfy thess allowable limits. The aim of this study is to investigate the dynamic characteristics of PC-Type mock-up structures designed for next TFT LCD FAB through vibration measurement and analysis procedure, therefore, to provide a proper dynamic structure design for high precision manufacture/inspection work process, which satisfy thess allowable limits.

• 대한전자공학회:학술대회논문집
• /
• 대한전자공학회 2000년도 하계종합학술대회 논문집(2)
• /
• pp.314-317
• /
• 2000

In order to analyze the characteristics of complicated TFT-LCD (Thin Film Transistor-Liquid Crystal Display) circuits, it is indispensible to use simulation programs. In this study, we present a systematic method of extracting the input parameters of poly-Si TFT for Spice simulation. This method is applied to two different types of poly-Si TFTs fabricated in our group with good results. Among the Spice simulators, Pspice has the graphic user interface feature making the composition of complicated circuits easier. We added successfully a poly-Si TFT model on the Pspice simulator, which would contribute to efficient simulations of poly-Si TFT-LCD pixels and arrays.

• 한국기계가공학회지
• /
• 제12권5호
• /
• pp.163-169
• /
• 2013

The objective of this study is to replace labor intensive forging processes by an automated system. For achieving it, an exclusive mechanism that consists of a positioner, an arm, and a hanger is configured to handle hot forging objects. Also, a structural analysis is applied to the horizontal motion unit, which is the most highly loaded, in order to verify its validity. In addition, its possibility is also verified through identifying the performance of the proposed system before applying it to sites. As a result, the major characteristic items, such as positioning accuracy, material diameter, object traveling weight, product failure rate, and forging process rate, in this system are perfectly verified for applying it to manufacturing sites.

• 한국산업융합학회 논문집
• /
• 제7권3호
• /
• pp.259-263
• /
• 2004

In the manufacture progress of LCD or semiconductor, there are used many kinds of gas like erosion gas, dilution gas, toxic gas as a progress which used these gas there are required high puritize to increase accumulation rate of semiconductor or LCD materials work progress of semiconductor or LCD it demand many things like the material which could minimize metallic dust that could be occured by reaction between gas and transfer pipe laying material, illumination of the surface, emition of the gas, metal liquation, welding etc also demand quality geting stricted. Material-Low-sulfur-contend (0.007-0010), vacuum-arc-remelt(VAR), seamless, high-purity tubing material is recommend for enhance welding lower surface defect density All wetted stainless steel surface must be 316LSS elecrto polishinged with ${\leq}0.254{\mu}m$($10.0{\mu}in$) Ra average surface finish, $Cr/Fe{\geq}1.1$ and $Cr_2O_3$ thickness ${\geq}25{\AA}$ From the AES analytical the oxide layer thickness (23.5~36 angstroms silicon dioxide equivalent) and chromum to iron ratios is similar to those generally found on electropolished stainless steel., molybdenum and silicon contaminants ; elements characteristic of stainless steel (iron, nickel and chromium); and oxygen were found on the surface Phosphorus and nitrogen are common contaminants from the electropolish and passivation steps.