• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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• pp.1386-1388
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• 2009

We report on a new method of fabricating color filters based on selective wetting of color inks. The reversible formation of a hydrophobic layer provides sequential generation and protection of successive color filter patterns through a simple coating process. The transmittance and geometrical properties of the fabricated color filter were described.

• Journal of Information Display
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• 제12권4호
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• pp.205-208
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• 2011

Herein, the integration of solution-processed polymer thin-film transistors (TFTs) that were fabricated using selective wettability through ultraviolet (UV) exposure into a reflective liquid crystal display is demonstrated. From the experimental results of energy-dispersive spectroscopy, the composition of carbon and fluorine enhancing the hydrophobicity in the polymer chains was found to play a critical role in the wetting selectivity upon UV exposure. The polymer TFTs fabricated through the wettability-patterning process exhibited long-term stability and reliability. This wetting-selectivity-based patterning technique will be useful for constructing different types of solution-processed electronic and optoelectronic devices.

• Journal of Information Display
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• 제9권4호
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• pp.6-10
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• 2008

In this study, the selective-wettability-inscription (SWI) technique for the wet-etchingless fabrication of surface microstructures applicable to wide-viewing liquid crystal displays (LCDs) on plastic substrates was demonstrated. On the basis of the selective wetting of the photopolymer, the bi-level microstructures were spontaneously formed to serve as spacers for maintaining uniform cell gap and protrusions for the generation of multi-domains. The LC cell that has bi-level microstructures shows good extinction in the field-off state and a wide-viewing property in the field-on state. The SWI technique would be useful for the fabrication of flexible displays on plastic substrates.

• Journal of Information Display
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• 제11권4호
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• pp.140-143
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• 2010

A simple and versatile method of fabricating color patterns in two-dimension (2D) and three-dimension (3D) was developed using the selective-wettability approach. Red, green, and blue color elements are sequentially formed on a single substrate in a pattern-by-pattern and/or pattern-on-pattern fashion, through a simple coating process. Either 2D or 3D structures in an array format are produced by controlling the thickness of the hydrophobic layer (HL) coating a substrate within the framework of wetting transition. Moreover, it was demonstrated that the stacked geometry of two successive patterns can be easily tailored for various types of color arrays, with the pattern fidelity of a few tens of nanometers in terms of only a parameter of the HL thickness.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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• pp.1286-1289
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• 2008

We report on a wide-viewing liquid crystal (LC) display with bi-level microstructures spontaneously formed by selective wetting on a chemically heterogeneous surface. The bi-level microstructures serve as spacers for maintaining uniform cell gap, as well as protrusions for wide-viewing properties. Our LC cell having the bi-level microstructures shows good electro-optic properties.

• 한국식품과학회지
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• 제22권5호
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• pp.520-525
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• 1990

포화지방산 또는 불포화지방산의 분리방법인 요소부 가법이 지닌 가메탄올 분해(methanolysis)와 농축물 회수의 곤란함 등의 문제를 해결하기 위하여 지방산과 요소의 부가화합물 형성의 반응매질로 유기용매를 사용하고 요소의 습윤제로 물을 사용한 새로운 요소부가법을 제시하였다. 어유를 원료로 제조한 지방산을 헵탄, 헥산, 이소옥탄같은 비극성 유기용매에 용해키시고 요소와 요소의 습윤제인 물을 첨가하여 부가화합물 형성을 유도한 후 요소와 부가화합물을 잘 형성하지 않는 불포화지방산 분획을 회수하여 지방산 조성을 분석한 결과 EPA, DHA 및 이들의 전구물질을 포함한 고도불포화지방산이 80%이상인 것으로 나타났다. 이 고도불포화지방산 농축물내에 EPA와 DHA 함량은 사용하는 유기용매으 종류에 따라서 변화되었는데, 헵탄과 에틸 에테르 등을 사용할 경우에는 EPA의 농축에 효과가 높았다. 이러한 특성을 이용하여 우선 펜탄을 사용하여 DHA를 농축하고 다시 헵탄을 사용하여 EPA의 농축을 시도한 바 어유 지방산으로부터 DHA가 50%인 농축물과 EPA가 53%인 분획을 각각 얻을 수 있었다.

• 대한금속재료학회지
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• 제47권7호
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• pp.423-432
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• 2009

In the galvanizing coating process, the effects of the silicon content on the coatability and wettability of molten zinc were investigated on Dual-Phase High Strength Steels (DP-HSS) with various Si contents using the galvanizing simulator and dynamic reactive wetting systems. DP-HSS showed good coatability and a well-developed inhibition layer in the range of Si content below 0.5 wt%. Good coatability was the results of the mixed oxide $Mn_{2}SiO_{4}$, being formed by the selective oxidation on the surface, with a low contact angle in molten zinc and a large fraction of oxide free surface that provided a sufficient site for the molten zinc to wet and react with the substrate. On the other hand, with more than 0.5 wt%, DP-HSS exhibited poor coatability and an irregularly developed inhibition layer. The poor coatability was due to the poor wettability that resulted from the development of network-type layers of amorphous ${SiO}_{2}$, leading to a high contact angle in molten zinc, on the surface.

• 한국고분자학회:학술대회논문집
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• 한국고분자학회 2006년도 IUPAC International Symposium on Advanced Polymers for Emerging Technologies
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• pp.31-32
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• 2006

We describe the preparation of nanostructured molecularly-imprinted surfaces using nanomolding on porous alumina. In molecular imprinting functional and cross-linking monomers are copolymerized in the presence of a molecular template, resulting in synthetic receptor materials. The drug propranolol and the dye fluorescein were used as the molecular imprinting templates. Binding studies with imprinted and non-imprinted surfaces revealed specific recognition of the templates and thus the existence of selective binding sites. In addition, the surface properties of the films were studied by water contact angle measurements. It was found that, depending on the monomers used, certain nanostructures induced great changes in the wetting properties of the surface.

• Corrosion Science and Technology
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• 제9권6호
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• pp.259-264
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• 2010

In continuous hot dip galvanizing process, oxide formation on steel surface has an influence on Zn wetting. High strength automotive steel contains high amount of Si and Mn, where Si-Mn composite oxides such as $Mn_2SiO_4$ or $MnSiO_3$ covers the surface after annealing. Zn wetting depends on how the aluminothermia reaction can reduce the Mn-Si composite oxides and then form inhibition layer such as $Fe_2Al_5$ on the steel surface. The outward diffusion of metallic ions such as $Mn^{2+}$, $Si^{2+}$ in the steel matrix is very important factor for the formation of the surface oxides on the steel surface. The surface state and grain boundaries provide an important role for the diffusion and the surface oxide reactions. Some elements such as P, Sb, and B have a strong affinity for the interface precipitation, and it influence the diffusivity of metallic ions on grain boundaries. B oxide forms very rapildly on the steel surface during the annealing, and this promote complex oxides with $SiO_2$ or MnO. P has inter-reacted with other elements on the grain boundaries and influence the diffusion through on them. Small addition of Sb could suppress the decarburization from steel surface and retards the formation of internal and external selective oxides on the steel surface. Interface control by the trace elements such as Sb could be available to improve the Zn wettability during the hot dip galvanizing.

• 반도체디스플레이기술학회지
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• 제15권4호
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• pp.10-15
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• 2016

In this paper, novel ball grid array (BGA) interconnection process using solderable anisotropic conductive adhesives (SACAs) with low-melting-point alloy (LMPA) fillers have been developed to enhance the processability in the conventional capillary underfill technique and to overcome the limitations in the no-flow underfill technique. To confirm the feasibility of the proposed technique, BGA interconnection test was performed using two types of SACA with different LMPA concentration (0 and 4 vol%). After the interconnection process, the interconnection characteristics such as morphology of conduction path and electrical properties of BGA assemblies were inspected and compared. The results indicated that BGA assemblies using SACA without LMPA fillers showed weak conduction path formation such as solder bump loss or short circuit formation because of the expansion of air bubbles within the interconnection area due to the relatively high reflow peak temperature. Meanwhile, assemblies using SACA with 4 vol% LMPAs showed stable metallurgical interconnection formation and electrical resistance due to the favorable selective wetting behavior of molten LMPAs for the solder bump and Cu metallization.