• Title/Summary/Keyword: school bonding

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Study on the Structural Analysis of Chip Bonding Machine Base (Chip Bonding Machine Base 구조해석에 관한 연구)

  • Kim, Won-Jong;Hwang, Eun-Ha
    • Journal of the Korean Society of Industry Convergence
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    • v.15 no.2
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    • pp.55-58
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    • 2012
  • This study is concerned about the design and structural analysis of high integrated Chip Bonding Machine. Recently, many studies have been undergoing to reduce a working time in a field of Chip Bonding Machine. Chip Bonding Machine belongs to reduce a stand-by time by Chip Moving time. The developed system can save tool moving distance in small space than other machine. The analysis is carried out by SoldEdge & Ansys software.

An Evaluation of Shear Bond Strength of New Dentin Bonding Agents (최근 소개된 상아질 접착제의 전단 접착 강도 비교)

  • Shin, Jisun;Hwang, Eunji;Kim, Jongbin
    • Journal of the korean academy of Pediatric Dentistry
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    • v.44 no.3
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    • pp.358-364
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    • 2017
  • For the purpose of convenience and reducing time, newer bonding agents have been developed for composite resin restoration. Recently developed one bottle bonding system including etching, primer and adhesive can make procedures simpler and less technique-sensitive than old generation adhesives. The aim of this study was comparing the shear bond strength of new dentin bonding agents to the 5th generation bonding agent which had an etching step. 78 premolar teeth were randomly divided into three groups which were treated with $Tetric^{(R)}$ N-Bond Universal (Ivoclar Vivadent, Liechtenstein), $GC^{(R)}$ G-Premio BOND (GC Co., Japan) without additional etching step and $3M^{TM}$ Single Bond2 (3M ESPE, USA) with an etching step following manufacturer's instructions. $Filtek^{TM}$ Z-350 (3M ESPE, USA) composite resin was applied and light cured over bonding agents. For shear bond strength evaluation, universal testing machine was used with a wedge technique. As a result, shear bond strength of one step bonding agents was lower than two step bonding agent and there were statistically significant differences between them (p < 0.05). In addition, within the result of two new bonding agents, $Tetric^{(R)}$ N-Bond Universal showed significantly higher shear bond strength than $GC^{(R)}$ G-Premio BOND (p < 0.05).

A STUDY ON THE EFFECT OF DENTIN BONDING AGENTS APPLIED OVER ENAMEL ABOUT THE BOND STRENGTH OF COMPOSITE RESIN (접착강화제가 치아경조직과의 접착강도 변화에 미치는 영향에 관한 연구)

  • Choi, Woong-Dae;Park, Sang-Jin
    • Restorative Dentistry and Endodontics
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    • v.20 no.1
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    • pp.1-16
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    • 1995
  • The purpose of this study was to investigate the effect of dentin bonding agents on the bond strength of composite resin restorations in case of applying the dentin bonding agents to acid etched enamel surfaces. Freshly extracted 364 bovine anterior teeth were selected as a adherents. 320 enamel specimens were divided into two groups(unetched group (1) and etched group (2) for testing the shear bond strength, 40 specimens were used for the hardness testing, and 4 specimens of rest were to observe the resin-tag formation into etched enamel surfaces. All surfaces of enamel specimens were polished with 320~1500 SiC paper under continuous running water. In Group (1), 100 enamel specimens were polished and unetched. 220 polished enamel specimens in Group (2) were etched with 37 % phosphoric acid solution for 60 seconds, washed with water for 20 seconds, and dried with a light air pressure for 60 seconds. Three kinds of dentin bonding agents(Gluma, Prisma, Scotchbond 2) were evaluated the effect on the bond strength to conditioned enamel surfaces. Shear bond strengths were measured on the three cases such as a coating of primer only, a coating of sealer only, and a sequential coating of primer and sealer to acid etched enamel surfaces were compared with the bond strengths measured by the coating of enamel bonding agent followed by the bonding of composite resin (Photo clearfil bright, Kuraray, Japan) to unetched and acid etched enamel surfaces. In addition, the hardness tested on the adhesive fractured surface between composite resin enamel as a mean of evaluation of a factor whether the mechanical bond strengths were affected and the penetration of dentin bonding agents into etched enamel surfaces was also observed. Bond strengths were measured using the method of shear bond strength by a universal testing machine (Instron-4467, USA), statistical test were applied to the results using a one way analysis variance(ANOVA), and hardness was measured by the Vicker's Hardness Tester(MHT-i, Matsuzawa, Japan) and the penetration of the resins were observed by the SEM (Hitachi, S-2300, Japan). The following conclusions were drawn; 1. Enamel bonding agent showed to affect the improvement of bond strength of composite resin to enamel surface both unetched and etched. 2. Dentin bonding agents could be resulted in increase of bond strength to unetched enamel surface, but there were no statistical significances. 3. Bond strengths to etched enamel surface were significantly decreased with a coating of dentin primer only. 4. Coating of sealer only and coating of primer and sealer noticed the similar bond strengths of composite resin to etched enamel using the enamel bonding agents. 5. The applying method proved to be more effective than the kinds of dentin bonding agents on the bond strength of composite resin to etched enamel than the kind of dentin. 6. Vicker's hardness numbers of dentin bonding agents were lower than that of composite resin, but the degree of penetration of dentin bonding agents into etched enamel surfaces was excellent.

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Effects of solvent volatilization time on the bond strength of etch-and-rinse adhesive to dentin using conventional or deproteinization bonding techniques

  • de Sousa, Jose Aginaldo Junior;Carregosa Santana, Marcia Luciana;de Figueiredo, Fabricio Eneas Diniz;Faria-e-Silva, Andre Luis
    • Restorative Dentistry and Endodontics
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    • v.40 no.3
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    • pp.202-208
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    • 2015
  • Objectives: This study determined the effect of the air-stream application time and the bonding technique on the dentin bond strength of adhesives with different solvents. Furthermore, the content and volatilization rate of the solvents contained in the adhesives were also evaluated. Materials and Methods:Three adhesive systems with different solvents (Stae, SDI, acetone; XP Bond, Dentsply De Trey, butanol; Ambar, FGM, ethanol) were evaluated. The concentrations and evaporation rates of each adhesive were measured using an analytical balance. After acid-etching and rinsing, medium occlusal dentin surfaces of human molars were kept moist (conventional) or were treated with 10% sodium hypochlorite for deproteinization. After applying adhesives over the dentin, slight air-stream was applied for 10, 30 or 60 sec. Composite cylinders were built up and submitted to shear testing. The data were submitted to ANOVA and Tukey's test (${\alpha}=0.05$). Results: Stae showed the highest solvent content and Ambar the lowest. Acetone presented the highest evaporation rate, followed by butanol. Shear bond strengths were significantly affected only by the factors of 'adhesive' and 'bonding technique' (p < 0.05), while the factor 'duration of air-stream' was not significant. Deproteinization of dentin increased the bond strength (p < 0.05). Stae showed the lowest bond strength values (p < 0.05), while no significant difference was observed between XP Bond and Ambar. Conclusions: Despite the differences in content and evaporation rate of the solvents, the duration of air-stream application did not affect the bond strength to dentin irrespective of the bonding technique.

EFFECT OF BENZALKONIUM CHLORIDE ON DENTIN BONDING WITH BPDM/HEMA SYSTEM (Benzalkonium Chloride가 BPDM/HEMA계 접착제의 상아질 접착에 미치는 영향)

  • Kwon, Byung-Gyun;Ahn, Sik-Hwan;Kim, Sung-Kyo
    • Restorative Dentistry and Endodontics
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    • v.21 no.2
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    • pp.569-584
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    • 1996
  • The purpose of this study was to elucidate the effect of benzalkonium chloride on tensile bond strength of BPDM/HEMA dentin bonding. One hundred sixty dentin specimens from freshly extracted bovine mandibular incisors were used, and 0, 0.02, 0.1 or 0.5% benzalkonium chloride solution was applied to the dentin specimen with/after phosphoric acid. 32% phosphoric acid was used when the specimens were bonded with One-Step$^{TM}$, a BPDM/HEMA system and 10% was used when bonded with All-Bond$^{(R)}$ 2, a NTG-GMA/BPDM system. Aelitefil$^{TM}$ composite resin was bonded to the pretreated dentin specimen with the use of All-Bond$^{(R)}$ 2 or One-Step$^{TM}$ dentin bonding agent. After the bonded specimens were stored in $37^{\circ}C$ distilled water for 24 hours, tensile bond strength was measured. The fractured dentin specimens were examined under the scanning electron microscope. The results were as follows : Benzalkonium chloride application after acid-treatment resulted in decrease of dentin bond strength of One-Step$^{TM}$, a BPDM/HEMA system (p>0.05). Benzalkonium chloride application did not exert any influence on dentin bond strength of All-Bond$^{(R)}$ 2, a NTG-GMA/BPDM system (p>0.05). There was no relationship between the concentration or application method of benzalkonium chloride and the dentin bond strength of One-Step$^{TM}$ or All-Bon$^{(R)}$ 2 (p<0.05). On SEM examination of the fractured dentin-resin interface, while mixed failure was prominent in dentin bonding with One-Step$^{TM}$, adhesive and mixed failures were seen together in dentin bonding with All-Bond$^{(R)}$ 2 regardless of the concentration and application method of benzalkonium chloride.

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Analysis of Bonding Characteristics of a T-shape Structure Fabricated by Superplastic Hydroforming and Diffusion Bonding using two Ti-3Al-2.5V tubes (Ti-3Al-2.5V 튜브의 초소성 하이드로포밍과 확산접합으로 제조된 T형 구조물의 접합 특성 분석)

  • Yoo, Y.H.;Lee, S.Y.
    • Journal of the Korean Society for Heat Treatment
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    • v.31 no.2
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    • pp.49-55
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    • 2018
  • A T-shape structure was manufactured by the superplastic forming and diffusion bonding process using two Ti-3Al-2.5V alloy tubes. A Ti-3Al-2.5V tube was prepared for the hydroforming in the superplastic condition until it reaches a surface area such as a roof welded in the hole of another Ti-3Al-2.5V tube. Afterward, the superplastic forming process and the diffusion bonding process were carried out simultaneously until the appropriate bonding along the interface area of two Ti-3Al-2.5V tubes was obtained. The bonding qualities were different at each location of the entire interface according to the applied process conditions such as strain, pressure, temperature, holding time, geometries, etc. The microstructures of bonding interface have been observed to understand the characteristics of the applied processes in this study.

Effect of Desmear Treatment on the Interfacial Bonding Mechanism of Electroless-Plated Cu film on FR-4 Substrate (Desmear 습식 표면 전처리가 무전해 도금된 Cu 박막과 FR-4 기판 사이의 계면 접착 기구에 미치는 영향)

  • Min, Kyoung-Jin;Park, Young-Bae
    • Korean Journal of Materials Research
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    • v.19 no.11
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    • pp.625-630
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    • 2009
  • Embedding of active devices in a printed circuit board has increasingly been adopted as a future electronic technology due to its promotion of high density, high speed and high performance. One responsible technology is to embedded active device into a dielectric substrate with a build-up process, for example a chipin-substrate (CiS) structure. In this study, desmear treatment was performed before Cu metallization on an FR-4 surface in order to improve interfacial adhesion between electroless-plated Cu and FR-4 substrate in Cu via structures in CiS systems. Surface analyses using atomic force microscopy and x-ray photoemission spectroscopy were systematically performed to understand the fundamental adhesion mechanism; results were correlated with peel strength measured by a 90o peel test. Interfacial bonding mechanism between electrolessplated Cu and FR-4 substrate seems to be dominated by a chemical bonding effect resulting from the selective activation of chemical bonding between carbon and oxygen through a rearrangement of C-C bonding rather than from a mechanical interlocking effect. In fact, desmear wet treatment could result in extensive degradation of FR-4 cohesive strength when compared to dry surface-treated Cu/FR-4 structures.

Computer-Aided Alloy Design of Insert Metal for Transient Liquid Phase Bonding of High Aluminum Ni-base Superalloys

  • Nishimotd, Kazutoshi;Saida, Kazuyoshi
    • Proceedings of the KWS Conference
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    • 2002.10a
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    • pp.803-808
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    • 2002
  • A computer-aided alloy-designing technique to develop the insert metal for transient liquid phase (TLP) bonding was applied to high aluminum Ni-base superalloys. The main procedure of a mathematical programming method was to obtain the optimal chemical composition through rationally compromising the plural objective performances of insert metal by a grid-search which involved data estimation from the limited experimental data using interpolation method. The objective function Z which was introduced as an index of bonding performance of insert metal involved the melting point, hardness (strength), formability of brittle phases and void ratio (bonding defects) in bond layer as the evaluating factors. The contour maps of objective function Z were also obtained applying the interpolation method. The compositions of Ni-3.0%Cr-4.0%B-0.5%Ce (for ${\gamma}$/${\gamma}$/${\beta}$ type alloy) and Ni3.5%Cr-3.5%B-3%Ti (for ${\gamma}$/${\gamma}$ type alloy) which optimized the objective function were determined as insert metal. SEM observations revealed that the microstructure in bond layers using the newly developed insert metals indicated quite sound morphologies without forming microconstituents and voids. The creep rupture properties of both joints were much improved compared to a commercial insert metal of MBF-80 (Ni-15.5%Cr-3.7%B), and were fairly comparable to those of base metals.

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Study of concrete de-bonding assessment technique for containment liner plates in nuclear power plants using ultrasonic guided wave approach

  • Lee, Yonghee;Yun, Hyunmin;Cho, Younho
    • Nuclear Engineering and Technology
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    • v.54 no.4
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    • pp.1221-1229
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    • 2022
  • In this work, the guided wave de-bonding area-detecting technique was studied for application to containment liner plates in nuclear power plant areas. To apply this technique, an appropriate Lamb wave mode, symmetric and longitudinal dominance, was verified by the frequency shifting technique. The S0 2.7 MHz mm Lamb wave mode was chosen to realize quantitative experimental results and their visualization. Results of the bulk wave, longitudinal wave mode, and comparison experiments indicate that the wave mode was able to distinguish between the de-bonded and bonded areas. Similar to the bulk wave cases, the bonded region could be distinguished from the de-bonded region using the Lamb wave approach. The Lamb wave technique results showed significant correlation to the de-bonding area. As the de-bonding area increased, the Lamb wave energy attenuation effect decreased, which was a prominent factor in the realization of quantitative tomographic visualization. The feasibility of tomographic visualization was studied via the application of Lamb waves. The reconstruction algorithm for the probabilistic inspection of damage (RAPID) technique was applied to the containment liner plate to verify and visualize the de-bonding condition. The results obtained using the tomography image indicated that the Lamb wave-based RAPID algorithm was capable of delineating debonding areas.

Drying time of tray adhesive for adequate tensile bond strength between polyvinylsiloxane impression and tray resin material

  • Yi, Myong-Hee;Shim, Joon-Sung;Lee, Keun-Woo;Chung, Moon-Kyu
    • The Journal of Advanced Prosthodontics
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    • v.1 no.2
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    • pp.63-67
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    • 2009
  • STATEMENT OF PROBLEM. Use of custom tray and tray adhesive is clinically recommended for elastomeric impression material. However there is not clear mention of drying time of tray adhesive in achieving appropriate bonding strength of tray material and impression material. PURPOSE. This study is to investigate an appropriate drying time of tray adhesives by evaluating tensile bonding strength between two types of polyvinylsiloxane impression materials and resin tray, according to various drying time intervals of tray adhesives, and with different manufacturing company combination of impression material and tray adhesive. MATERIAL AND METHODS. Adhesives used in this study were Silfix (Dentsply Caulk, Milford, Del, USA) and VPS Tray Adhesive (3M ESPE, Seefeld, Germany) and impression materials were Aquasil Ultra (monophase regular set, Dentsply Caulk, Milford, Del, USA) and Imprint II Garant (regular body, 3M ESPE, Seefeld, Germany). They were used combinations from the same manufacture and exchanged combinations of the two. The drying time was designed to air dry, 5 minutes, 10 minutes, 15 minutes, 20 minutes, and 25 minutes. Total 240 of test specimens were prepared by auto-polymerizing tray material(Instant Tray Mix, Lang, Wheeling, Il, USA) with 10 specimens in each group. The specimens were placed in the Universal Testing machine (Instron, model 3366, Instron Corp, University avenue, Nowood, MA, USA) to perform the tensile test (cross head speed 5 mm/min). The statistically efficient drying time was evaluated through ANOVA and Scheffe test. All the tests were performed at 95% confidence level. RESULTS. The results revealed that at least 10 minutes is needed for Silfix-Aquasil, and 15 minutes for VPS Tray Adhesive-Imprint II, to attain an appropriate tensile bonding strength. VPS Tray Adhesive-Imprint II had a superior tensile bonding strength when compared to Silfix-Aquasil over 15 minutes. Silfix-Aquasil had a superior bonding strength to VPS Tray Adhesive-Aquasil, and VPS Tray Adhesive-Imprint II had a superior tensile bonding strength to Silfix-Imprint II at all drying periods. CONCLUSION. Significant increase in tensile bonding strength with Silfix-Aquasil and VPS Tray adhesive-Imprint II combination until 10 and 15 minutes respectively. Tray adhesive-impression material combination from the same company presented higher tensile bonding strength at all drying time intervals than when using tray adhesive-impression material of different manufactures.