• Journal of Sensor Science and Technology
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• v.30 no.4
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• pp.236-242
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• 2021

In this paper, we report the fabrication of the tip-on-gate of a field-effect-transistor (ToGoFET) probe using a standard complementary metal-oxide-semiconductor (CMOS) process and the performance evaluation of the fabricated probe. After the CMOS process, I-V characteristic measurement was performed on the reference MOSFET. We confirmed that the ToGoFET probe could be operated at a gate voltage of 0 V due to channel ion implantation. The transconductance at the operating point (Vg = 0 V, Vd = 2 V) was 360 ㎂/V. After the fabrication process was completed, calibration was performed using a pure metal sample. For sensitivity calibration, the relationship between the input voltage of the sample and the output current of the probe was determined and the result was consistent with the measurement result of the reference MOSFET. An oxide sample measurement was performed as an example of an application of the new ToGoFET probe. According to the measurement, the ToGoFET probe could spatially resolve a hundred nanometers with a height of a few nanometers in both the topographic image and the ToGoFET image.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.330-333
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• 2005

The fabrication of mold fur nano imprint lithography (NIL) is experimentally reported using the scanning probe lithography (SPL) technique, instead of the conventional I-beam lithography technique. The nanometer scale patterning structure is fabricated by the localized generation of oxide patterning on the silicon (100) wafer surface with a thin oxide layer, The fabrication method is based on the contact mode of scanning probe microscope (SPM) in air, The precision cleaning process is also performed to reach the low roughness value of $R_{rms}=0.084 nm$, which is important to increase the reproducibility of patterning. The height and width of the oxide dot are generated to be 15.667 nm and 209.5 nm, respectively, by applying 17 V during 350 ms.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.9 no.2
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• pp.303-310
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• 2008

We fabricated hydrogenated amorphous silicon(a-Si:H) 140 nm thick film on a $180\;nm-SiO_2/Si$ substrate with an inductively-coupled plasma chemical vapor deposition(ICP-CVD) equipment at $250^{\circ}C$. Moreover, 30 nm-Ni film was deposited with a thermal-evaporator sequently. Then the film stack was annealed to induce silicides by a rapid thermal annealer(RTA) at $200{\sim}500^{\circ}C$ in every $50^{\circ}C$ for 30 minuets. We employed a four-point tester, high resolution X-ray diffraction(HRXRD), field emission scanning electron microscope(FE-SEM), transmission electron microscope(TEM), and scanning probe microscope(SPM) in order to examine the sheet resistance, phase transformation, in-plane microstructure, cross-sectional microstructure evolution, and surface roughness, respectively. We confirmed that nano-thick high resistive $Ni_3Si$, mid-resistive $Ni_2Si$, and low resistive NiSi phases were stable at the temperature of <300, $350{\sim}450^{\circ}C$, and >$450^{\circ}C$, respectively. Through SPM analysis, we confirmed the surface roughness of nickel silicide was below 12 nm, which implied that it was superior over employing the glass and polymer substrates.

• Korean Journal of Materials Research
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• v.10 no.9
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• pp.601-606
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• 2000

Nickel mono-silicide(NiSi) shows no increase of resistivity as the line width decreases below 0.15$\mu\textrm{m}$. Furthermore, thin silicide can be made easily and restrain the redistribution of dopants, because NiSi in created through the reaction of one nickel atom and one silicon atom. Therefore, we investigated the deposition condition of Ni films, heat treatment condition and basic properties of NiSi films which are expected to be employed for sub-0.15$\mu\textrm{m}$ class devices. The nickel silicide film was deposited on the Si wafer by using a dc-magnetron sputter, then annealed at the temperature range of $150~1000^{\circ}C$. Surface roughness of each specimen was measured by using a SPM (scanning probe microscope). Microstructure and qualitative composition analysis were executed by a TEM-EDS(transmission electron microscope-energy dispersive x-ray spectroscope). Electrical properties of the materials at each annealing temperature were measured by a four-point probe. As the results of our study, we may conclude that; 1. SPM can be employed as a non-destructive process to monitor NiSi/NiSi$_2$ transformation. 2. For annealing temperature over $800^{\circ}C$, oxygen pressure $Po_2$ should be kept below $1.5{\times}10^{-11}torr$ to avoid oxidation of residual Ni. 3. NiSi to $NiSi_2$ transformation temperature in our study was $700^{\circ}C$ from the four-point probe measurement.

• Transactions of the Society of Information Storage Systems
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• v.3 no.2
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• pp.59-65
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• 2007

Scanning Prove Microscope (SPM) - based Data Storage (SDS)는 Atomic Force Microscope (AFM)을 이용하여 Cantilever Tip 이 저장 장치 미디어에 나노미터 단위로 비트를 읽고, 쓰고 지우는 저장 장치로써, x, y 두 축을 이용한다. 따라서 축간 coupling 의 영향이 크게 발생한다. 따라서 축간 coupling 의 영향을 고려하여 제어기를 설계하여야 한다. 본 논문은 coupling 요소를 제거하기 위하여 Feedforward Decoupler 를 설계하여 Stage 의 입력 앞 단에 추가하는 방법을 제안하였다. Feedforward Decoupler 를 추가함으로써 coupling 요소가 줄어드는 것을 모의 실험을 통해 확인한다. 이를 통해 나노급으로 보다 정밀한 제어가 가능함을 확인하였다.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 1999.06a
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• pp.67-72
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• 1999

Scanning probe Microscope(SPM) such as Scanning Tunneling Microscope(STM) and Atomic Force Microscope(AFM) was shown to be the powerful tool for nano-scale characterization of material surfaces Using this technique, surface morphology of the cyclically deformed Cu or Cu-Al single crystal was observed. The surface became proportionately rough as the number of cycles increased, but after some number of cycles no further change was observed. Slip steps with the heights of 100 to 200 nm and the widths of 1000 to 2000 nm were prevailing at the stage. The slipped distance of one slip system at the surface was not uniform. and formation of the extrusions or intrusions was assumed to occur such place. By comparing the morphological change caused by crystallographic orientation, strain amplitude, number of cycles or stacking fault energy, some interesting results which help to clarify the basic mechanism of fatigue damage were obtained. Furthermore, applicability of the scanning tunneling microscopy to fatigue damage is discussed.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.24 no.4 s.175
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• pp.955-962
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• 2000

Scanning Probe Microscope (SPM) such as Scanning Tunneling Microscope (STM) and Atomic Force Microscope (AFM) was shown to be the powerful tool for nano-scale characterization of a fracture surface . AFM was used to study cross sectional profiles and dimensions of fatigue striations in 2017-T351 aluminum alloy. Their widths (SW) and heights (SH) were measured from the cross sectional profiles of three-dimension AFM images. The following results that will be helpful to understand the fatigue crack growth mechanism were obtained. (1) Coincidence of the crack growth rate with the striation width was found down to the growth rate of 10-5 mm/cycle. (2) The relation of SH=0.085(SW)1.2 was obtained. (3) The ratio of the striation height to its width SH/SW did not depend on the stress intensity factor range K and the stress ratio R. (4) Not only the SW but also the SH changed linearly with the crack tip opening displacement (CTOD) when plotted in log-log scale. From these results, the applicability of the AFM to nano-fractography is discussed.

• Tribology and Lubricants
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• v.17 no.4
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• pp.276-282
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• 2001

Nano adhesion between SPM (scanning probe microscope) tips and 075 (octadecyltrichlorosilane) SAM (self-assembled monolayer) was experimentally studied. Tests were performed to measure the nano adhesion and friction in both AFM(atomic force microscope) and LFM(lateral force microscope) modes in various conditions of relative humidity. OTS SAM was formed on Si-wafer (100) surfaces, and Si$_3$N$_4$ tips of different radius of curvature were used. When the surface was hydrophobic, the adhesion and friction forces were found lower than those of bare Si-wafer. Results also showed that micro-adhesion force increased as the relative humidity and the tip radius of curvature increased. The main parameter for affecting the micro-adhesion was found absorbed humidity on the contact surface. These results were discussed with the JKR model and a capillary force caused by absorbed water.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.6 s.183
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• pp.166-173
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• 2006

In this study, a probe array has been developed for use in a data storage device that is based on scanning probe microscope (SPM) and MEMS technology. When recording data bits by poling the PZT thin layer and reading them by sensing its piezoresponse, commercial probes of which the tip heights are typically shorter than $3{\mu}m$ raise a problem due to the electrostatic forces occurring between the probe body and the bottom electrode of a medium. In order to reduce this undesirable effect, a poly-silicon probe with a high aspect-ratio tip was fabricated using a molding technique. Poly-silicon probes fabricated by the molding technique have several features. The tip can be protected during the subsequent fabrication processes and have a high aspect ratio. The tip radius can be as small as 15 nm because sharpening oxidation process is allowed. To drive the probe, electrostatic actuation mechanism was employed since the fabrication process and driving/sensing circuit is very simple. The natural frequency and DC sensitivity of a fabricated probe were measured to be 18.75 kHz and 16.7 nm/V, respectively. The step response characteristic was investigated as well. Overshoot behavior in the probe movement was hardly observed because of large squeeze film air damping forces. Therefore, the probe fabricated in this study is considered to be very useful in probe-based data storages since it can stably approach toward the medium and be more robust against external shock.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2000.11a
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• pp.341-346
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• 2000

The effect of OTS(octadecyltrichlorosilane) SAM(self-assembled monolayer) on the micro-adhesion has been studied. OTS SAM was formed on the Si(100) surface and SPM (scanning probe microscope) tips with different radius of curvature were fabricated by a series of masking and etching processes. Pull-off forces of different tips on Si and OTS SAM surfaces were measured by SPM in different relative humidities. The surface of OTS SAM was changed to hydrophobic surface and the micro-adhesion force of OTS SAM was lower than that of pure Si. As the tip radius of curvature and the relative humidity increased. the micro-adhesion force increased. Based on the test results. the main parameter affected to the micro-adhesion was absorbed humidity on the surface.