• Journal of the Korean Society for Heat Treatment
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• v.32 no.3
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• pp.118-123
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• 2019

The aim of this study investigates the feasibility of scanning acoustic microscope (SAM) with high frequency transducer for material degradation. The test specimen was prepared by artificial heat treatment of Co-base superalloy. The high frequency 200 MHz acoustic lens was used to generate the leaky surface acoustic wave (LSAW) on the test specimens. The matrix precipitates coarsened with thermal aging time, and then grow up to several tens of micrometers. The velocity of LSAW decreased with increasing aging time. Also, it has a good correlation between LSAW and hardness. Consequently, V(z) curve methods of SAM using high frequency transducer is useful tool to evaluate the heat treatment effects on microstructure.

• Proceedings of the KIEE Conference
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• 1987.07b
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• pp.1591-1594
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• 1987

The Scanning Acoustic Microscope(SAM) is an image device which can display the small opaque material or the interior of solid. This paper showed the design of the acoustic lens which is an important factor of the Scanning Acoustic Microscope, and analyzed the performance of the acoustic lens. Finally, I experimented the image processing of the interior of solid through the Scanning Acoustic Microscope and the change of the acoustic image (resolution,contrast) by the change of F/number.

• Journal of the Korean Society for Precision Engineering
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• v.17 no.7
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• pp.217-225
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• 2000

Scanning Acoustic Microscope (SAM) is used as an important nondestructive test tool in semiconductor reliability evaluation and failure analysis. However, inspections of chip attach adhesive interface fer thin chip has proven difficulty as the reflected signals from the chip top and bottom are superimposed. In this paper, in order to overcome this difficulty, a new signal processing method based on the deconvolution technique combined with the wavelet transform is proposed. The wavelet transform complements a disability of deconvolution technique of which performance largely decreases when the waveform of target signal is not identical to that of reference signal. Performances of the proposed method are demonstrated by through computer simulations using model signal and experiments for the fabricated semiconductor samples, and satisfactory results are obtained.

• Journal of the Korean Society for Nondestructive Testing
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• v.21 no.6
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• pp.598-606
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• 2001

Recently, semiconductor packages trend to be thinner, which makes difficult to detect defects therein. A preconditioning test is generally performed to evaluate the reliability of semiconductor packages. The test procedure includes two scanning acoustic microscope (SAM) tests at the beginning and end of the entire test, in order to help detect physical defects such as delaminations and package cracks. In particular, of primary concern are package cracks and delaminations caused by moisture absorbed under ambient conditions. This paper discusses the failure mechanism associated with the moisture absorbed and encapsulated in semiconductors, and the use SAM to detect failures such as tracks and delaminations grown during the preconditioning test.

• Journal of the Korean Society for Precision Engineering
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• v.8 no.4
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• pp.118-125
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• 1991

Acoustic microscopy has attracted much interest recently as potential nondestructive evaluation technique for detecting and sizing defects of surface and sub-surface. Also acoustic emission testing method has been developed for detecting microcracks which is more than 30${\mu}m$ in length quantitatively on ceramics. In the present paper, acoustic emission during the four point bending test in hot-pressed sintered $Si_3N_4$ specimen which was stressed by thermal shock, has been measured by high sensitive sensing system. The surface and sub-surface cracks were detected by scanning acoustic micrscope of 800 MHz and conventional ultrasonic testing in C-scope image. The purpose was to investigate the location and size of cracks by SAM and AE technique, whose experimental data demonstrate good for detecting microcracks.

• Journal of Welding and Joining
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• v.12 no.3
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• pp.109-117
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• 1994

Spot welding has wide used with a high work efficiency in the automotive and aerospace industries. Up to the present, the technique mainly used to test spot welds on production lines has been entirely depended upon destructive chisel or peel testing. Therefore, it's being very important assignment to secure the NDE technique which can be evaluate spot weld quality with more efficiency and high reliability. This paper discusses the feasibility of UNDE techniques to evaluate spot weld quality. For the sake of the approach to the quantitative measurement of nugget diameter and the discrimination of a the corona bond from nugget, ultrasonic c-scan image and distribution of reflective echo amplitude was measured by immersion method with the mechanical and the electronic scanning of point-focussed ultrasonic beam(25 MHz). As the results of this study, corona bond which is the most dangerous types of interface defects can be successfully detected, as well as expulsion and voids. Ultrasonic testing results were confirmed and compared by optical microscope and SAM(Scanning Acoustic Microscope) observation of the spot-weld cross section. The results show that the nugget diameter can be successfully measured with the accuracy of 0.8 mm.

• Journal of the Korean Society for Nondestructive Testing
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• v.32 no.4
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• pp.393-400
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• 2012

In recent years, nano-structured thin film systems are often applied in industries such as MEMS/NEMS device, optical coating, semiconductor or like this. Thin films are used for many and varied purpose to provide resistance to abrasion, erosion, corrosion, or high temperature oxidation and also to provide special magnetic or dielectric properties. Quite a number of articles to evaluate the characterization of thin film structure such as film density, film grain size, film elastic properties, and film/substrate interface condition were reported. Among them, the evaluation of film adhesive to substrate has been of great interest. In this study, we fabricated the polymeric thin film system with different adhesive conditions to evaluate the adhesive condition of the thin film. The nano-structured thin film system was fabricated by spin coating method. And then V(z) curve technique was applied to evaluate adhesive condition of the interface by measuring the surface acoustic wave(SAW) velocity by scanning acoustic microscope(SAM). Furthermore, a nano-scratch technique was applied to the systems to obtain correlations between the velocity of the SAW propagating within the system including the interface and the shear adhesive force. The results show a good correlation between the SAW velocities measured by acoustic spectroscope and the critical load measured by the nano-scratch test. Consequently, V(z) curve method showed potentials for characterizing the adhesive conditions at the interface by acoustic microscope.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1991.04a
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• pp.127-133
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• 1991

Acoustic microscopy has attracted much intrest recently as potential mondestructive evalution technique for detecting and sizing defects of surface and sub-surface. Also acoustic emission testing method has been developed for detecting microcracks which is more than 30 umm in length quintitatively on ceramics material. In the present paper, acoustic emission during the four point bending test in hot-pressed sintered Si$\_$3/N$\_$4/ specimen which was stressed bythermal shock has been measured by high sensitive sensing system. The surface and sub-surface cracks were detected by scanning acoustic microscope of 800 MHz and conventional ultrasonic testing in C-scope image. The purpose was to investigate the location and size of cracks by SAM and AE technique, whose experimental datas demontrates good agreement for detecting microcracks.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2003.10a
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• pp.426-430
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• 2003

본 연구에서는 초음파현미경의 기하학적 원리와 초음파현미경의 특징중 하나인 V(z)곡선의 간섭파형을 시뮬레이션 하였고, 실제 초음파현미경의 V(z)곡선법을 이용하여 미소영역에서의 누설탄성표면파 음속을 측정하였다. 초음파현미경을 이용한 V(z)곡선법의 음속측정결과가 시뮬레이션 음속값과 큰차이를 보이지 않으므로 미소영역에 초음파현미경의 V(z)곡선법을 적용하여 초음파의 음속측정이 가능함을 확인하였다. 이는 향후 초음파현미경을 이용하여 미세한 재료의 물성평가에 적용할 수 있을 것으로 기대된다.

• Transactions of the Korean Society of Mechanical Engineers
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• v.17 no.2
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• pp.237-247
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• 1993

Carbon fiber reinforced plastics(CFRP) have gained increased application in aerospace structures because of their specific strength and stiffness, but are sensitive to impact-induced damage. An experimental investigation was carried out to evaluate the impact resistance of CFRP according to the ply angle. The specimens of angle ply laminate composites were employed with [0.deg. $_{6}$/ .deg.$_{10}$/0.deg.$_{6}$], in which 6 kinds of ply angle such as .deg.=15.deg., 30.deg., 45.deg., 60.deg., 75.deg. and 90.deg. were selected. The impact tests were conducted using the air gun type impact testing machine by steel balls of diameter of 5 mm and 10 mm, and impact-induced damages were evaluated under same impact speed of V=60m/s. The impact damaged zones were observed through a scanning acoustic microscope (SAM). The obtained results were summarized as follows: (1) Delaminations on the interfacial boundaries showed th directional characteristics to the fiber directions. The delamination area on the impact side (interface A) was considerably smaller compared to that of the opposite side (interface B). (2) Cracks corresponding to other delaminations than those mentioned in SAM photographs were also seen on the impact damaged zone. (3) The delamination patterns were affected by the ply-angle, the dimensions of the specimen, and the boundary conditions. (4) The impact damaged zone showed zone showed the delamination on the interfacial boundaries, transverse shear cracks of the surface layer, and bending cracks of the bottom layer.r.r.r.