• Journal of the Korea Academia-Industrial cooperation Society
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• v.22 no.4
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• pp.235-245
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• 2021

Recently, the frequency of torrential rain is increasing due to climate change, which causes a large amount of debris flows. The purpose of this study was to understand the flow characteristics of debris flow according to the change in channel slope and volumetric sediment concentration and to analyze the effects of a berm on the flow characteristics of debris flow. The flow characteristics of debris flow, such as flow velocity, flow depth, Froude number, and flow resistance coefficients, were calculated using laboratory tests. The effect of a berm was analyzed by comparing the experimental results of a linear channel with those of a one-stepped channel. The results showed that the channel slope affected the flow velocity and flow depth, and the volumetric sediment concentration affected the flow velocity and flow depth, Froude number, and flow resistance coefficient. Moreover, as a berm was installed, the flow velocity and flow depth decreased by up to 26.1% and 71.2%, respectively. This means that installing a berm reduces the flow velocity, thereby reducing the mobility and kinetic energy. These results provide useful information to understand better the flow characteristics of debris flow and the effectiveness of a berm.

• KSCE Journal of Civil and Environmental Engineering Research
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• v.42 no.2
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• pp.197-208
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• 2022

The existence of shallow bedrock and the desire to use underground space necessitate the use of blasting methods. The standard blasting method under water after drilling is associated with certain technical difficulties, including reduced detonation power, the use of a fixed charge per delay, and decoupling. However, there is no blasting method to replace the existing blasting method. In this paper, a dry hole charged with ANFO blasting is assessed while employing a dry hole pumping system to remove water from the drill borehole. Additional standard blasting is also utilized to compare the blasting performances of the two methods. The least-squares linear regression method is adopted to analyze the blasting vibration velocity quantitatively using the measured vibration velocity for each blasting method and the vibration velocity model as a function of the scaled distance. The results show that the dry hole charged with ANFO blasting will lead to greater damping of the blasting vibration, more energy dissipation to crush the surrounding rock, and closer distances for the allowable velocity of the blasting vibration. Also, standard blasting shows much longer influencing distances and a wider range of the blasting pattern. The pilot test confirms the blasting efficiency of dry hole charged with ANFO blasting.

• KSCE Journal of Civil and Environmental Engineering Research
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• v.29 no.1A
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• pp.61-73
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• 2009

In this paper, hybrid health monitoring techniques using acceleration-impedance features are newly proposed to detect two damage-type in steel plate-girder bridges, which are girder's stiffness-loss and support perturbation. The hybrid techniques mainly consists of three sequential phases: 1) to alarm the occurrence of damage in global manner, 2) to classify the alarmed damage into subsystems of the structure, and 3) to estimate the classified damage in detail using methods suitable for the subsystems. In the first phase, the global occurrence of damage is alarmed by monitoring changes in acceleration features. In the second phase, the alarmed damage is classified into subsystems by recognizing patterns of impedance features. In the final phase, the location and the extent of damage are estimated by using modal strain energy-based damage index method and root mean square deviation (RMSD) method. The feasibility of the proposed hybrid technique is evaluated on a laboratory-scaled steel plate-girder bridge model for which hybrid acceleration-impedance signatures were measured for several damage scenarios. Also, the effect of temperature on the accuracy of the impedance-based damage monitoring results are experimentally examined from combined scenarios of support damage cases and temperature changes.

• Journal of Korea Port Economic Association
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• v.39 no.2
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• pp.129-141
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• 2023

This study analyzes the dynamic characteristics of daily freight rates of dry bulk and tanker shipping markets and their forecasting accuracy by using the error correction models. In order to calculate the error terms from the co-integrated time series, this study uses the common stochastic trend model (CSTM model) and vector error correction model (VECM model). First, the error correction model using the error term from the CSTM model yields more appropriate results of adjustment speed coefficient than one using the error term from the VECM model. Furthermore, according to the adjusted determination coefficients (adjR²), the error correction model of CSTM-model error term shows more model fitness than that of VECM-model error term. Second, according to the criteria of mean absolute error (MAE) and mean absolute scaled error (MASE) which measure the forecasting accuracy, the results show that the error correction model with CSTM-model error term produces more accurate forecasts than that of VECM-model error term in the 12 cases among the total 15 cases. This study proposes the analysis and forecast tasks 1) using both of the CSTM-model and VECM-model error terms at the same time and 2) incorporating additional data of commodity and energy markets, and 3) differentiating the adjustment speed coefficients based the sign of the error term as the future research topics.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.239-240
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• 2008

As semiconductor devices are scaled down for better performance and more functionality, the Cu-based interconnects suffer from the increase of the resistivity of the Cu wires. The resistivity increase, which is attributed to the electron scattering from grain boundaries and interfaces, needs to be addressed in order to further scale down semiconductor devices [1]. The increase in the resistivity of the interconnect can be alleviated by increasing the grain size of electroplating (EP)-Cu or by modifying the Cu surface [1]. Another possible solution is to maximize the portion of the EP-Cu volume in the vias or damascene structures with the conformal diffusion barrier and seed layer by optimizing their deposition processes during Cu interconnect fabrication, which are currently ionized physical vapor deposition (IPVD)-based Ta/TaN bilayer and IPVD-Cu, respectively. The use of in-situ etching, during IPVD of the barrier or the seed layer, has been effective in enlarging the trench volume where the Cu is filled, resulting in improved reliability and performance of the Cu-based interconnect. However, the application of IPVD technology is expected to be limited eventually because of poor sidewall step coverage and the narrow top part of the damascene structures. Recently, Ru has been suggested as a diffusion barrier that is compatible with the direct plating of Cu [2-3]. A single-layer diffusion barrier for the direct plating of Cu is desirable to optimize the resistance of the Cu interconnects because it eliminates the Cu-seed layer. However, previous studies have shown that the Ru by itself is not a suitable diffusion barrier for Cu metallization [4-6]. Thus, the diffusion barrier performance of the Ru film should be improved in order for it to be successfully incorporated as a seed layer/barrier layer for the direct plating of Cu. The improvement of its barrier performance, by modifying the Ru microstructure from columnar to amorphous (by incorporating the N into Ru during PVD), has been previously reported [7]. Another approach for improving the barrier performance of the Ru film is to use Ru as a just seed layer and combine it with superior materials to function as a diffusion barrier against the Cu. A RulTaN bilayer prepared by PVD has recently been suggested as a seed layer/diffusion barrier for Cu. This bilayer was stable between the Cu and Si after annealing at $700^{\circ}C$ for I min [8]. Although these reports dealt with the possible applications of Ru for Cu metallization, cases where the Ru film was prepared by atomic layer deposition (ALD) have not been identified. These are important because of ALD's excellent conformality. In this study, a bilayer diffusion barrier of Ru/TaCN prepared by ALD was investigated. As the addition of the third element into the transition metal nitride disrupts the crystal lattice and leads to the formation of a stable ternary amorphous material, as indicated by Nicolet [9], ALD-TaCN is expected to improve the diffusion barrier performance of the ALD-Ru against Cu. Ru was deposited by a sequential supply of bis(ethylcyclopentadienyl)ruthenium [Ru$(EtCp)_2$] and $NH_3$plasma and TaCN by a sequential supply of $(NEt_2)_3Ta=Nbu^t$ (tert-butylimido-trisdiethylamido-tantalum, TBTDET) and $H_2$ plasma. Sheet resistance measurements, X-ray diffractometry (XRD), and Auger electron spectroscopy (AES) analysis showed that the bilayer diffusion barriers of ALD-Ru (12 nm)/ALD-TaCN (2 nm) and ALD-Ru (4nm)/ALD-TaCN (2 nm) prevented the Cu diffusion up to annealing temperatures of 600 and $550^{\circ}C$ for 30 min, respectively. This is found to be due to the excellent diffusion barrier performance of the ALD-TaCN film against the Cu, due to it having an amorphous structure. A 5-nm-thick ALD-TaCN film was even stable up to annealing at $650^{\circ}C$ between Cu and Si. Transmission electron microscopy (TEM) investigation combined with energy dispersive spectroscopy (EDS) analysis revealed that the ALD-Ru/ALD-TaCN diffusion barrier failed by the Cu diffusion through the bilayer into the Si substrate. This is due to the ALD-TaCN interlayer preventing the interfacial reaction between the Ru and Si.