• 한국정보디스플레이학회:학술대회논문집
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• 2005.07b
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• pp.919-921
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• 2005

We describe that an elastomeric stamp of poly(dimethylsiloxane) (PDMS) can modify the surface energy of some surfaces when brought into conformal contact with the number of stamping. We focus on an increase of the hydrophobicity of the patterned surface due to diffusion of low molecular weight (LMW) silicone polymer chains. The transfer of PDMS to the surface during patterning is relevant to and calls for attention by those who are using this method in applications where control of the surface chemistry is of importance for the application.

• Korean Chemical Engineering Research
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• v.46 no.6
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• pp.1081-1086
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• 2008

QDs-LEDs(quantum dot light emitting device) should contain well-organized arrays of QDs on an electron transport layer. Thin films of CdSe/ZnS core-shell QDs were successfully fabricated on $TiO_2$ substrates by using PDMS stamp and micro contact printing method. 2-Carboxyethylphosphonic acid(CAPO) and 1,6-hexanedithiol(HDT) were employed as molecular linkers in assembling CdSe/ZnS core-shell QDs with high-density and uniform array. The CAPO increased the binding strength between the QDs and the substrates, and the HDT induced the strong inter-particle attractions of assembled QDs. The assembling properties of QDs thin films were characterized by SEM, AFM, optical microscope and photoluminescence spectroscope(PL).

• Applied Chemistry for Engineering
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• v.23 no.5
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• pp.501-504
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• 2012

In this study, etched Al electrodes with ordered arrays of pits and high aspect ratios were successively obtained using a patterned protect layer on the Al surface prepared with soft lithography method. Various methods were applied to fabricate a well ordered protect layer on the Al surface and the difference of etched Al surfaces with and without a protect layer was investigated by using SEM. It was found that the etched Al surfaces were affected by using either a protect layer or a non protect layer. As a result, the Al surface with the well ordered pits could be achieved by protect layer. However, the etched Al with nonuniform pits can be obtained without any protect layers.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.2
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• pp.7-14
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• 2010

This paper describes the effects of kinetic parameters such as attaching speed, attaching time, and dettaching speed on printing property of electrodes which were fabricated by micro-contact printing with Ag ink. In inking process the attaching speed was preferable to be less than 1 mm/s, attaching time as short as possible, and detaching speed larger than 1000 mm/s in order to obtain the transfer ratio of ink larger than 98%. Meanwhile in printing process the parameters were totally opposite to the results of inking process; attaching speed larger than 100 mm/s, attaching time larger than 30 sec, and detaching speed less than 1 mm/s for the best results. With the parameters we could obtain the micro-contact printed electrodes with the minimum line width of $30\;{\mu}m$, thickness of 300~500 nm, roughness less than 50 nm, and resistivity of about $15{\sim}16{\mu\Omega\cdot}cm$.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.26 no.11
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• pp.841-845
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• 2013

We give a textured front on silicon wafer for high-efficiency solar cells by using micro contact printing method which uses PDMS (polydimethylsiloxane) silicon rubber as a stamp and SAM (self assembled monolayer)s as an ink. A random pyramidal texturing have been widely used for a front-surface texturing in low cost manufacturing line although the cell with random pyramids on front surface shows relatively low efficiency than the cell with inverted pyramids patterned by normal optical lithography. In the past two decades, the micro contact printing has been intensively studied in nano technology field for high resolution patterns on silicon wafer. However, this promising printing technique has surprisingly never applied so far to silicon based solar cell industry despite their simplicity of process and attractive aspects in terms of cost competitiveness. We employ a MHA (16-mercaptohexadecanoic acid) as an ink for Au deposited $SiO_2/Si$ substrate. The $SiO_2$ pattern which is same as the pattern printed by SAM ink on Au surface and later acts as a hard resist for anisotropic silicon etching was made by HF solution, and then inverted pyramidal pattern is formed after anisotropic wet etching. We compare three textured surface with different morphology (random texture, random pyramids and inverted pyramids) and then different geometry of inverted pyramid arrays in terms of reflectivity.