• 제목/요약/키워드: resin compositions

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Study on Properties of Epoxy Resin Compositions Containing Novolac Derivatives (바이페닐 유도체를 도입한 에폭시 수지 조성물의 특성에 관한 연구)

  • Choi, Su Jung;Kim, Young Chul
    • Journal of Adhesion and Interface
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    • v.12 no.4
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    • pp.138-143
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    • 2011
  • Recently epoxy resin compositions having backbone of novolac derivatives with biphenylene compounds have been used as materials of eco-freindly EMC (Epoxy Molding Compound), because the cured epoxy resin compositions show the self-extinguishing without flame retardant additives. In this study, epoxy resin compositions were prepared and cured using novolac derivateves with biphenylene. Their propeties - structures of phenol derivatives and reactivity, thermal expansion, modulus, and thermal degradation - were obtained by DSC, DMA, TMA, TGA method. When both epoxy resin and hardenr had the biphenyl novolac structure, epoxy resin compositions showed low thermal expansion, good mechanical property, and combustion retardation.

Effects of Resin Compositions and Additives on Gelation Properties and Bonding Characteristics of Urea-Melamine-Formaldehyde resin adhesives (요소·멜라민 수지 접착제의 겔화성 및 접착특성에 미치는 수지조성과 첨가물의 영향)

  • Roh, Jeang-Kwan
    • Journal of the Korean Wood Science and Technology
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    • v.27 no.1
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    • pp.72-78
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    • 1999
  • To accelerate the curing and to improve the bonding properties of urea-melamine-formaldehyde (UMF) resin adhesives for plywood, the effects of resin compositions and additives on gelation time and bonding strength were discussed. The gelation time of UMF resin prepared by simultaneous reaction with urea(U), melamine(M) and formaldehyde(F) at M/U molar ratio 0.2 was shortened as the molar ratio of formaldehyde to urea was increased. However, at F/U molar ratios higher than 2.5, the amounts of free fomaldehyde of resin could not satisfy with KS standard, Therefore, it was difficult to increase the amount of formaldehyde in resin composition for the purpose of fast gelation time. With increasing the molar ratio of melamine to urea(M/U) from 0.3 to 0.6 at constant F/U molar ratio 3.4, the gelation time of UMF resin was slightly decreased, while gradually increased at M/U molar ratio higher than 0.6. The gelation properties of UMF resin and bonding strength of UMF-bonded plywood could be enhanced by using ammonium chloride and p-toluene sulfonic acid as a curing-agent together with wheat flour and corngluten powder as a extender.

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Bonding for dental ceramic (임상가를 위한 특집 2- 세라믹 수복물의 접착)

  • Seo, Deog-Gyu
    • The Journal of the Korean dental association
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    • v.50 no.7
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    • pp.377-383
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    • 2012
  • Recently, ceramic materials have become a popular choice for dentists performing esthetic indirect restorations. The longevity and success of ceramic dental restorations depends on the adhesive procedures of resin cements. However, dental ceramics can be classified in various ways, depending on the compositions. Also, the applications for resin cement require multiple clinical steps. Therefore, understanding the different ceramic substrates involved in each procedure, as well as the proper adhesive steps for the resin cements is important to us for long-term clinical success.

Study on Self-extinguishing Epoxy Resin Composition (자기소화성 에폭시 수지 조성물 연구)

  • Kim, Young Chul;Cha, Ok Ja;Kim, Kyung Man
    • Journal of Adhesion and Interface
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    • v.11 no.4
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    • pp.168-173
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    • 2010
  • Flame retardant halogen containing compounds have been replaced as environmentally safe material which does not contain hazardous materials generating toxic gas. Self-extinguishing epoxy resin compositions have been studied in order to produce eco-friendly epoxy molding compound, which is used as insulating materials in semiconductor. We developed self-extinguishing epoxy resin compositions which do not contain halogen compounds with new epoxy resin (E3). The new epoxy molding compound (EMC-1) showed high flame resistance (UL-V0) and high thermal resistance ($451.9^{\circ}C$ at 5 wt% loss) enough to use as eco-friendly material.

Change in Chemical Compositions of Leachate and Medium Density Fiberboard from a Laboratory-scale Simulated Landfill

  • Lee, Min;Prewitt, Lynn;Mun, Sung Phil
    • Journal of the Korean Wood Science and Technology
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    • v.44 no.2
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    • pp.231-240
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    • 2016
  • The change in chemical compositions of leachate and medium density fiberboard (MDF) from a laboratory-scale simulated landfill which constructed in a plastic container containing alternating layers of soil and MDF was investigated to evaluate decomposing of MDF in soil. Four treatments were conducted: 1) MDF in soil, 2) MDF only, 3) cured UF resin in soil, and 4) soil only. Molecular weight (MW) distribution of compounds in leachate from soil only treatment did not change over time. In UF resin in soil treatment, the MW distribution shifted to a lower MW distribution over time, while the peak shifted to the left indicated changing to higher MW distribution in leachate from treatment 1 and 2 contained MDF. Higher percent nitrogen in leachate was observed in MDF containing treatments due to the UF resin in the MDF. The percent carbon slightly increased in MDF only while that greatly decreased in MDF in soil treatment maybe due to bacterial activity. The percent of extractable materials from the MDF decreased greatly on day 35 compare to day 0, and subsequently did not change much on day 77. In contrast, percent holocellulose and lignin did not change much over time. No structural change of the wood fiber in MDF occurs during the study. Water-soluble materials from MDF in soil contributed the change in chemical composition of leachate.

Bending Performances of Radiata Pine Veneers and Phenol Resin-Impregnated Sheet Overlaid Plywoods by Nondestructive Evaluation (비파괴평가에 의한 라디에타소나무 단판 및 수지함침시트 표면적층 합판의 휨성능)

  • Suh, Jin-Suk
    • Journal of the Korean Wood Science and Technology
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    • v.26 no.1
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    • pp.87-96
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    • 1998
  • The bending performances were evaluated at the radiata pine plywood through veneer compositions encompassing veneer quality, ply-numbers and overlays of the high density- or medium density-phenol resin impregnated sheets (hereafter abbreviated as resin sheets) on the raw plywood. In addition, a prediction on the bending MOE of veneers and plywoods was carried out by the nondestructive testing with stresswave timer. The summarized results were as follows: I. Bending strength and bending MOE of resin sheets-overlaid plywoods in parallel surface grain direction through 5 and 7ply were increased by 13 to 45% and 17 to 34%, respectively. Resin sheets-overlay occurred an increasing effect of the strength efficiency i.e. strength perpendicular-to-grain direction versus that parallel-to-grain direction, showing the phenomenon that the plywood strength becomes greater at the perpendicular-to-grain direction of 7ply than at that of 5ply. Displacement at bending failure had a greater trend at 7ply than at 5ply, and was decreased by resin sheets-overlay. 2. After the nondestructive bending MOEs were measured for individual veneers, these veneers were rearranged in plywood-manufacture. In these plywoods, including resin sheets-overlay, the actual MOE was predictable with feasibility of $R^2$=0.53, and also the nondestructively-evaluated MOE was lower by 20% in raw plywood, and higher 20% in LVL than actual bending MOEs.

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Effect of Composition of EVA-based Hot-Melt Adhesives on Adhesive Strength (EVA계 핫멜트 접착제의 조성이 접착력에 미치는 영향)

  • Lee, Jung-Joon;Song, Yu-Hyun;Lim, Sang-Kyun;Park, Dae-Soon;Sung, Ick-Kyung;Chin, In-Joo
    • Journal of Adhesion and Interface
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    • v.11 no.4
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    • pp.155-161
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    • 2010
  • A series of ethylene vinyl acetate (EVA) based hot melt adhesives containing different types and compositions of tackifier resins were prepared to investigate their rheological behavior and T-peel adhesion strength on polyurethane (PU) elastomeric sheets. C5 aliphatic hydrocarbon resin (C5 resin), C9 aromatic hydrocarbon resin (C9 resin), hydrogenated dicyclopentadiene resin ($H_2$-DCPD resin), and dicyclopentadiene and acrylic monomer copolymer resin (DCPD-acrylic resin) were used as the tackifiers for the hot melt adhesives. To determine the polarity of the tackifiers, their oxygen contents were analyzed, and the DCPDacrylic resin was found to contain an oxygen content higher than the other tackifiers. Only the DCPD-acrylic resin showed complete miscibility with EVA and the homogeneous phase of the hot melt adhesive blends at all compositions. The T-peel adhesion strength between the hot melt adhesives and polyurethane elastomeric sheets was mainly affected by the polarity of the tackifier resins in the hot melt adhesives, rather than by the storage moduli, G', of the hot melt adhesives themselves.

A Study on the Mechanical Properties of Composite Materials of Polyurethane Resin and CuO (PUR/CuO 복합재료의 기계적 특성 연구)

  • Kim, Eun-Bong;Koo, Su-Jin;Jeong, Sang-Gu;Kim, Seok-Hyeon
    • Journal of Power System Engineering
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    • v.18 no.5
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    • pp.106-114
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    • 2014
  • For the purpose of development of polyurethane sealing material, polyurethane resins reinforced with CuO were prepared from polyol and MOAC(4,4'-Methylenebis(2-chlorobenzeneamine)). And the effects of compositions on the mechanical properties of the reinforced polyurethane resin were experimentally examined. The polyurethane resin got to be thermally decomposed at $260^{\circ}C$ and completely carbonized around $500^{\circ}C$. Tensile strength, elongation and hardness of the polyurethane resin increased with the content of MOCA. CuO was uniformly dispersed in the polyurethane resin by 1 minute's ultrasonic radiation. Tensile strength, elongation and hardness of the polyurethane resin reinforced with CuO increased with the content of CuO. Tensile strength and hardness of the reinforced polyurethane resin increased with particle size of the CuO, but elongation decreased. CuO showed higher tensile strength and hardness than any other additives, and lowest elongation.

Shear bond strength between CAD/CAM denture base resin and denture artificial teeth when bonded with resin cement

  • Han, Sang Yeon;Moon, Yun-Hee;Lee, Jonghyuk
    • The Journal of Advanced Prosthodontics
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    • v.12 no.5
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    • pp.251-258
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    • 2020
  • PURPOSE. The bond strengths between resin denture teeth with various compositions and denture base resins including conventional and CAD/CAM purposed materials were evaluated to find influence of each material. MATERIALS AND METHODS. Cylindrical rods (6.0 mm diameter × 8.0 mm length) prepared from pre-polymerized CAD/CAM denture base resin blocks (PMMA Block-pink; Huge Dental Material, Vipi Block-Pink; Vipi Industria) were bonded to the basal surface of resin teeth from three different companies (VITA MFT®; VITA Zahnfabrik, Endura Posterio®; SHOFU Dental, Duracross Physio®; Nissin Dental Products Inc.) using resin cement (Super-Bond C&B; SUN MEDICAL). As a control group, rods from a conventional heat-polymerizing denture base resin (Vertex™ Rapid Simplified; Vertex-Dental B.V. Co.) were attached to the resin teeth using the conventional flasking and curing method. Furthermore, the effect of air abrasion was studied with the highly cross-linked resin teeth (VITA MFT®) groups. The shear bond strengths were measured, and then the fractured surfaces were examined to analyze the mode of failure. RESULTS. The shear bond strengths of the conventional heat-polymerizing PMMA denture resin group and the CAD/CAM denture base resin groups were similar. Air abrasion to VITA MFT® did not improve shear bond strengths. Interfacial failure was the dominant cause of failure for all specimens. CONCLUSION. Shear bond strengths of CAD/CAM denture base materials and resin denture teeth using resin cement are comparable to those of conventional methods.

The Conduction Properties of Epoxy Resin Composition According to the Content Change of Spherical Hollow Type Silver (중공형 구형 은입자의 함량변화에 따른 에폭시 수지조성물의 전도특성 연구)

  • Kim, Whan Gun;Lim, Ryun Woo
    • Journal of the Semiconductor & Display Technology
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    • v.11 no.2
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    • pp.23-26
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    • 2012
  • The monodispersed polystyrene spheres were prepared by emulsion polymerization in aqueous alcohol system. They coated with silver by reduction of silver ion percolated on the surface of them. The spherical hollow type silver has been prepared by dissolving polystyrene with toluene. Epoxy resin compositions with spherical hollow type silver were manufactured, which were composed of a bisphenol F type epoxy resin (RE-304S), amine type hardener (Kayahard AA), and 1-benzyl 2-methyl imidazole (1B2MI) as catalyst. The electrical conductivity with silver content ratio were investigated after cure, the percolation threshold weight ratio for conductance in this epoxy resin system was obtained above the 70 wt% of silver.