• 제목/요약/키워드: resin

검색결과 7,460건 처리시간 0.027초

합판용 페놀수지 접착제의 속경화 (Fast-Curing of Phenol·Formaldehyde Resin Adhesives for Plywood)

  • 노정관
    • Journal of the Korean Wood Science and Technology
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    • 제23권3호
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    • pp.33-39
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    • 1995
  • To accelerate the cure of phenolic resin adhesives for plywood, the complexation with melamine resin and the addition of cure-accelerating agents were discussed. The hot-pressing temperature and time of phenol resin could be decreased by complexation with melamine resin. but the wet glue-joints strength of phenol melamine resin was lower than that of ordinary phenol resin in case of plywood using spruce veneer at core layer. Among the tested cure-accelerating agents. the sodium carbonate showed the greatest effect on shortening gelation time of phenolic resin. In addition, in the manufacturing scale test, the hot-pressing time of phenol resin with the addition of 5 parts sodium carbonate could be shortened about 20% compared with ordinary phenol resin which had same glue-joints properties.

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의치상 수리면 오염원에 따른 수지의 결합강도 (Bond strength of denture base resin repaired according to contamination)

  • 정경풍
    • 대한치과기공학회지
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    • 제25권1호
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    • pp.71-79
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    • 2003
  • The purpose of this study was to investigate bond strength of denture base resin repaired according to contamination. One commercial denture base resin and two different kinds of relines resin were tested; Lusiton 199(denture base resin), Vertex(reline resin) and TokusoRebase(repair resin). The specimens were processed according to the manufacturer's instructions to cured denture base resin(polymethylmethacrylate; PMMA) and reline resin. Bond strengths were examined by use of a three-point transverse flexural strength test. Data were analyzed with two-factor analysis of variance and Duncan's post-hoc test at $\alpha$=0.05. Generally, the bondstrength of heat-cured resin(Lusiton 199) was higher than the other resins. The contaminations produced an decrease in bond strength. Therefore the contamination, such as saliva or water must be avoided during the laboratory repair procedures.

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UV 나노임프린트 리소그래피의 Quartz 기판상의 Resin mold 제거를 위한 Hybrid 세정공정에 관한 연구

  • 조윤식;김민수;강봉균;김재관;이병규;박진구
    • 한국재료학회:학술대회논문집
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    • 한국재료학회 2012년도 춘계학술발표대회
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    • pp.81.1-81.1
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    • 2012
  • 나노임프린트 리소그라피(Nano-Imprint Lithography, NIL) 기술은 기판위의 resin을 나노구조물이 각인된 스탬프로 눌러서 나노구조물을 형성하는 기술로, 경제적이고 효과적으로 나노구조물을 제작할 수 있는 기술이다. 그중에서도 UV 기반의 나노임프린트(UV-NIL) 기술은 resin을 투명한 스탬프로 누른뒤 UV로 경화시켜 나노구조물을 형성하는 기술로써 고온, 고압($140{\sim}180^{\circ}C$, 10~30bar)이 필요한 가열식 나노임프린트 기술에 비해 상온, 상압($20^{\circ}C$, 1bar)에서도 구조물 형성이 가능하여 다층구조 형성에 적합하다. 연속적인 임프린팅 공정에 의해 resin이 quarz 스탬프에 잔류하여 패터닝에 결함을 유발하게 되므로 오염물을 제거하기 위한 세정공정이 필요하다. 하지만 UV에 의해 경화된 resin은 cross-linking을 형성하여 화학적인 내성이 증가하게 되므로 제거하기가 어렵다. 현재는 resin 제거를 위한 세정공정으로 SPM($H_2SO_4/H_2O_2$) 세정이 사용되고 있는데 세정시간이 길고 세정 후에 입자 또는 황 잔유물이 남으며 많은 유해용액 사용의 문제점이 있어 효과적으로 resin을 제거할 세정공정이 필요한 상황이다. 본 연구에서는 친환경적인 UV 세정 및 오존수 세정공정을 적용하여 경화된 resin을 제거하는 연구를 진행하였다. 실험샘플은 약 100nm 두께의 resin을 증착한 $1.5cm{\times}1.5cm$ $SiO_2$ 쿠폰 wafer를 사용하였으며, UV 및 오존수의 처리시간을 달리하여 resin 제거효율을 평가하였다. ATR-FTIR 장비를 사용하여 시간에 따른 resin의 두께를 측정한 결과, UV 세정으로 100nm 높이의 resin중에 80nm의 bulk resin이 단시간에 제거가 되었고 나머지 20nm의 resin thin film은 오존수 세정으로 쉽게 제거되는 것을 확인 하였다. 또한 표면에 남은 resin residue와 particle을 제거하기 위해서 SC-1 세정을 진행하였고 contact angle과 optical microscope 장비를 사용하여 resin이 모두 제거된 것을 확인하였다.

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Synthesis of Triazole-functionalized Phenolic Resin and its Inherent Flame Retardant Property

  • Poduval, Mithrabinda K.K.;Kim, Tae-Hyun
    • Bulletin of the Korean Chemical Society
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    • 제35권11호
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    • pp.3249-3253
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    • 2014
  • A novel triazole-functionalized phenolic resin was developed, and its thermal and flame-retardant properties were investigated. The triazole group was incorporated as a pendant unit on the phenolic resin via copper-mediated click chemistry between propargylated phenolic resin and benzyl azide. The newly-developed triazole-functionalized phenolic resin showed higher thermal stability and char yield, together with a reduced total heat release (THR), than the non-functionalized bare phenolic resin, indicating enhanced flame retardancy for the triazole-functionalized phenolic resin.

Shear bond strength between CAD/CAM denture base resin and denture artificial teeth when bonded with resin cement

  • Han, Sang Yeon;Moon, Yun-Hee;Lee, Jonghyuk
    • The Journal of Advanced Prosthodontics
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    • 제12권5호
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    • pp.251-258
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    • 2020
  • PURPOSE. The bond strengths between resin denture teeth with various compositions and denture base resins including conventional and CAD/CAM purposed materials were evaluated to find influence of each material. MATERIALS AND METHODS. Cylindrical rods (6.0 mm diameter × 8.0 mm length) prepared from pre-polymerized CAD/CAM denture base resin blocks (PMMA Block-pink; Huge Dental Material, Vipi Block-Pink; Vipi Industria) were bonded to the basal surface of resin teeth from three different companies (VITA MFT®; VITA Zahnfabrik, Endura Posterio®; SHOFU Dental, Duracross Physio®; Nissin Dental Products Inc.) using resin cement (Super-Bond C&B; SUN MEDICAL). As a control group, rods from a conventional heat-polymerizing denture base resin (Vertex™ Rapid Simplified; Vertex-Dental B.V. Co.) were attached to the resin teeth using the conventional flasking and curing method. Furthermore, the effect of air abrasion was studied with the highly cross-linked resin teeth (VITA MFT®) groups. The shear bond strengths were measured, and then the fractured surfaces were examined to analyze the mode of failure. RESULTS. The shear bond strengths of the conventional heat-polymerizing PMMA denture resin group and the CAD/CAM denture base resin groups were similar. Air abrasion to VITA MFT® did not improve shear bond strengths. Interfacial failure was the dominant cause of failure for all specimens. CONCLUSION. Shear bond strengths of CAD/CAM denture base materials and resin denture teeth using resin cement are comparable to those of conventional methods.

복합레진 인레이의 내면처리와 합착용 시멘트의 종류에 따른 인장접합강도에 관한 연구 (A STUDY ON THE TENSILE BOND STRENGTH OF COMPOSITE RESIN INLAYS ACCORDING TO THEIR INTERNAL SURFACE TREATMENT AND TYPES OF LUTING CEMENT)

  • 김진철;조영곤;황호길
    • Restorative Dentistry and Endodontics
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    • 제18권1호
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    • pp.103-113
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    • 1993
  • The purpose of this study was to evaluate the tensile bond strength of composite resin inlays according to the their internal surface treatment and types of luting cement and compared them with the conventional direct resin filling thchnique. Class II cavities were prepared in 50 extracted human molar teeth, and then equally divided into five groups. Group 1 : Cavities of control group were directly filled with P-50. Group 2 : Cavities of resin inlay group were luted with resin cement. Group 3 : Cavities of resin inlay group were luted with luting G-I cement. Group 4 : Cavities of resin inlay group were luted with resin cement after sandblasting. Group 5 : Cavities of resin inlay group were luted with luting G-I cement after sandblasting. All specimens were polished with same method and stored in normal saline for 24 hours before testing. An Universal Testing machine(Model No. AGS-100A, Shimadzu, Japan) was used to apply tensile loads in the vertical direction, and the force required for separation was recorded with a cross-head speed of 5mm/min and 100kg in full scale. The results were as follows : 1. The mean tensile bond strength was lowest in group luted with luting G-I cement, with measurements of $14.45{\pm}0.78(kg/cm^2)$ and highest in group luted with resin cement after sandblasting, with measurements of $49.6{\pm}2.74(kg/cm^2)$. 2. The tensile bond strength was greater in resin inlay groups luted with resin cement than in control group and resin inlay groups luted with luting G-I cement(P<0.05). 3. The tensile bond strength was lower in resin inlay groups luted with luting G-I cement than in control group(P<0.05). 4. The tensile bond strength was greater in resin inlay groups luted with resin cement or luting G-I cement after sandblasting than without that(P<0.05).

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RESIN TRANSFER MOLDING 공정에서의 기공 형성에 관한 3차원 모델링 (Three-Dimensional Modeling of Void Formation During Resin Transfer Molding)

  • 배준호;강문구;임성택;이우일
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2001년도 춘계학술대회논문집C
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    • pp.246-250
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    • 2001
  • In resin transfer molding (RTM), resin is forced to flow through the fiber perform of inhomogeneous permeability. This inhomogeneity is responsible for the mismatch of resin velocity within and between the fiber tows. The capillary pressure of the fiber tows exacerbates the spatial variation of the resin velocity. The resulting microscopic perturbations of resin velocity at the flow front allow numerous air voids to form. In this study, a mathematical model was developed to predict the formation and migration of micro-voids during resin transfer molding. A transport equation was employed to account for the migration of voids between fiber tows. Incorporating the proposed model into a resin flow simulator, the volumetric content of micro-voids in the preform could be obtained during the simulation of resin impregnation.

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광중합형 복합레진의 압축강도에 미치는 레진과 필러의 영향 (The Effect or Resin ann ruler Type on the compressive strength of Light-activated Composite Resins)

  • 원대희
    • 대한의용생체공학회:의공학회지
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    • 제18권1호
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    • pp.1-8
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    • 1997
  • This study was performed to evaluate the effect of resin and filler type on the compressive strength of light-activated composite resins. Experimental composite resins containing either amorphous spherical silica or crushed quartz in two matrix resins of BisGMA/TEGDMA and UTMA/TEGDMA were prepared and the specimens of 3 m in diameter and 6m in length were made. Compressive test was subjected to a crosshead speed of 0.5 mm/min, and the fracture surFaces were examined by SEM. The compressive strength of UTMA-based composite resin was higher than that of BisGMA-based composite resin. The loading rate of spherical silica was higher than that of crushed silica when the size dis- tribution of fillers was same. Strength decrease of Bis-GMA-based composite resin was severer than that of UTMA-based composite resin in a $37^{\circ}$c water environment. Fracture surface showed that the composite resin failure developed along the matrix resin and the filler/resin interface region.

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새로운 반도체 Packaging용 Ethoxysilyl Bisphenol A Type Epoxy Resin System의 경화특성 연구 (Cure Characteristics of Ethoxysilyl Bisphenol A Type Epoxy Resin Systems for Next Generation Semiconductor Packaging Materials)

  • 김환건
    • 반도체디스플레이기술학회지
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    • 제16권2호
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    • pp.19-26
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    • 2017
  • The cure properties of ethoxysilyl bisphenol A type epoxy resin (Ethoxysilyl-DGEBA) systems with different hardeners were investigated, comparing with DGEBA and Diallyl-DGEBA epoxy resin systems. The cure kinetics of these systems were analyzed by differential scanning calorimetry with an isothermal approach, and the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. The Ethoxysilyl-DGEBA epoxy resin system showed lower cure conversion rates than DGEBA and Diallyl-DGEBA epoxy resin systems. The conversion rates of these epoxy resin systems with DDM hardener are lower than those with HF-1M hardener. It can be considered that the optimum hardener for Ethoxysilyl-DGEBA epoxy resin system is Phenol Novolac type. These lower cure conversion rates in the Ethoxysilyl-DGEBA epoxy resin systems could be explained by the retardation of reaction molecule movements according to the formation of organic-inorganic hybrid network structure by epoxy and ethoxysilyl group in Ethoxysilyl- DGEBA epoxy resin system.

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복합레진의 표면조도에 관한 연구 (A STUDY OF SURFACE ROUGHNESS OF COMPOSITE RESIN)

  • 박기현
    • 대한치과보철학회지
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    • 제38권1호
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    • pp.108-115
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    • 2000
  • This study was designed to compare the effect of polishing on surface roughness of composite resin. We used Z100(3M) composite resin and placed the composite resin in the hole (4mm thick and 4mm in diameter) of vinyl plate and polymerized it under manufacturer's instructions. Samples were divided into 5 groups by polishing methods. Group 1 was control: resin was polymerized under glass plate, Group 2: resin was polymerized without any polishing procedure, Group 3: resin was polymerized with a polishing procedure of abrasive disc, Group 4: bonding agent was applyed in thin layer and polymerized on the polished polymerized resin surface. Group 5: resin was polymerized under transparent celluloid strip. The surface roughness of each specimen was measured with Sufacoder SEF-30D (Kosaka lab. Ltd) under 0.08mm cut off, 0.05mm/s stylus speed, ${\times}40$ horizontal magnification, ${\times}5000$ vertical magnification. The results were as follows : 1. Group 1 showed the most smooth surface in this study. 2. Group 3 showed more rough surface than Group 2. Considering the surface roughness, it would be better to make the shape completely before polymerize the resin. To finish and polish after the polymerization of resin makes less smooth surface. 3. When we use the transparent celluloid strip, minimum finishing procedures are recommended. Any polishing procedure could not recover the smooth resin surface of celluloid strip. 4. Application and polymerization of the thin layer of bonding agent on the polished surface showed the minimum surface smoothing effect.

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