• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1537-1540
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• 2003

MEMS technology with micro scale is complete system utilized as the sensor. micro electro device. The metallization of MEMS is very important to transfer the power operating the sensor and signal induced from sensor part. But in the MEMS structures local stress concentration and deformation is often happened by geometrical shape and different constraint on the metallization. Therefore. this paper studies the effect of supporting type and thickness ratio about thin film thickness of the substrate thickness for the residual stress variation caused by thermal load in the multi-layer thin film. Specimens were made from materials such as Al, Au and Cu and uniform thermal load was applied, repeatedly. The residual stress was measured by FEA and nano-indentation using AFM. Generally, the specimen made of Al induced the large residual stress and the 1st layer made of Al reduced the residual stress about half percent than 2nd layer. Specimen made of Cu and Au being the lower thermal expansion coefficient induce the minimum residual stress. Similarly the lowest indentation length was measured in the Au_Cu specimen by nano-indentation.

• Transactions of the Korean Society of Mechanical Engineers
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• v.16 no.10
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• pp.1841-1852
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• 1992

With the wide application of fiber-reinforced composite material in aircraft, space structures and robot arms, the design and manufacture of composite joints have become a very important research area because they are often the weakest areas in composite structures. In this study, the effects of the adhesive thickness, residual thermal stress on the torque capacity of the tubular single lap joints were studied. The torque capacity of the adhesive joints were experimentally determined and found to be inversely proprotional to the adhesive thickness. In order to match the experimental results to the theoretical analyses, the elastic-perfectly plastic material properties of the adhesive were used in the closed form solution. Also, the residual thermal stress of the joints were calculated by the finite element method and it was proved that the residual thermal stress could play an important role in the thick adhesive joints.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.22 no.1
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• pp.238-246
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• 1998

Surface residual stresses as well as wall thickness and ovality changes after U-bending process on UNS N06690 row-1 heat exchanger tubes, were estimated. Surface residual stresses were measured by Hole Drilling Method(HDM), calculating the stresses from relieved strains of 3 rosette strain gages. After bending of the tubes, dimensional tolerances for wall thickness and ovality were satisfied with ASTM requirements. Residual stresses at the extrados were introduced with compressive stress(-) by bending operations, and its maximum value reached-319 MPa in axial direction at ${\phi}=0^{\circ}$ in position. Tensile residual stresses(+) of ${\sigma}_zz=45$ MPa,${\sigma}_zz=25$ MPa were introduced in the intrados surface at position of ${\phi}=0^{\circ}$ Maximum tensile residual stress of 170 MPa was detected on the flank side at position of ,${\phi}=95^{\circ}$i.e., at apex region. It appeared that higher stress gradients were generated at the irregular transition regions. In the trend of residual stress changes with U-bend position, the extrados is related with the changes of ovality and the intrados is related with the changes of wall thickness.

• Journal of the Semiconductor & Display Technology
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• v.14 no.3
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• pp.61-66
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• 2015

Recently, the major trends of NIL are high throughput and large area patterning. For UV NIL, if it can be proceeded in the non-vacuum environment, which greatly simplifies tool construction and greatly shorten process times. However, one key issue in non-vacuum environment is air bubble formation problem. In this paper, numerical analysis of bubble defect of UV NIL is performed. Fluent, flow analysis focused program was utilized and VOF (Volume of Fluid) skill was applied. For various resist-substrate and resist-mold angles, effects of velocity inlet and residual layer thickness of resist on bubble defect formation were investigated. The numerical analyses show that the increases of velocity inlet and residual layer thickness can cause the bubble defect formation, however the decreases of velocity inlet and residual layer thickness take no difference in the bubble defect formation.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2002.05a
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• pp.195-198
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• 2002

Residual stress of sheet occurs during cold rolling and it is hard to avoid and inevitable. The residual stress in the sheet cause etching curls when it suffers peroration process. The residual stress through the thickness direction in the sheet is a function of a friction coefficient, total reduction, mil size and initial sheet thickness. To estimate the residual stress and deformation due to etching curl, FEM analysis is performed. A numerical analysis is used a ANSYS 5.6 and an elastic-plastic constitutive equations. rho simulation results indicate a distribution of residual stress.

• Journal of the Semiconductor & Display Technology
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• v.16 no.4
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• pp.68-74
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• 2017

Nanoimprint lithography (NIL) is a next generation technology for fabrication of micrometer and nanometer scale patterns. There have been considerable attentions on NIL due to its potential abilities that enable cost-effective and high-throughput nanofabrication to the display device and semiconductor industry. Up to now there have been a lot of researches on thermal NIL, but most of them have been focused on polymer deformation in the molding process and there are very few studies on the cooling and demolding process. In this paper a cooling process of the polymer resist in thermal NIL is analyzed with finite element method. The modeling of cooling process for mold, polymer resist and substrate is developed. And the cooling process is numerically investigated with the effects of imprinting temperature and residual layer thickness of polymer resist on stress distribution of the polymer resist. The results show that the lower imprinting temperature, the higher the maximum von Mises stress and that the thicker the residual layer, the greater maximum von Mises stress.

• Design & Manufacturing
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• v.16 no.1
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• pp.27-35
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• 2022

Thermoforming is a plastic manufacturing process that applies a force to stretch a film of heated thermoplastic material over an engineered mold to create a 3-dimensional shape. After forming, the shaped part can then be trimmed and finished to specification to meet an end-user's requirements. The process and thermoplastic materials are extremely versatile and can be utilized to manufacture parts for a very wide range of applications. In this study, based on K-BKZ nonlinear viscoelastic model, thermoforming process analysis was performed for an interior room-lamp. The predicted thickness was minimum at the corner of a molded film, and maximum at the center of the bottom. By using the Taguchi method of design of experiments, the effects of process conditions on residual stresses were investigated. The dominant factors were the liner thickness and the film heating time. As the thickness of the liner increased, the residual stress decreased. And it was found that the residual stress decreased significantly when the film heating temperature was higher than the glass transition temperature. A thermoforming mold and a trimming mold were manufactured, and the spring back was investigated through experiments. The dominant factors were film heating time, liner thickness, and lower mold temperature. As the film heating time and liner thickness increased, the spring back decreased. In addition, it was found that the spring back decreased as the lower mold temperature increased.

• The Journal of the Korean dental association
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• v.40 no.12 s.403
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• pp.981-987
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• 2002

• Korean Journal of Materials Research
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• v.28 no.7
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• pp.398-404
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• 2018

Fatigue crack growth retardation of 304 L stainless steel is studied using a neutron diffraction method. Three orthogonal strain components(crack growth, crack opening, and through-thickness direction) are measured in the vicinity of the crack tip along the crack propagation direction. The residual strain profiles (1) at the mid-thickness and (2) at the 1.5 mm away from the mid-thickness of the compact tension(CT) specimen are compared. Residual lattice strains at the 1.5 mm location are slightly higher than at the mid-thickness. The CT specimen is deformed in situ under applied loads, thereby providing evolution of the internal stress fields around the crack tip. A tensile overload results in an increased magnitude of the compressive residual stress field. In the crack growth retardation, it is found that the stresses are dispersed in the crack-wake region, where the highest compressive residual stresses are measured. Our neutron diffraction mapping results reveal that the dominant mechanism is by interrupting the transfer of stress concentration at the crack tip.

• Korean Journal of Materials Research
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• v.9 no.2
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• pp.181-187
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• 1999

In this study, the effect of residual stress on mechanical strength was investigated with 1 kind of whiteware body and 4 kinds of glazes which are produced in succeeding ceramic art place. Using dipping method, the body was coated for different times in order to manipulate the coating thickness and sintered in the different temperatures ($1200^{\circ}C$, $1250^{\circ}C$, $1300^{\circ}C$, $1350^{\circ}C$) for two thus hours. The sintered bodies were characterized by XRD, EPMA, FEM and UTM in order to study the forming of reaction layer between body and glazes, residual stresses and the effects of residual stresses on mechanical strength of pottery. At $1300{\circ}C$, we obtained maximum density and mechanical strength. By the finite element method, the residual stresses in surface of body were minimum in specific thickness of glazes and the mechanical strength of body in that thickness of glazes showed maximum when the firing temperature was settled.