• Title/Summary/Keyword: rapid thermal processing

Search Result 158, Processing Time 0.031 seconds

ANALYSIS OF WATER STRESS OF GREENHOUSE PLANTS USING THERMAL IMAGING

  • K. H. Ryu;Kim, G. Y.;H. Y. Chae
    • Proceedings of the Korean Society for Agricultural Machinery Conference
    • /
    • 2000.11c
    • /
    • pp.593-599
    • /
    • 2000
  • Accurate quantification of plant physiological properties is often necessary for optimal control of an automated greenhouse production system. Conventional crop growth monitoring systems are usually burdensome, inaccurate, and harmful to crops. A thermal image analysis system was used to accomplish rapid and accurate measurements of physiological-property changes of water-stressed crops. Thermal images were obtained from several species of plants that were placed in a growth chamber. Analyzing the images provided the pattern of temperature changes in a leaf and the amount of differences in the temperature of stressed plants and non-stressed plants.

  • PDF

Analysis of Water Stress of Greenhouse Crops Using Infrared Thermography (열영상 정보를 이용한 온실 재배 작물의 수분 스트레스 분석)

  • 김기영;류관희;채희연
    • Journal of Biosystems Engineering
    • /
    • v.24 no.5
    • /
    • pp.439-444
    • /
    • 1999
  • Automated greenhouse production systems often require crop growth monitoring involving accurate quantification of plant physiological properties. Conventional methods are usually burdensome, inaccurate, and harmful to crops. A thermal image analysis system can accomplish rapid and accurate measurements of physiological-property changes of stressed crops. In this research a thermal imaging system was used to measure the leaf-temperature changes of several crops according to water deficit. Thermal images were obtained from lettuce, cucumber, pepper, and chinese cabbage plants. Results showed that there were significant differences in the temperature of stressed plants and non-stressed plants. The temperature differences between these two group of plants were 0.7 to 3$^{\circ}C$ according to species.

  • PDF

Thermal Behavior Analysis in Continuous Bloom Casting Mold (Bloom용 연속주조 몰드의 열거동 해석)

  • 정영진;김성훈;김영모;강충길
    • Transactions of Materials Processing
    • /
    • v.13 no.4
    • /
    • pp.319-325
    • /
    • 2004
  • Continuous casting machine has been experienced a rapid development to increase productivity with high casting speed and to meet consumer's strict demands for high quality. However, because most of defects and cracks are initially formed in mold and grown into surface cracks during the post process, more specific and clear investigations upon heat transfer mechanism between mold and solidified shell are necessarily needed. In this study heat transfer coefficients which shows the characteristic of heat transfer mechanism are calculated with temperatures measured in bloom mold using optimal algorithm, and thermal analysis are investigated using the calculated heat transfer coefficients. Finally uniformity of solidified shell is investigated for high carbon steel, 0.187%C from thermal analysis.

Study on Thermal Load Capacity of Transmission Line Based on IEEE Standard

  • Song, Fan;Wang, Yanling;Zhao, Lei;Qin, Kun;Liang, Likai;Yin, Zhijun;Tao, Weihua
    • Journal of Information Processing Systems
    • /
    • v.15 no.3
    • /
    • pp.464-477
    • /
    • 2019
  • With the sustained and rapid development of new energy sources, the demand for electric energy is increasing day by day. However, China's energy distribution is not balanced, and the construction of transmission lines is in a serious lag behind the improvement of generating capacity. So there is an urgent need to increase the utilization of transmission capacity. The transmission capacity is mainly limited by the maximum allowable operating temperature of conductor. At present, the evaluation of transmission capacity mostly adopts the static thermal rating (STR) method under severe environment. Dynamic thermal rating (DTR) technique can improve the utilization of transmission capacity to a certain extent. In this paper, the meteorological parameters affecting the conductor temperature are analyzed with the IEEE standard thermal equivalent equation of overhead transmission lines, and the real load capacity of 220 kV transmission line is calculated with 7-year actual meteorological data in Weihai. Finally, the thermal load capacity of DTR relative to STR under given confidence is analyzed. By identifying the key parameters that affect the thermal rating and analyzing the relevant environmental parameters that affect the conductor temperature, this paper provides a theoretical basis for the wind power grid integration and grid intelligence. The results show that the thermal load potential of transmission lines can be effectively excavated by DTR, which provides a theoretical basis for improving the absorptive capacity of power grid.

Design and Fabrication of Power Controller for Temperature Control on Semiconductor Thermal Processing (반도체 열처리 공정을 위한 온도 조절기용 전력 제어장치의 설계 및 제작)

  • 주동만;민경일;황재효
    • Journal of the Korea Academia-Industrial cooperation Society
    • /
    • v.3 no.4
    • /
    • pp.257-262
    • /
    • 2002
  • A design method of a power controller for controlling the temperature adopted in RTP (rapid thermal processing) which uses the phase control method is presented. The power controller is fabricated by using the design method presented in this paper and is tested. As the results, the range of average voltage from the variable output is 0∼198.06 V and the control resolution is 48.356 mV (12 bit) at the range of the input signal (0∼10 V).

  • PDF

Investigation into development of post-processing system to improve geometrical conformity of VLM-$_{ST}$ parts for the detail shape (VLM-$_{ST}$ 제품의 국부형상 정밀도 향상을 위한 후가공 공정개발에 관한 연구)

  • 김효찬;안동규;이상호;양동열
    • Proceedings of the Korean Society of Precision Engineering Conference
    • /
    • 2002.10a
    • /
    • pp.274-278
    • /
    • 2002
  • Surface finishing is still indispensable for most rapid prototyping (RP) processes because of the inherent stair-stepped surface and shrinkage of the parts. These problems can be minimized in the $VLM-_ST$ Process, because it uses expandable polystyrene foam sheets, each of which has a thickness of3.9 mm and a linear-interpolated side slope. The use of thick layers, however, limits the process capability of constructing fine details. This study focuses on the design of post-processing tool for fine details of $VLM-_ST$ parts and investigation of thermal characteristics during EPS foam cutting using the post-processing tool. To calculate the heat flux from the tool into the foam sheet, the tool was modeled as a heat source of radiation for finite element analysis. Results of the analysis agreed well with those of the experiment.

  • PDF

Thermal Deformation Simulation of Boron Steel Square Sheet in Fluid Cooling Process (사각판재 보론강을 사용한 유체냉각공정에서의 열변형 해석)

  • Suh, C.H.;Kwon, T.H.;Jeon, H.W.;Oh, S.K.;Park, C.D.;Choi, H.Y.;Moon, W.S.
    • Transactions of Materials Processing
    • /
    • v.26 no.1
    • /
    • pp.5-10
    • /
    • 2017
  • Fluid cooling is one of the manufacturing processes used to control mechanical properties, and is recently used for hot stamping of automobile parts. The formed part at room temperature is heated and then cooled rapidly using various fluids in order to obtain better mechanical properties. The formed part may undergo excessive thermal deformation during rapid cooling. In order to predict the thermal deformation during fluid cooling, a coupled simulation of different fields is needed. In this study, cooling simulation of boron steel square sheet was performed. Material properties for the simulation were calculated from JMatPro, and three convection heat transfer coefficients such as water, oil and air were obtained from the experiments. It was found that the thermal deformation increased when the difference of cooling rate of sheet face increased, and the thermal deformation increased when the thickness of sheet decreased.

Progess in Fabrication Technologies of Polycrystalline Silicon Thin Film Transistors at Low Temperatures

  • Sameshima, T.
    • 한국정보디스플레이학회:학술대회논문집
    • /
    • 2004.08a
    • /
    • pp.129-134
    • /
    • 2004
  • The development of fabrication processes of polycrystalline-silicon-thin-film transistors (poly-Si TFTs) at low temperatures is reviewed. Rapid crystallization through laser-induced melt-regrowth has an advantage of formation of crystalline silicon films at a low thermal budget. Solid phase crystallization techniques have also been improved for low temperature processing. Passivation of $SiO_2$/Si interface and grain boundaries is important to achieve high carrier transport properties. Oxygen plasma and $H_2O$ vapor heat treatments are proposed for effective reduction of the density of defect states. TFTs with high performance is reported.

  • PDF

An RTP Temperature Control System Based on LQG Design (LQG 설계에 의한 RTP 온도제어 시스템)

  • Song, Tae-Seung;Yoo, Jun
    • Journal of Institute of Control, Robotics and Systems
    • /
    • v.6 no.6
    • /
    • pp.500-505
    • /
    • 2000
  • This paper deals with wafer temperature uniformity control essential in rapid thermal processing (RTP). One of the important control objectives of RTP is to keep the temperature over the wafer surface as uniformly as possible. For this, a discrete time state equation around the operating point is first identified by using the subspace fitting method, and a multivariable LQG(Linear Quadratic Gaussian) controller is designed based on the identified model. Simulation and experimental results show improvement in temperature uniformity over the conventional PID method.

  • PDF

Structural and ferroelectric characteristics of sol-gel $Pb(Zr_{1-x}Ti_x)O_3$ thin films according to the sintering conditions and Zr/Ti mol% (소성 조건과 Zr/Ti 몰비에 따른 졸겔 $Pb(Zr_{1-x}Ti_x)O_3$ 박막의 구조 및 강유전 특성)

  • 김준한;윤현상;박정흠;장낙원;박창엽
    • Electrical & Electronic Materials
    • /
    • v.9 no.8
    • /
    • pp.836-850
    • /
    • 1996
  • In this study, we have analyzed structural analysis and measured ferroelectric characteristics of PZT thin films prepared by sol gel process with different sintering conditions and different Zr/Ti mot%. When the Zr mot% of PZT thin film was increased, it was found that the remanent. polarization and coercive field were decreased and increased, respectively. Also, the maxium dielectric constant of PZT(50/50) thin film was 786.8. We got double hysteresis(anti-fcrroelectric) curve from PbZrO$_{3}$ thin film. As heating rate goes up, pyrochlore phase of PZT thin film was decreased and dielectric and ferroelectric characteristics were improved. As a result of variation of sintering temperature and time 500.deg. C-800.deg. C and 5 sec.-8 hours, respectively, we got optimal sintering temperature and time. The optimium sintering temperature and time of conventional furnace method and rapid thermal processing method were 650.deg. C-700.deg. C for 30-60 minutes and 700.deg. C/20 seconds-2 minutes, respectively.

  • PDF