• 품질경영학회지
• /
• 제51권4호
• /
• pp.633-642
• /
• 2023

Purpose: The variation of the internal diameters of gun barrel incurs a lot of reworks in gun barrel manufacturing process and the significant quality problem of gun barrel. And it is likely to stem from the current measurement system for the internal diameter of gun barrel and the related manufacturing process as well. The purpose of this study is to improve the gun barrel manufacturing process through improving measurement system. Methods: The improved measurement system using laser can measure the internal diameters of gun barrel more accurately, and the properly adjusted honing process reduces the variation of internal diameters of gun barrel. Results: Comparing the mean square error of internal diameters for 6 gun barrels measured before and after process improvement shows that the variation of gun barrel internal diameters was significantly reduced after the process improvement. Conclusion: The introduction of improved measurement system for the internal diameters of gun barrel and the adjustment of related honing process results in the reduction of reworks of gun barrels and their internal diameter variations.

• 한국정보기술학회 영문논문지
• /
• 제8권2호
• /
• pp.59-67
• /
• 2018

The minimum power supply voltage of a typical bandgap current reference (BGCR) is limited by operating temperature and input common mode range (ICMR) of a feedback amplifier. A new BGCR using a bandgap voltage generator (BGVG) is proposed to minimize the effect of temperature, supply voltage, and process variation. The BGVG is designed with proportional to absolute temperature (PTAT) characteristic, and a feedback amplifier is designed with weak-inversion transistors for low voltage operation. It is verified with a $0.18-{\mu}m$ CMOS process with five corners for MOS transistors and three corners for BJTs. The proposed circuit is superior to other reported current references under temperature variation from $-40^{\circ}C$ to $120^{\circ}C$ and power supply variation from 1.2 V to 1.8 V. The total power consumption is $126{\mu}W$ under the conditions that the power supply voltage is 1.2 V, the output current is $10{\mu}A$, and the operating temperature is $20^{\circ}C$.

• 한국전자파학회논문지
• /
• 제13권9호
• /
• pp.882-888
• /
• 2002

본 논문에서는 공정변화와 온도변화에 의한 MMIC의 성능저하를 보상할 수 있는 바이어스 안정화 회로를 제안하였다. 제안된 바이어스 안정화 회로는 기존의 정전류원을 사용하는 바이어스 회로와의 비교를 통하여 그 효과를 검증하였다. 두 구조를 동일한 조건으로 비교하기 위해 하나의 레이아웃에 두 구조를 채택한 증폭기를 동시에 설계 및 제작을 하였다. 공정오차는 세가지 경우 NOM, MIM, MAX로 구분하고 각각에 대해 고주파 특성을 측정하였다. 측정 결과로 정전류원을 가지는 바이어스회로를 채택한 증폭기 의 1.8 GHz에서의 이득변화는 6.4 dB, Ids 변화 7 mA이지만 제안된 바이어스회로를 채택한 증폭기는 이득변화는 2.1 dB, Ids 변화 3 mA로 우수한 특성을 보임을 확인하였다. 따라서, 제안된 바이어스 회로를 적용한 MMIC는 공정상의 변화와 온도 등에 의한 동작점의 변화를 보상하여 고주파특성의 감쇠를 보상할 수 있고 궁극적으로 회로의 수율을 개선할 수 있다. 제작된 회로의 전체크기는 1.2 mm $\times$ 1.4 mm이다.

• 품질경영학회지
• /
• 제24권4호
• /
• pp.90-102
• /
• 1996

Process incapability index which is intended to evaluate the process capability by measuring process incapability provides more detailed information by dividing information about the process mean and variance. But when the target value is not consistent with the center of specification, it is very difficult to evaluate the process capability accurately. Thus it is necessary to improve the existing process incapability index. The improved process incapability index can identify the variation of the process faster than other process capability indices when applied firstly, to the precision process which can be affected sensitively by the change of the process, secondly, to the ordinary process where cost difference from the change of process is noticeable. By using subindices such as inaccuracy index and imprecision index, it is easier for quality manager to find where the cause of the variation of process is, and to take necessary action in advance.

• 한국품질경영학회:학술대회논문집
• /
• 한국품질경영학회 2006년도 추계 학술대회
• /
• pp.211-216
• /
• 2006

Monitoring variability is a vital part of modem statistical process control. The conventional Shewhart Rand S charts address the setting where the in-control process readings have a constant variance. In some settings, however, it is the coefficient of variation, rather than the variance, that should be constant. This paper develops a chart, equivalent to the S chart, for monitoring the coefficient of variation using rational groups of observations.

• JSTS:Journal of Semiconductor Technology and Science
• /
• 제10권4호
• /
• pp.292-299
• /
• 2010

With scaled technology, timing analysis of circuits becomes more and more difficult. In this paper, we review recently developed circuit simulation techniques created to deal with the cost issues of transistor-level simulations. Various techniques for fast SPICE simulations and Monte Carlo simulations are introduced. Moreover, process and aging variation issues are mentioned, along with promising methodologies.

• Journal of the Korean Data and Information Science Society
• /
• 제14권4호
• /
• pp.939-950
• /
• 2003

Control charts are very useful tool for monitoring of process characteristics. This paper discusses the problem of design of control limits when the subgroups are composed by cluster sampling type. As an alternative method of design of control limits XbBar chart is proposed, which uses the control limits based on the variation between subgroups instead of using classical variation within subgroups. Two examples are presented for reasonable design of control limits and conditions of subgroups based on the cluster sampling. Through examples the guidelines for making proper control limits are proposed.

• Communications for Statistical Applications and Methods
• /
• 제7권3호
• /
• pp.773-788
• /
• 2000

Statistical process control (SPC) and engineering process control (EPC) are based on different strategies for processes quality improvement. SPC reduces process variability by detecting and eliminating special causes of process variation. while EPC reduces process variability by adjusting compensatory variables to keep the quality variable close to target. Recently there has been needs for a process control proceduce which combines the tow strategies. This paper considers a combined scheme which simultaneously applies SPC and EPC techniques to reduce the variation of a process. The process model under consideration is an integrated moving average(IMA) process with a step shift. The EPC part of the scheme adjusts the process back to target at every fixed monitoring intervals, which is referred to a repeated adjustment scheme. The SPC part of the scheme uses an exponentially weighted moving average(EWMA) of observed deviation from target to detect special causes. A Markov chain model is developed to relate the scheme's expected cost per unit time to the design parameters of he combined control scheme. The expected cost per unit time is composed of off-target cost, adjustment cost, monitoring cost, and false alarm cost.

• 한국기계가공학회지
• /
• 제10권4호
• /
• pp.50-56
• /
• 2011

Injection molding process is one of the popular manufacturing methods to produce plastic parts with high efficiency and low cost. Ball seat for automobile suspension is made by an injection molding process as a part to support pivot function of ball joint consisted of ball stud and housing. It is necessary for a ball seat to have a dimensional stability in the three dimensional inner area to be contacted with ball stud. In this paper, the dimensional stability of inner surface is indirectly analyzed by checking the difference of inner diameter around the circumferential direction and the thickness variation at the top part of ball seat. Measurement was performed by using the coordinate measuring machine and the fixture to hold ball seat. Optimization of injection molding processes such as injection time, cooling time and temperatures of cylinder barrel was derived to reduce the difference of inner diameter and the thickness variation at the top part of ball seat based on the Taguchi method.

• 한국기계가공학회지
• /
• 제12권2호
• /
• pp.41-48
• /
• 2013

Springback is a very typical dimensional discrepancy phenomenon, which occurs usually on the final stamping parts after the tool loading is removed. Variation of springback leads to amplified variations and problems during assembly of the stamped components, in turn, resulting in quality issues. The variations in the properties of the incoming material and process parameters are the main causes of springback variation. In this research, a robust design methodology which combines orthogonal array based experimental design and design space reduction skim to reduce the springback variation for advanced high strength steel parts in sheet metal forming is suggested. The concept of design space reduction is adapted in the experimental design setup to improve the quality of the obtained solution. The effectiveness of the proposed procedures is illustrated through a robust design of springback in metal forming process of a cross member of auto body.