• 대한전기학회:학술대회논문집
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• 대한전기학회 2011년도 제42회 하계학술대회
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• pp.1382-1383
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• 2011

결정질 실리콘 태양전지에서 전극 형성 공정은 Voc(Open-circuit voltage), Isc(Short-circuit current), Rser(Series resistance), Rshunt(Shunt resistance), FF(Fill factor) 특성에 영향을 주기 때문에 매우 중요하다. 하지만 paste와 선 공정에서의 조건에 따라 특성이 바뀌기 때문에 소성 공정을 최적화하기는 쉽지 않다. 본 연구에서는 Gravure Off-set printing 방식을 이용하여 결정질 실리콘 기판 표면에 미세 전극 형성 공정을 하고 소성 조건 최적화를 위해 peak 온도와 ramp-up 속도를 변화시켜 각 조건별 특성을 비교하였다. Peak 온도가 커질수록, contact resistance의 감소에 따라 Rser가 줄어들었다. 본 연구를 통해 Voc는 619mV, FF는 77.9%로 측정되는 Gravure Off-set 태양전지에 최적화된 소성 공정 조건을 확보하였다.

• 한국인쇄학회지
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• 제8권1호
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• pp.1-20
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• 1990

$\alpha$,$\beta$,$\varepsilon$ type copper phthalocy $\alpha$,$\beta$,$\varepsilon$ type copper phthalocyanine(CuPc) pigment was purified by a simple train sublimation technique. The layered photoconductor was made with $\varepsilon$ type CuPc as a carrier generation layer(CGL) and polyvinly carvazol(PVCz) as a carrier transport layer(CLT). A CGL of CuPc was electrochemical deposited on an Al substrate used as cathode in pigment dispersion solutions. a CTL of PVCz pwas spin coated on $\varepsilon$ type CuPc thin film by a spin coater. The effect of sonication time, electrophotographic property of the layered photoconductor were studied with surface coverage, surface potential and sensitivity.

• 한국인쇄학회지
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• 제26권1호
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• pp.73-85
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• 2008

We have manufactured a photoresist which has excellent dispersity and good applying property due to 330cps of viscosity for environment-friendly and economical maskless screen plate making. And the photoresist applied on the screen stretched was exposed without mask by beam projector with CRT light source. Then it was developed by air spray with $1.7kgf/cm^2$ of injection pressure. The pencil hardness and solvent resistance of curing photoresist film were worse than those of conventional photoresist film and the maximum resolution of line image formed by maskless screen plate making was 0.5 mm since the exposure system for maskless plate making has weak light intensity and the diffusion of light. But we could obtain maskless screen plate which has sharp edges of line image and confirm a possibility of dry development process by air spray method.

• Fibers and Polymers
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• 제6권2호
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• pp.174-179
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• 2005

The present paper studies the effect of chitosan, cationic starch and polyvinyl alcohol (PVA) as sizing agents to enhance surface properties of kenaf paper. The polymers were incorporated into the sheets by spray application. The results clearly showed that the addition of chitosan to a sheet formed from beaten fibers had excellent improvement in surface properties, compared to the effect of other additives. Sizing quality of cationic starch fairly matched with the sizing quality of chitosan, however, it was able to reduce the water absorption potential of paper more than chitosan at a same concentration. In most other properties, particularly the most important property for printing papers, surface smoothness, chitosan-sized papers are superior to the paper sized with cationic starch or PVA.

• Journal of Information Display
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• 제8권2호
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• pp.5-9
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• 2007

We demonstrate novel soft-lithographic techniques for preparing patterned liquid crystal (LC) orientations at an alignment layer. By controlling patterning conditions such as wetting property and operating temperature depending on polymeric materials, multi-directional or modified LC alignment conditions can be simply achieved.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2003년도 하계학술대회 논문집 C
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• pp.1529-1531
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• 2003

Thick film mechanical sensors can be categorized into four main areas piezoresistive, piezoelectric, piezocapastive and mechanic tube. In this areas, the thick film strain gage is the earliest example of a primary sensing element based on the substrates. The latest thick film sensor is used various pastes that have been specifically developed for pressure sensor application. The screen printing technique has been used to fabricate the pressure sensors on alumina substrate($Al_2O_3$). Thick film capacitive of strain sensing characteristics are reported and dielectric paste based on (Ti+Ba) materials. The electric property of dielectric paste has been studied and exhibit good properly with good gage factor comparable to piezoresistive strain gage. New piezocapacitive strain sensor was designed and tested. The output of capacitive value was good characteristics.

• 한국인쇄학회지
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• 제18권2호
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• pp.13-27
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• 2000

The UV curing industry is one of the most wide application fields in the coating and printing inks industry. Applications extend to general coating for paper, board, wood tapes, compact discs and holograms, ink, photoresists for imaging processes and adhesives for welding and sealing in circuit boards. The UV-curing resins have advantages of quick set, space saving, clean environment and efficient use of energy. The purpose of this study has been to control of morphology structures consist of UV-curing resins and alkyd resins. Therefore, we are investigated with regard to rheology properties on the exposure to UV-curing, structures and mechanical properties for curing films.

• 한국콘텐츠학회:학술대회논문집
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• 한국콘텐츠학회 2019년도 춘계종합학술대회
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• pp.371-372
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• 2019

금속 3D 프린팅의 응용분야는 자동차, 우주항공, 의료/헬스, 전자기기, 금형 등으로 분류할 수 있다. 최근 들어 선진국을 중심으로 아크 용접기반 금속 3D 프린팅 기술의 연구개발이 활발히 진행되고 있다. 3D 프린팅 기술은 CAD 설계 정보를 이용한 적층 제조방식이기 때문에 내부 형상이 아무리 복잡하여도 제작이 가능하고, 디자인이 변경되더라도 별도의 금형 제작 없이 제작이 가능하다는 장점이 있다. 와이어 아크기반 금속 3D 프린팅 기술은 차세대 생산제조 핵심기술로 발전할 전망이다. 금속 3D 프린터의 기술경쟁력 제고를 위해서 적층패턴, 와이어정밀 송급 및 적층품질 실시간 모니터링 등의 시스템 제어 기술과 대형 금속부품의 고생산성을 위한 적층가공 시스템 기술개발이 진행될 것으로 예상된다. 금속 와이어 아크를 이용한 대형 3D 프린팅 시스템의 지식재산권 확보 전략을 수립하기 위해 대형 3D 프린터 기술, 금속 와이어 3D 프린터 기술, 아크 3D 프린터 기술의 세 가지 분야에 대한 특허동향 분석을 수행하였다.

• 마이크로전자및패키징학회지
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• 제25권3호
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• pp.13-19
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• 2018

본 연구에서는 태양광 접속함 모듈 적용을 위한 유연 솔더(Sn-Pb) 및 무연 솔더(Sn-3.0Ag-0.5Cu 및 Sn-1.0Ag-0.7Cu-1.6Bi-0.2In)의 특성을 비교 평가하였다. 접속함 내에는 전압 및 전류 검출용 모듈, 고내압용 다이오드가 실장된 정류모듈 등 다양한 모듈이 내장되어있다. 본 연구에서는 솔더링특성, 인쇄성, 솔더형상 검사, X-ray를 이용한 솔더 내 void 검사 및 접합강도를 측정하였고, 무연 솔더 합금의 공정최적화는 step 1과 step 2로 구분하여 검토를 실시하였다. Step 1은 유연 솔더와 무연 솔더 페이스트 인쇄 검사 시험을 1차와 2차로 나누어 실험을 진행하였고 printability는 void 함량 및 접합강도의 상관관계로 검토하였다. 전체적으로 유연 솔더의 특성은 무연 솔더에 비하여 상대적으로 우수하였다. Step 2는 리플로우 공정의 최고점 온도 변화에 따른 접합부 특성 변화를 관찰하였다. 리플로우 최고 온도가 증가할수록 접합부 내의 void 함량이 2~4% 정도 감소하였고, 접합강도는 약 0.5 kgf 범위내에서 큰 차이 없이 나타났다. 기판 표면처리종류에 있어서는 ENIG 표면처리가 OSP 및 Pb-free 솔더 표면처리보다 우수한 접합강도를 나타내었다. 1종류의 무연솔더와 OSP 표면처리로 접합된 태양광 접속함 모듈의 500 싸이클 열충격 신뢰성시험 전후에 전기적 특성변화는 0.3% 내의 범위에서 안정적으로 작동함을 확인하였다.

• 한국의류학회지
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• 제42권4호
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• pp.612-625
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• 2018

This study designed 16 kinds of basic structure and 4 kinds of modified structure for impact protection pads with a spacer fabric shape. The pad is a structure in which hexagonal three-dimensional units, composed of a surface layer and a spacer layer, are interconnected. Designed pads were printed with flexible $NinjaFlex^{(R)}$ materials using a FDM 3D printer. The printed pads were evaluated for impact protection performance, compression properties and sensory properties. The evaluation of the impact protection performance indicated that basic structures better than CR foam material at 20cm height were DV1.5, DX1.5, DX1.0, DV1.0 and HV1.5. The evaluation of the compression properties for the five types, with good results in the impact protection performance, indicated that DV1.0, DX1.0, DV1.5, HV1.5 and DX1.5 showed good results, respectively. The sensory evaluation of DV1.0, DX1.0, and DV1.5, which with good results when considering both the impact protection performance and the compression performance, showed that DV1.0 were the best for surface, flexibility, compression and weight. Therefore, DV1.0 is shown to be the best structure for protection pads.