• Journal of the Korea institute for structural maintenance and inspection
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• v.24 no.2
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• pp.103-110
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• 2020

This study examined the applicability of the vacuum impregnation post-processing to enhance the strength of binder jet 3D printed output. In addition, permeability, bulk density, and compressive strength of 10 mm, 20 mm, 30 mm, and 40 mm cubic specimens were examined to check the strength limit depending on the 3D prined output size. In result, as the maximum pressure increased, the post-processing storage solution permeated to the inside of the 3D printed sample and thus the permeation area ratio was improved. The compressive strength and the permeation area indicate the correlation between the exponential function of the adjusted R-square factor 0.992. In addition, the bulk density was increased, which can be inferred as the post-processing solution permeated to the inside. In conclusion, in order to enhance the compressive strength of the binder jet 3D printed output, it is essential to permeate the post-processing solution to the inside of the output, and vacuum impregnation can be proposed as an effective method.

• Resources Recycling
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• v.14 no.5 s.67
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• pp.45-53
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• 2005

Electro-generated chlorine leaching of waste printed circuit boards was investigated in hydrochloric acid solutions. Non-magnetic component of $0.6{\sim}1.2mm$ was prepared by grinding, magnetic separation, and sieving. The non-magnetic component of pulverized printed circuit board contained about 45% of metal component, in which copper was about 83.6%. The leaching rate of copper was greatly affected by current density and agitation speed. The leaching of copper up to 98% was achieved at $20mA/cm^2$, $50^{\circ}C$, 180 minutes, and 600 rpm in 1M HCl solutions. Increasing agitation and lowering current density enhanced utilization efficiency of electro-generated chlorine. Leaching of copper was suppressed at the initial stage, while the minor metal elements, such as aluminum, lead, and tin, were dominantly leached out.

• Journal of the Institute of Electronics Engineers of Korea TE
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• v.42 no.4
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• pp.1-6
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• 2005

Recently embedded passive technology which fabricate passive elements such as resistors and capacitors at the inner layer of PCB(Printed Circuit Board) is used to make high performance IT products. However, embedded capacitor has limit in full range circuit applications because of the low capacitance density. In this paper, a new embedded capacitor which has wrinkled electrodes and dielectric layer was proposed to overcome the limits. FEM(Finite Elements Method) technique was used to evaluate capacitance density of the wrinkled type embedded capacitor. Capacitance density of the wrinkled type embedded capacitor is larger than that of conventional planar type embedded capacitor by about 25.6%$\sim$39.6%. In case of thin film type embedded capacitor, proposed wrinkled structure has more enhanced effect on the capacitance density.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.4
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• pp.83-89
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• 2015

In this paper, we propose a fabrication technique for enhanced electrical properties of piezoelectric thick films with excellent patterning property using sol-infiltration and a direct-patterning process. To achieve the needs of high-density and direct-patterning at a low sintering temperature (< $850^{\circ}C$), a photosensitive lead zirconate titanate (PZT) solution was infiltrated into a screen-printed thick film. The direct-patterned PZT films were clearly formed on a locally screen-printed thick film, using a photomask and UV light. Because UV light is scattered in the screen-printed thick film of a porous powder-based structure, there are needs to optimize the photosensitive PZT sol infiltration process for obtaining the enhanced properties of PZT thick film. By optimizing the concentration of the photosensitive PZT sol, UV irradiation time, and solvent developing time, the hybrid films prepared with 0.35 M of PZT sol, 4 min of UV irradiation and 15 sec solvent developing time, showed a very dense with a large grain size at a low sintering temperature of $800^{\circ}C$. It also illustrated enhanced electrical properties (remnant polarization, $P_r$, and coercive field, $E_c$). The $P_r$ value was over four times higher than those of the screen-printed films. These films integrated on silicon wafer substrate could give a potential of applications in micro-sensors and -actuators.

• Journal of the Korean Institute of Educational Facilities
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• v.17 no.6
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• pp.23-30
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• 2010

Because the effort to solve space shortage in academic libraries has never been successful, the rapid development of digital technology is being considered as a panacea to revolutionize analog libraries and to open a new era for digital libraries. However, this technology is yet to be perfected. Even with the use of digital technology, we are currently still looking for more space to accommodate newly printed materials and at the same time store valuable resources that are seldomly used. In 1985, Harvard adopted the industrial high-density shelving system into their library. No other retrieving system has proven to be more successful as the Harvard model. Presently, more than 50 colleges have built over 70 high-density library storage facilities. Rice University Library Service Center (RLSC) can be examined as an example of the Harvard-model. This paper will focus on assessing the operating system and architectural requirements of the RLSC which may allow for a more efficient, economical, and fundamental resolution to the library space shortage problem.

• Journal of the Korean Society of Clothing and Textiles
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• v.46 no.3
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• pp.481-493
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• 2022

This study investigated process conditions for 3D printing through manufacturing thermoplastic polyurethane (TPU) samples under different infill conditions. Samples were prepared using a fused deposition modeling 3D printer and TPU filament. 12 infill patterns were set (2D: grid, lines, zigzag; 3D: triangles, cubic, cubic subdivision, octet, quarter cubic; 3DF: concentric, cross 3D, cross, honeycomb), with 3 infill densities (20%, 50%, 80%). Morphology, actual time/weight and compressive properties were analyzed. In morphology: it was found that, as infill density increased, the increase rate of the number of units rose for 2D and fell for 3DF. Printing time varied with the number of nozzle movements. In the 3DF case, the number of nozzle movements increased rapidly with infill density. Sample weight increased similarly. However, where the increase rate of the number of units was low, sample weight was also low. In compressive properties: compressive stress increased with infill density and stress was high for the patterns with layers of the same shape.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.34 no.1
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• pp.30-36
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• 2002

The objective of this study was to investigate the viscosity of coating colors and ink-jet printing properties with different coating colors with various blending ratios of silica based pigments. The volume of pigments was measured to evaluate the effect of the pigments on the viscosity of coating colors. Contact angle, the change of ink diameter, optical density, and the area and perimeter of a printed let-ter were evaluated to examine the effect of the ink absorption on the ink-jet printing properties. Generally, as the amount of silica pigments Increased the ink-jet printing quality improved. But this caused an increase of the overall coating viscosity.

• Journal of the Korean Graphic Arts Communication Society
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• v.23 no.2
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• pp.25-43
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• 2005

Generally, machine calendering are used change of paper surface properties. During machine calendering, dry paper passes between the rolls under pressure, thereby improving the surface smoothness and gloss. These improvements make the paper better suited for printing and decreasing problems during the printing, such as delayed dry and set-off. Then we investigated newspaper properties by the changing of machine calendering condition, and relationship printability. Properties of each samples were examined in accordance with KS and TAPPI standard test method i.e, basic weight, bulk density, thickness, porosity, opacity, brightness, smoothness and roughness. IGT printability tester was used to obtain ink requirement of newspaper, printed density and set-off. Results of in this study, we have proposed the optimizes range of newspaper calendering condition. Useful optimize calendering condition was pressure 55 kN/m, temperature $130^{\circ}C$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.10-10
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• 2008

Flip chip technology is keeping pace with the increasing connection density of the ICs and is capable of transferring semiconductor performance to the printed circuit board. One of the most general flip chip technology is CPB technology presented by Intel. The CPTB technology has similar benefits with CPB but has simpler process and better reliability characteristics. In this paper, process sequence and structure of CPTB are presented.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.3.2-3.2
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• 2011

In recent years, inkjet printing technology has received significant attention as a micro/nanofabrication technique for flexible printing of electronic circuits and solar cells, as well for biomaterial patterning. It eliminates the need for physical masks, causes fewer environment problems, lowers fabrication costs, and offers good layer-to-layer registration. To fulfill the requirements for use in the above applications, however, the inkjet system must meet certain criteria such as high frequency jetting, uniform droplet size, high density nozzle array, etc. Existing inkjet devices are either based on thermal bubbles or piezoelectric pumping; they have several drawbacks for flexible printing. For instance, thermal bubble jetting has limitations in terms of size and density of the nozzle array as well as the ejection frequency. Piezoelectric based devices suffer from poor pumping energy in addition to inadequate ejection frequency. Recently, an electrohydrodynamic (EHD) printing technique has been suggested and proposed as an alternative to thermal bubble or piezoelectric devices. In EHD jetting, a liquid (ink) is pumped through a nozzle and a strong electric field is applied between the nozzle and an extractor plate, which induce charges at the surfaces of the liquid meniscus. This electric field creates an electric stress that stretches the meniscus in the direction of the electric field. Once the electric field force is larger than the surface tension force, a liquid droplet is formed. An EHD inkjet head can produce droplets smaller than the size of the nozzle that produce them. Furthermore, the EHD nano-inkjet can eject high viscosity liquid through the nozzle forming tiny structures. These unique features distinguish EHD printing from conventional methods for sub-micron resolution printing. In this presentation, I will introduce the recent research results regarding the EHD nano-inkjet and the printing system, which has been applied to solar cell or thin film transistor applications.