• Journal of the Korean Graphic Arts Communication Society
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• v.12 no.1
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• pp.1.2-15
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• 1994

This is the study which appear the relation between the situation of Anchor point and the qualities of lithographic prints using the uncoated paper. Anchor point were measured by microscopic photography and Kubelka-munk`s method. The situation of Anchor point increased with print density and print though, but it decreased with evenness and rub off. In case of commercial uncoated paper, the situation of Anchor point was optimized when it was 25~35% apporoximately. In preparation of samples for microscopic photography, the samples were used by the resin testing methods. This method used that the resin fixes the printed papers of sample very hard, in preparation of samples for microscopica potography a good result could be gained by this method.

• Journal of Electrical Engineering and Technology
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• v.10 no.5
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• pp.2001-2008
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• 2015

This paper proposes the concept of FlexPCB(flexible Printed Circuit Board) conductive structure for electrodynamic bearings. It has three main advantages: easy “printing” of considerably thin conductive wires, resulting in potential reduction in stray eddy currents; realization of specific conductive configurations with high precision to optimize the eddy current flowing; simplicity in being wound to cylinders or hollow cylinders of different diameters. To verify this new concept, the FlexPCB conductive structure was manufactured, an axial electrodynamic bearing test rig was built and the conductive structure's induced voltage was measured along the axial displacements from 0mm to 56mm at three rotating speeds. The finite element method was used to calcuatlate the flux density of electrodynamic bearing and induced voltage of the FlexPCB conductive structure. The experimental results are compared with the results from the FEM calculation. It is concluded that the measured and calculated induced voltages have consistency in the middle part of the bearing.

• Journal of IKEEE
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• v.20 no.4
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• pp.416-419
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• 2016

When the integration density and operating frequency increase in the electronic circuits, it is important to improve the signal transmission characteristics. In this paper, the signal transmission characteristics of the printed circuit boards are analyzed with the curvature of the pads. From the simulation results, signal transmission characteristics are improved when pad curvature increases. Pad curvature more effects on signal transmission characteristics when the thickness of the transmission line and the length of the transmission decrease.

• 유체기계공업학회:학술대회논문집
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• 2006.08a
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• pp.561-564
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• 2006

Because of new requirements related to the employment of SMT(Surface Mounting Technology) manufacturing and the diversity of components on high density PCB(printed circuit boards), Thermal control of the reflow process is required in oder to achieve acceptable yields and reliability of SMT assemblies. Accurate control of the temperature distribution during the reflow process is one of the major requirements, especially in lead-free assembly. This study has been performed for reflow process using the commercial CFD tool(Fluent) for predicting flow and temperature distributions. There was flow recirculation region that had a weak point in the temperature uniformity. Porous plate was installed to prevent and minimize flow recirculation region for acquiring uniform temperature in oven. This paper provided design concept from CFD results of the steady state temperature distribution and flow field inside a reflow oven.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2001.04a
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• pp.275-280
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• 2001

Recently, the trends of industrial products grow more miniaturization, variety and mass production. Micro drilling which take high precision in cutting work is requested more micro hole and high speed working. Especially, Micro deep hole drilling is becoming more important in a wide spectrum of precision production industries, ranging from the production of automotive fuel injection nozzle, watch and camera parts, medical needles, and thick multi-layered Printed Circuit Boards(PCB) that are demanded for very high density electric circuitry. This paper shows the tool monitoring results of micro drill with tool dynamometer. And additionally, microscope with built-in monitor inspection show the relationship between burr in workpiece and chip form of micro drill machining.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.34 no.2
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• pp.22-31
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• 2002

In this paper, PVA(polyvinylalcohol), oxidized starch and SBR latex were used as binders for ink-jet printing papers, and their effects of the type and blending ratio of binders on ink-jet printing properties were compared. In case of coating color using PVA mainly used for a binder in ink-jet printing, spreading of printed letters decreased and excellent images were manifested resulting from strong hydrophilic of PVA. However, increasing solids content of coating color was somewhat limited because of the interaction of PVA and functional groups in silica as well as high molecular weight of PVA. When oxidized starch and SBR latex were mixed with PVA at desirable ratio to solve these problems, runnability in coating process was improved and good printing properties were shown. Gloss was improved when latex was used along with PVA as a binder because of the thermoplastic property of the latex. From this result, possibilities of high solids content and high gloss ink-jet printing papers were investigated.

• Journal of the Korean Institute of Telematics and Electronics C
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• v.35C no.7
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• pp.20-29
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• 1998

As the packing density of ICs in recent submicron IC design increases, interconnects gain importance. Because interconnects directly affect on two major components of circuit performance, power dissipation and operating speed, circuit engineers are concerned with the optimal design of interconnects and the aid tool to design them. When circuit models of interconnects are given (including geometry and material information), the analysis process for the given structure is not an easy task, but conversely, it is much more difficult to design an interconnect structure with given circuit characteristics. This paper focuses on the latter process that has not been foucsed on much till now due to the complexity of the problem, and prsents a design aid tool(DATOIS) to synthesize interconnects. this tool stroes the circuit performance parameters for normalized interconnect geometries, and has two oeprational modes:analysis mode and synthesis mode. In the analysis mode, circuit performance parameters are obtained by searching the internal database for a given geometry and interpolates results if necessary . In thesynthesis mode, when a given circuit performance parameter satisfies a set of geometry condition in the database, those geometry structures are printed out.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.04b
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• pp.73-76
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• 2009

ZnBo이 첨가된 (Ba,Sr)$TiO_3$ 후막을 이용한 planner capacitor의 전기적 특성을 조사하였다. 후막은 알루미나 기판에 스크린 프린팅기법에 의해서 제작되었고 $1200^{\circ}C$의 온도에서 소결하였다. 출발 물질인 BST의 저온 소결을 위해서 ZnBO를 첨가하였다. ZnBO가 1, 3, 5 wt% 첨가된 경우 소결온도가 $1200^{\circ}C$의 낮은 온도에서 소결되는 것을 확인했으며 ZnBO의 첨가랑이 증가함에 따라서 유전율은 감소하고 유전손실는 증가 하는 현상이 나타났다. 1, 3, 5 wt%의 ZnBO가 첨가된 (Ba,Sr)$TiO_3$는 각각 756, 624, 554의 유전율를 보였다. 또한 ZnBO의 양이 증가함에 따라서 누설전류가 감소되는 것을 확인하였고, ZnBO의 첨가가 grain의 성장과 density가 증가되어 누설전류의 양이 감소하게 되는 것으로 분석되었다.

• Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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• 2008.05a
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• pp.21-24
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• 2008

Properties of carbon nano fiber (CNF) as field emitters were described. Carbon nano fiber (CNF) of herringbone was prepared by thermal chemical vapor deposition(CVD). Field emitters mixed with organic binders, conductive materials and were prepared by screen-printing process. In order to increase field emissions, the surface treatment of rubbing & peel-off was applied to the printed CNF emitters on cathode electrode. The measurements of field emission properties were carried out by using a diode structure inline vacuum chamber. CNF of herringbone type showed good emission properties that a turn on field was as low as 2.1 $V/{\mu}m$ and current density was as large as 0.15 $mA/cm^2$ of 4.2 $V/{\mu}m$ with electric field. Through the results. we propose that CNFs are suitable for application of electron emitters in Field Emission Devices.

• Journal of Power Electronics
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• v.9 no.2
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• pp.308-319
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• 2009

An increasing number of power electronic applications require high power density. Therefore, the switching frequency and switching speed have to be raised considerably. However, the very fast switching transients induce a strong voltage and current ringing. In this work, a novel damping concept is introduced where the parasitic wiring inductances are advantageously magnetically coupled with a damping layer for attenuating these unwanted oscillations. The proposed damping layer can be implemented using standard materials and printed circuit board manufacturing processes. The system behavior is analyzed in detail and design guidelines for a damping layer with optimized RC termination network are given. The effectiveness of the introduced layer is determined by layout parasitics which are calculated by application of the Partial Element Equivalent Circuit (PEEC) simulation method. Finally, simulations and measurements on a laboratory prototype demonstrate the good performance of the proposed damping approach.