• 한국표면공학회지
• /
• 제32권3호
• /
• pp.289-296
• /
• 1999

The integration of the LSI has been greatly improved and the circuit patters on the LSI are becoming finer line and pitch. The high-density electronic packaging technology is improved. In order to realize the high-density packaging technology, the density of the circuit wiring of the printed circuit boards have also been more dense. The build-up process multilayer printed circuit board technology have a lot of vias, possibilities of the finer conductor wirings and have a freedom of capabilities of wiring design. The build-up process printed circuit boards have the wiring rules which are the pattern width: $100-20\mu\textrm{m}$, the via hole diameter: $100-50\mu\textrm{m}$. There three kinds of build-up processes as far materials and hole drilling. In this paper, the recent technology trends of the build-up printed circuit board technologies are described.

• 한국정밀공학회지
• /
• 제17권2호
• /
• pp.130-136
• /
• 2000

Generally, the build-up printed circuit board manufactured by the sequential process with etching, plating, drilling etc. requires many types of equipments and lead time. Etching process is suitable for mass production, however, it is not adequate for manufacturing prototype in the developing stage. In this study, we introduce a screen printing technology to prototyping a build-up printed circuit board. As for the material, photo/thermal curable resin and conductive paste are used for the formation of dielectric and conductor. The build-up structure is made by subsequent processes such as the formation of liquid resin thin layer, the solidification by UV/IR light, and via filling with conductive paste. By use of photo curable resin, productivity is greatly enhanced compared with thermal curable resin. Finally, the basic concept and the possibility of build-up printed circuit board prototyping are proposed in comparison with to the conventional process.

• 대한전자공학회논문지SD
• /
• 제48권2호
• /
• pp.67-72
• /
• 2011

삼중대역(2.3/2.5/3.5GHz) m-WiMAX 시스템의 제작을 위한 8층의 인쇄회로기판을 제작하였다. 고주파 동작시에도 우수한 성능을 확보하기 위하여 저유전율을 사용한 인쇄회로기판을 제작하였다. 또한 시스템 전체의 크기를 축소하기 위하여 수동소자를 삽입시킨 임베디드 인쇄회로기판을 제작하였다. 그 결과 시스템 면적의 9%를 줄일 수 있었다. 제작된 인쇄회로기판을 사용하여 삼중대역 m-WiMAX 시스템이 제작되었으며, 인터넷 연결 테스트를 성공적으로 수행하였다. 개발된 임베디드 인쇄회로기판은 시스템의 면적 축소와 저신호 손실 RF 통신 시스템에 효과적인 대응을 가능하게 할 것이다.

• 자원리싸이클링
• /
• 제19권1호
• /
• pp.57-65
• /
• 2010

최근, 인쇄회로기판 제조공정으로부터 유가자원을 회수하고자 하는 연구가 활발히 진행되고 있다. 인쇄회로기판의 드릴가공 받침대로 사용한 후 폐기되는 백보드 소재활용과 소형화, 고 신뢰성화에 따른 유가금속인 금 회수가 필수적이다. 특히 이동통신용 전자부품의 핵심소재로 사용되는 인쇄회로기판부품에는 최소 0.03 ${\mu}m$에서부터 최대 50 ${\mu}m$ 두께로 금이 도금되어 있다. 금, 원자재, 약품 값 폭등으로 생산현장의 유가자원 활용이 중요한 과제로 대두되면서 유가자원 활용을 위한 경쟁이 가속화되는 추세다. 본고에서는 인쇄회로기판 제조공정에서 발생하는 폐백보드 및 금의 회수에 대한 기술동향을 제공함으로써 유가자원 활용 산업발전에 기여하고자 하였다.

• International Journal of Precision Engineering and Manufacturing
• /
• 제4권4호
• /
• pp.51-56
• /
• 2003

Generally, the build-up printed circuit board manufactured by a sequential process involving etching, plating, drilling, etc, which requires many types of equipments and long lead time. Etching process is suitable for mass production, however, it is not adequate for manufacturing a prototype in the development stage. In this study, we introduce a screen printing technology for prototyping a build-up printed circuit board. As for the material, photo/thermal curable resin and conductive paste are used for the formation of dielectric and conductor. The build-up structure is made by subsequent processes such as formation of a liquid resin thin layer, solidification by a UV/IR light, and via hole filling with a conductive paste. By use of photo curable resin, productivity is greatly enhanced compared with thermal curable resin. Finally, the basic concept and the possibility of build-up printed circuit board prototyping are proposed in comparison with the conventional process.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2007년도 춘계학술대회 논문집
• /
• pp.695-696
• /
• 2007

• 한국정밀공학회지
• /
• 제24권5호
• /
• pp.89-96
• /
• 2007

Inkjet printing has become one of the most attractive manufacturing techniques in industry. Especially inkjet printing technology will soon be part of the PCB (Printed Circuit Board) fabrication processes. Traditional printing on PCB includes screen printing and photolithography. These technologies involve high costs, time-consuming procedures and several process steps. However, by inkjet technology manufacturing time and production costs can be reduced, and procedures can be more efficient. PCB manufacturers therefore willingly accept this inkjet technology to the PCB industry, and are quickly shifting from conventional to inkjet printing. To produce the printed circuit board by the inkjet technology, it must be harmonized with conductive nano ink, printing process, system, and inkjet printhead. In this study, micro patterning of conductive line has been investigated using the piezoelectric printhead driven by a bipolar voltage signal is used to dispense 20-40 ${\mu}m$ diameter droplets and silver nano ink which consists of 1 to 50 nm silver particles that are homogeneously suspended in an organic carrier. To fabricate a conductive line used in PCB with high precision, a printed line width was calculated and compared with printing results.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2012년도 춘계학술대회 논문집
• /
• pp.873-874
• /
• 2012

• 한국경영과학회:학술대회논문집
• /
• 대한산업공학회/한국경영과학회 1992년도 춘계공동학술대회 발표논문 및 초록집; 울산대학교, 울산; 01월 02일 May 1992
• /
• pp.159-168
• /
• 1992

생산라인의 line balancing이 흐름생산에 있어서 일관된 생산을 하기 위한 필수조건이다. 여러 다양한 제품을 생산하는 printed circuit board(PCB) 공장에서의 line balancing을 얻기 위해서는 mixed model line balancing절차를 설명하고자 한다.

• Bulletin of the Korean Chemical Society
• /
• 제33권6호
• /
• pp.1967-1971
• /
• 2012

A hexavalent chromium (Cr (VI)) is one of the hazardous substances regulated by the RoHS. The determination of Cr (VI) in various polymers and printed circuit board (PCB) has been very important. In this study, the three different analytical methods were investigated for the determination of a hexavalent chromium in Acrylonitrile Butadiene Styrene copolymer (ABS) and PCB. The results by three analytical methods were obtained and compared. An analytical method by UV-Visible spectrometer has been generally used for the determination of Cr (VI) in a sample, but a hexavalent chromium should complex with diphenylcarbazide for the detection in the method. The complexation did make an adverse effect on the quantitative analysis of Cr (VI) in ABS. The analytical method using diphenylcarbazide was also not applicable to printed circuit board (PCB) because PCB contained lots of irons. The irons interfered with the analysis of hexavalent chromium because those also could complex with diphenylcarbazide. In this study, hexavalent chromiums in PCB have been separated by ion chromatography (IC), then directly and selectively detected by inductively coupled plasma atomic emission spectrometry (ICP-AES). The quantity of Cr (VI) in PCB was 0.1 mg/kg.