• Title/Summary/Keyword: presureless sintering

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The Effect of Sintering Condition On Tribological Behavior in the Cu-Base Sintered Friction Materials (동계 소결마찰재의 소결조건에 따른 마찰특성 고찰)

  • 김상호;김기열;정진현;이범주;정동윤
    • Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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    • 1997.04a
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    • pp.53-61
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    • 1997
  • The effect of sintering condition on tribological behavior in the Cu-base sintered friction materials was studied through pin-on-disk type wear tester. Especially, the experiment was focused on making a comparative study between presstwed sintering and pressureless sintering. Pressureless sintering process showes more stable friction coefficient and lower wear rate than pressure sintering process. This result is related to pore size and density of pore in the sintered materials.

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Tribological Properties of Clay Bonded SiC (점토 결합 SiC 소결체의 마찰 마모 특성)

  • 한상준;이경희;이재한;김홍기
    • Journal of the Korean Ceramic Society
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    • v.32 no.9
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    • pp.1027-1032
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    • 1995
  • SiC had been widely applied for mechanical sealing as a sealing material. SiC sintering is commonly made of reaction sintering, presureless sintering, and hot isostatic pressing (HIP) sintering. In this investigation, however, clay bonded sintering was used to avoide any complications of the special sintering methods as mentioned above. In order to prevent harmful SiC oxidation in the clay bonded sintering, clay and frit were used to form the SiC oxidation protecting layer and graphite was added to provide high solid lubricity. As a result, the material with 6% clay (clay 5.4% and frit 0.6%) and 2~4% graphite (45 mesh) sintered at 140$0^{\circ}C$ for 3 hours, showed the following physical properties; porosity 6%, static friction coefficient 0.15, kinematic coefficient 0.1,. and specific wear rate 4.8$\times$10-8 $\textrm{mm}^2$kgf-1. On the other hand, the flexural strength was 900kgf/$\textrm{cm}^2$. This tribological characteristic properties were similar to those of the reaction sintered SiC except the flexural strength.

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