• Journal of the Korean Wood Science and Technology
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• v.35 no.5
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• pp.7-15
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• 2007

To evaluate the durability of finger-jointed woods according to change of humidity conditions, four types of finger-jointed woods glued with different kinds of adhesives and finger pitches were made with Sitka spruce, and the effect of humidity conditions on creep performances was investigated. The shape of creep curves differed among humidity conditions, and the inclination of creep curves was greatest in 85%RH, and lowest in 65%RH. Their creep curves showed a linear behavior beyond approximately one hour, regardless of humidity conditions. The A values of the creep curves fitted to power law increased with increasing relative humidity, whereas the A' values were in order of 30 > 85 > 65%RH unlike the A values. The initial deformation increased with increasing relative humidity, whereas the creep deformation unlike the initial deformation was in order of 85 > 30 > 65%RH, and it was found that the creep deformation of finger-jointed woods indicated the smaller amount in air-dry moisture content rather than in a low moisture content less than 30%RH. Finger-jointed woods with 6.8 mm (L) pitch had the greater creep amount than in those with 4.4 mm (S) pitch in all humidity conditions. The difference of creep amount between both adhesives in all humidity conditions was small. Relative creep at 240 hr was greatest as 62.2~71.9% in 85%RH, and the values indicated 2.1~2.6 times that of 30%RH and 3.0~3.6 times that of 65%RH and were equal or slightly greater than that of solid spruce.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.3
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• pp.29-35
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• 2003

The Sn-based lead-free solders with varying microstructure were prepared by changing the cooling rate from the melt. Bulky as-cast SnAg, SnAgCu, and SnCu, alloys were cold rolled and thermally stabilized before the creep tests so that there would be very small amount of microstructural change during creep (TS), and thin specimens were water quenched from the melt (WQ) to simulate microstructures of the as-reflowed solders in flip chips. Cooling rates of the WQ specimens were 140∼150 K/sec, and the resultant $\beta-Sn$ globule size was 5∼10 times smaller than that of the TS specimens. Subsequent creep tests showed that the minimum strain rate of TS specimens was about $10_2$ times higher than that of the WQ specimens. Fractographic analyses showed that creep rupture of the TS-SnAgCu specimens occurred by the nucleation of voids on the $Ag_3Sn$ Sn or $Cu_6Sn_5$ particles in the matrix, their subsequent growth by the power-law creep, and inter-linkage of microcracks to form macrocracks which led to the fast failure. On the other hand, no creep voids were found in the WQ specimens due to the mode III shear rupture coming from the thin specimens geometry.

• Journal of the Korean Society of Safety
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• v.14 no.1
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• pp.208-215
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• 1999

The creep behavior of a rapidly solidified and consolidated Al-9.45wt%Fe-4.45wt%Cr alloy were investigated in the stress range 40 to 115 MPa and temperature range 300(0.53Tm) to 441$^{\circ}C$(0.66Tm). It is of use to available aerospace and automobile industries for the improved performance of materials used at high temperature. Because Al alloys with improved creep resistance offer the potential for lower weight and reduced costs in aerospace and automobile components (e.g., structural members and engine parts) through the replacement of heavier and more costly materials, the safety in use at high temperature is good. The alloy is characterized by high stress exponents and activation energies for creep, which are greatly dependent on the stress and temperature. Because the creep stress is seen to cause a strongly significant enhancement of coarsening, the coarsening rate of the dispersed particles in all crept specimens is faster than that in isothermally annealed specimens. Dislocations connecting dispersoids are observed more cofrequently in crept specimens with higher stress and lower temperature. The creep strain rates in the power law creep regime were found to be predicted much better by the Shorty and Rosler/Arzt equation with the inclusion of a threshold stress and dislocation detachment mechanism. The dispersoids in this alloy were acting a source of void nucleation that finally leaded to ductile fracture within the grain so called intergranular. Each void was initiated, grown and failed at the dispersoids in the aluminium matrix. Grain boundary accommodation of the slip produced, which result in initiation of the void and then final transgranular fracture. Therefore, it was confirmed that these dispersoids played an important role in the fracture mechanism by the formation of $Al_{13}Fe_4$, $Al_{13}Cr_2$ and $Al_2O_3$.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.24 no.5 s.176
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• pp.1331-1342
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• 2000

In power generation systems a variety of structural components typically operate at high temperature and pressure. Therefore a life assessment methodology accounting for gradual creep fracture is increasingly needed for these components. The most critical defects in such structure are generally found in the form of semi-elliptical surface cracks in the welded tubular joints. Therefore the analysis of a semi-elliptical surface crack in a plate or a shell is an important problem in engineering fracture mechanics. On this background, via shell/line-spring finite element analyses of such surface cracks in the welded T and L joints under various loadings, we investigate J-integral along the crack front We first develop T and L joints auto mesh generation program providing ABAQUS input file composed of shell/line-spring finite elements. We then further develop a T and L joints life assessment program based on the experimental creep crack growth law and auto mesh generation program in a graphical user interface format Finally the remaining life of T and L joints for various analytical parameters are assessed using the developed life assessment program.

• Journal of the Korean Wood Science and Technology
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• v.33 no.5 s.133
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• pp.57-65
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• 2005

Following our previous reports for finger-jointed woods with various finger profiles studied for the efficient use of small diameter logs and woods containing various defects, twelve types of finger-jointed woods glued with three kinds of adhesives and with two sizes of finger pitches were made with sitka spruce and red pine. The effects of the adhesives and finger pitches on bending creep performances of finger-jointed woods were investigated. The shape of creep curves differed among the used adhesives and finger pitches of finger-jointed woods for both tested species. Their creep curves showed a linear behavior beyond about one hour, and the N values fitted to power law increased with increasing finger pitches. The initial deformation increased with increasing finger pitches, regardless of the tested species and kinds of adhesives, whereas the effect of finger pitches on the creep deformation was not clear. For finger-jointed woods glued with polyvinyl acetate (PVAc) resin, creep failure occurred in 106 hours after the load was applied. And the difference of the creep compliance between finger-jointed woods glued with resorcinol-phenol formaldehyde (RPF) resin and aqueous vinyl urethane (AVU) resin was small. The ratios for creep performances of finger-jointed woods glued with RPF resin and AVU resin versus solid wood were higher in creep deformation than initial deformation for both species, and the difference between both adhesives was not found. The relative creep decreased with increasing finger pitches, and the marked differences was not found between RPF resin and AVU resin.

• 한국금형공학회:학술대회논문집
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• 2008.06a
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• pp.39-44
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• 2008

Magnesium alloys have given high attention to the industry of light-weigh as automobile and electronics with aluminium, titanium and composite alloys due to their high strength, low specific density and good damping characteristics. But the magnesium contained structures under high temperature have the problems related to creep deformation and rupture life, which is a reason of developing the new material against creep deformation to use them safely. The purpose of this study is to predict the creep deformation mechanism and rupture time of AZ31 magnesium alloy. For this, creep tests of AZ31 magnesium alloy were done under constant creep load and temperature with the equipment including automatic temperature controller with acquisition computer. The apparent activation energy Qc and the applied stress exponent n, rupture life have been determined during creep of AZ31 Mg alloy over the temperature range of $150^{\circ}C$ to $300^{\circ}C$. In order to investigate the creep behavior. Constant load creep tests were carried out in the equipment including automatic temperature controller, whose data are sent to computer. At around the temperature of $150^{\circ}C{\sim}300^{\circ}C$ the creep behavior obeyed a simple power-law relating steady state creep rate to applied stress and the activation energy for the creep deformation was nearly equal and a little low, respectively, to that of the self diffusion of Mg alloy.

• Journal of the Korean Wood Science and Technology
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• v.45 no.6
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• pp.689-702
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• 2017

In this study, with the view to using effectively small and medium diameter Korean domestic woods as structural materials, cross-laminated woods were manufactured by using six species of Korean domestic softwoods and hardwoods, and bending creep properties were investigated for each species. The creep curves showed the shape of the exponential function plot, and the creep curves after 1 hour were able to estimate by fitting it to the power law. The initial and creep compliances of cross-laminated woods showed the higher values in wood species with a low density than in that with a high density. And by cross-laminating, the initial and creep compliances perpendicular to the grain considerably decreased, the extent of the decrease was found to be greater in creep deformation than in initial deformation. The creep anisotropies of cross-laminated woods were considerably decreased by cross-laminating. The relative creep of $C_{\bot}$ type composed of perpendicular-direction lamina in the faces decreased 0.59 - 0.64 times compared to that of $P_{\bot}$ type composed of perpendicular-direction laminae in all layers, and that for $C_{\parallel}$ type composed of parallel-direction laminae in the faces increased 1.5 - 1.6 times compared to that of $P_{\parallel}$ type composed of parallel-direction laminae in all layers.

• Geotechnical Engineering
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• v.14 no.6
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• pp.127-138
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• 1998

In refuse landfills, a considerable amount of settlement occurs due to the decomposition of refuse over several years. In this paper, several prediction methods are applied to the measured settlement data of fresh refuse sites. The effect of biological decomposition on the settlement characteristics is investigated in predicting the long-term settlement of refuse landfill sites in view of the predicted settlement curves and the amount of long-term settlement. Irrespective of the applied models, the long term settlement may not be correctly estimated if the model parameters do not contain the decomposition effects. Among the proposed several prediction methods, Gibson & Lo model and hyperbolic model seem to represent the long-term settlement characteristics, but the power creep law seems to considerably overestimate the long-term settlement.

• Journal of Theoretical and Applied Mechanics
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• v.1 no.1
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• pp.69-88
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• 1995

The paper attempts to estimate the incubation time of a cavity in the interface between a power law creep particle and an elastic matrix subjected to a uniaxial stress. Since the power law creep particle is time dependent, the stresses in the interface relax. Through previous stress analysis related to the present physical model, the relaxation time is defined by ${\alpha}$2 which satisfies the equation $\Gamma$0 ｜1+${\alpha}$2k｜m=1-${\alpha}$2 [19]. $\Gamma$0=2(1/√3)1+m($\sigma$$\infty$/2${\mu}$)m($\sigma$0/$\sigma$$\infty$tm) where $\sigma$$\infty$ is an applied stress, ${\mu}$ is a shear modulus of a matrix, $\sigma$$\infty$ is a material constant of a power law particle, $\sigma$=$\sigma$0 $\varepsilon$ and t elapsed time. the volume free energy associated with Helmholtz free energy includes strain energies associated with Helmholtz free energy includes strain energies caused by applied stress anddislocations piled up in interface (DPI). The energy due to DPI is found by modifying the results of Dundurs and Mura[20]. The volume free energies caused by both applied stress and DPI are a function of the cavity size(${\gamma}$) and elapsed time(t) and arise from stress relaxation in the interface. Critical radius ${\gamma}$ and incubation time t to maximize Helmholtz free energy is found in present analysis. Also, kinetics of cavity fourmation are investigated using the results obtained by Riede[16]. The incubation time is defied in the analysis as the time required to satisfy both the thermodynamic and kinetic conditions. Through the analysis it is found that [1] strain energy caused by the applied stress does not contribute significantly to the thermodynamic and kinetic conditions of a cavity formation, 2) in order to satisfy both thermodynamic and kinetic conditions, critical radius ${\gamma}$ decreases or holds constant with increase of time until the kinetic condition(eq.40) is satisfied. Therefore the cavity may not grow right after it is formed, as postulated by Harris[11], and Ishida and Mclean[12], 3) the effects of strain rate exponent (m), material constant $\sigma$0, volume fraction of the particle to matrix(f) and particle size on the incubation time are estimated using material constants of the copper as matrix.

• Journal of the Korean Society for Heat Treatment
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• v.18 no.3
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• pp.183-189
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• 2005

The effects of duplex-treatment of plasma carburization and CrN coating onto Ti-6Al-4V alloy on its creep properties were investigated by means of a constant stress creep tester. Applying duplex-treatment, specimens having an inner carburized layer of about $150{\mu}m$ in depth and outer CrN layer of about $7.5{\mu}m$ in thickness were prepared. The hardness of duplex-treatment surface was about 1,960 VHN. It also appeared that the duplex-treatment improved the roughness of the surface significantly; $Ra=0.045{\mu}m$ for treated alloy while $Ra=0.321{\mu}m$ for untreated alloy. The steady-state creep behaviors were investigated in a temperature range of $510{\sim}550^{\circ}C$ ($0.42{\sim}0.44T_m$) under an applied stress range of 200~275 MPa. The stress exponent, n, was derived assuming the power law creep behavior. The surface treatment showed a decrease in a value from 9.32 (untreated) to 8.79 (treated). Also the activation energy obtained from an Arrhenius plot increased from 238 to 257 kJ/mol.