• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제54권12호
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• pp.561-566
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• 2005

This paper describes electrical resistivity, dielectric strength, thermal conductivity, thermal stability and tensile strength of mica sheet impregnated with silicone rubber resin or silicone rubber resin containing alumina powder. The mica sheet impregnated with silicone rubber resin had higher electrical resistivity, dielectric strength and tensile strength than those of virgin mica sheet. Electrical resistivity of mica sheet impregnated with silicone rubber resin containing alumina increased with increasing the amount of alumina. However, dielectric strength and tensile strength of mica sheet impregnated with silicone rubber resin containing alumina decreased with increasing the amount of alumina. The mica sheet impregnated with silicone rubber resin had lower thermal conductivity than that of virgin mica sheet. However, thermal conductivity of mica sheet impregnated with silicone rubber resin conatining alumina increased with increasing the amount of alumina. In the case of thermal stability, thermal degradation of virgin mica sheet and impregnated mica sheet with silicone rubber resin did not occur up to $1100^{\circ}C$ and $400^{\circ}C$, respectively.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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• pp.1173-1174
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• 2006

Improvement of the strength is one of the most important subjects on soft magnetic composite (SMC) to increase the applica ble items. In this study, lubricants for inner lubricating SMC, which can be produced in lower cost than die wall-lubricatin g SMC, varied to investigate their effect on the strength. The newly developed SMC with self-lubricating resin shows high st rength equivalent to that of SMC obtained by die wall lubrication.

• 한국분말재료학회지
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• 제11권6호
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• pp.503-509
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• 2004

Dispersion stabilities and photocatalytic activities of rutile $TiO_{2}$ powders with unique nano-structure synthesized by homogeneous precipitation process at low temperature(HPPLT) have been investigated in the acrylic resin containing fluorostyrene in the range of 0~0.16 mole. Isoelectric point of $TiO_{2}$ in the acrylic resin placed in the neutral region whereas that of $TiO_{2}$ in the water placed in the acidic region, indicating that zeta potential and agglomeration of $TiO_{2}$ powder is strongly dependent on the pH and the type of solvent. To prepare an adhesion, an acrylic resin containing fluorostyrene was synthesized by a radical polymerization. The adhesion of coating layer was increased with increasing fluorostyrene's contents without changing the dispersion stabilities and degrading photocatalytic properties.

• Composites Research
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• 제13권2호
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• pp.72-80
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• 2000

흑연분말 첨가가 탄소/탄소 복합재료의 물성에 미치는 영향에 대하여 연구하였다. 페놀수지에 흑연분말을 0~30wt.%첨가하여 greenbody(G/B)를 제조하고 이를 $1000^{\circ}C$까지 탄화시켜 탄소/탄소 복합재료를 제조하였다. 굽힘특성은 G/B와 탄소/탄소 복합재료 모두 흑연분말 20wt.% 첨가시 최대치를 보였으며, 그 이상에서는 수지 내의inhomogeneity 증가 때문에 굽힘강도가 감소하였다. 페놀수지만을 경화시킨 경우에는 흑연분말을 20wt.% 첨가한 수지의 굽힘 강도가 첨가하지 않은 수지의 경우보다 낮은 값을 보였으나, 탄화 후에는 혹연분말의 첨가가 탄화수축 감소와 균열경로를 바꾸어 주는 효과를 주어서, 분말을 첨가한 시편의 굽힘 강도가 3배 이상 증가하였다. Mode II ENF 시험결과, G/B와 탄소/탄소 복합재료 모두 20wt.%의 흑연분말 첨가시에 에너지해방율($G_{II}$)이 증가하였으나, 분말의 첨가가 탄소/탄소 복합재료에 더 효과적임을 에너지해방율의 증가치로부터 확인할 수 있었다.

• 한국전기전자재료학회논문지
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• 제30권12호
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• pp.751-756
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• 2017

A molding-type power inductor is an inductor that uses a hybrid material that is prepared by mixing a ferrite metal powder coated with an insulating layer and an epoxy resin, which is injected into a coil-embedded mold and heated and cured. The fabrication of molding-type inductors requires various techniques such as for coil formation and insertion, improving the magnetic properties of soft magnetic metal powder, coating an insulating film on the magnetic powder surface, and increasing the packing density by well dispersing the powder in the epoxy resin. Among these aspects, researches on additives that can disperse the metal soft magnetic powder having the greatest performance in the epoxy resin with high charge have not been reported yet. In this study, we investigated the effect of silanes, KBM-303 and KBM-403, and a commercial dispersant on the dispersion of metal soft magnetic powders in epoxy resin. The sedimentation height and viscosity were measured, and it was confirmed that the silane KBM-303 was suitable for dispersion. For this silane, the packing density was as high as about 72.49%. Moreover, when 1.2 wt% of dispersant BYK-103 was added, the packing density was about 80.5%.

• 대한치과보철학회지
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• 제29권1호
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• pp.91-109
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• 1991

The purpose of this study were to comfirm the effects of the thickness and kinds of porcelain, etchants, illumination time, elapsed time for the measurement, and chemical cure component to the bond strength of porcelain laminate and composite resin cement, and to compare the effects between the light cured resin and the dual cured resins. The etched porcelain surface, the sectioned surface crossing porcelain and resin after bonding, and the debonded surfaces were observed by the SEM. One product of laminate porcelain powder, one light cured resin and two dual cured resins were selected. Each resin cements are lightened through the thin porcelain disc which was cut from cylindrical porcelain specimen by the diamond saw, and by the light through the porcelain disc they were bonded. Changes of thickness and kinds of porcelain, etchants, illumination time, and the elapsed time for the measurement were considered as variables for the bond strength. And the bond strength of porcelain and dual cured resins under the conditions of autopolymerization or the removal of chemical cure component were measured and compared. Bond strength were measured by shear stress. The etched surface, the cross-sectioned surface, and the debonded surface of porcelain or resin were observed by SEM. On the summary of this study, the following conclusions can be stated; 1. Bond strength of light cured resin was decreased inversely by the thickened porcelain laminate and showed the lowest value to the masking dentin porcelain among 4 kinds of porcelain powder. 2. Bond strength of autopolymerization of dual cured resin without illumination in dark chamber were from 75% to 98% to the data of dual cured resin with illumination. 3. Bond strength of dual cured resin used without chemical cured components were same to them of light cured resin. 4. Cross-sectioned surface treated by silane did not show the gap between the porcelain and resin. 5. Illumination over 80 seconds did not make the significant increase of bond strength on all kinds of resin.

• Journal of the Korean Wood Science and Technology
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• 제12권1호
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• pp.3-10
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• 1984

본(本) 연구(硏究)는 토란분말(土卵粉末) 및 밀가루 분말(粉末)을 알카리와 반응(反應)시켜 제조(製造)한 접착제(接着劑)를 합판용(合板用)으로 개발(開發)코저 실시(實施)하였다. 토란(土卵) 및 밀가루 접착제(接着劑) 대(對) 요소수지(尿素樹脂)의 비(比)를 각각(各各) 0:100, 10:90, 20:80, 30:70, 40:60, 50:50, 60:40, 80:20, 100:0으로 혼합(混合)하여 합판접착(合板接着)에 적용(適用)하였으며 또한 비교실험(比較實驗)을 위하여 요소수지(尿素樹脂)에 대한 통상적(通常的)인 증량방법(增量方法)인 밀가루 분말(粉末) 대(對) 요소수지(尿素樹脂)와의 증량비(增量比)를 10:90, 20:80, 30:70, 40:60, 50:50으로 혼합(混合)한 접착제(接着劑)로 합판(合板)을 제조(製造)하여 그 접착력(接着力)을 비교(比較) 분석(分析)하였다. 토란접착제(土卵接着劑)에 요소수지(尿素樹脂)를 30:70의 비(比)로 혼합(混合)한 것이 상태(常態) 및 내수접착력(耐水接着力)에서 가장 우수한 토란접착제(土卵接着劑)에 요소수지(尿素樹脂)를 혼합(混合)하여 제조(製造)한 합판(合板)의 상태접착력(常態接着力)은 혼합비(混合比) 60:40 까지는 같은 혼합비(混合比)의 밀가루 접착제(接着劑)를 혼합(混合)한 것과 밀가루 분말(粉末)을 증량(增量)한 것보다 높은 값을 나타냈다. 밀가루 접착제(接着劑)에 요소수지(尿素樹脂)에 혼합(混合)한 합판(合板)의 상태접착력(常態接着力)은 밀가루 분말(粉末)을 증량(增量)한 것과 비교(比較)하여 혼합비(混合比) 20:80(밀가루 접착제(接着劑) : 요소수지)까지는 비슷한 값을 보이다가 혼합비(混合比) 30:70에서부터는 높은 값을 나타내고 있다. 토란접착제(土卵接着劑) 및 밀가루 접착제(接着劑)를 요소수지(尿素樹脂)에 혼합(混合)한 합판(合板)의 내수접착력(耐水接着力)은 혼합비(混合比) 40:60(토란(土卵) 및 밀가루 접착제(接着劑) : 요소수지(尿素樹脂)) 까지는 밀가루 분말(粉末)을 증량(增量)한 것보다 훨씬 높은 값을 나타내었다. 토란접착제(土卵接着劑)를 혼합(混合)한 것은 밀가루 접착제(接着劑)를 혼합(混合)한 것과 비교(比較)하여 전혼합비(全混合比)에서 높은 내수접착력(耐水接着力)을 보였다. 밀가루 분말(粉末)을 직접(直接) 증량제(增量劑)로 가용(使用)한 것보다 알카리와 반응(反應)시켜 만든 토란접착제(土卵接着劑) 및 밀가루 접착제(接着劑)를 혼합(混合)한 것이 상태(常態) 및 내수접착력(耐水接着力)을 상당(相當)히 증진(增進)시킬 수 있었는데 이것은 제조(製造)된 접착제(接着劑) 자체(自體)가 접착성(接着性)을 갖기 때문에 나타난 결과(結果)로 생각된다.

• 한국분말재료학회지
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• 제17권1호
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• pp.59-64
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• 2010

8 mol% Y-doped $SrTiO_3$ powder was synthesized by Pechini method from titanium isopropoxide, strontium nitrate, yttrium nitrate, citric acid and ethylene glycol. A $Y_2Ti_2O_7$ pyrochlore phase-free perovskite powder was obtained by calcining a polymeric resin, which was prepared from a precursor solution, at $500^{\circ}C$ in an air atmosphere. Low temperature calcination could lead to a fine-grained microstructure. In the case of a solid-state reaction, an extended heat-treatment at high temperature in a reduced atmosphere needed to obtain a single phase perovskite $SrTiO_3$.

• 한국응용과학기술학회지
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• 제31권2호
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• pp.329-336
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• 2014

The conductive polymer composites have attracted considerable attention in the field of industry due to their electrical properties. To understand electrical properties of the composites, their volume specific resistance was measured. Electrical conductivity results showed percolation phenomena. Percolation theories are frequently applied to describe the insulator-to-conductor transitions in the composites composed of conductive filler and insulating matrix. It was found that the percolation threshold strongly depends on the aspect ratio of filler particles. The critical concentration of percolation formed is defined as the percolation threshold. The purpose of this study was to examine electrical properties of the epoxy resins filled with nickel. The sample was prepared using vehicle such as epoxy resin replenished with nickel powder, and the evaluation on their practical use was performed in order to apply them to electric and electronic industry as well as general field. The volume specific resistance of epoxy resin composites was 4.666~13.074 when using nickel powder. Weight loss of the conductive composites took place at $350^{\circ}C{\sim}470^{\circ}C$.

• 한국정밀공학회지
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• 제20권4호
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• pp.165-173
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• 2003

As the cycling time of new products have become more and more short in recent years, the demand for lowering the cost and reducing the production time becomes stronger. In order for the demand, the rapid prototyping and rapid tooling technology have been used. It has been widely known that RP technology has advantages with fabricating 3-D object having a complicated geometric shape. RP products, however, have a limitation with applying to the real die and mold because soft materials such as resin, paper and wax has been mostly used in RP technology. So in this paper, the RP products have been copied to semi-metallic soft tools using the mixture of metal fillers and epoxy resin. In order to evaluate the effect of the fillers on the characteristics of semi-metallic soft tools, three fillers are used including commercial aluminum powder, cast iron powder recycled by machining chips, and aluminum short fiber made by self-excited vibration technique. Besides, in the case of aluminum powder, the change of characteristics of semi-metallic soft tools is also tested according to the volume fraction of the powder.