• Applied Chemistry for Engineering
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• v.29 no.4
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• pp.395-398
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• 2018

In this work, profound microscale behaviors of block copolymer and polymer blend under electric field were investigated using microscopic methods and compared systematically. To this end, both the block copolymer and blend containing polyacrylonitrile (PAN) and poly(methyl methacrylate) (PMMA) were introduced. The two polymers have a similar dielectric constant. Under an identical experimental condition such as temperature, film thickness, field intensity, and exposure time, the polymer blend responded more sensitively than the block copolymer. The presence of covalent bond suppressed the mobility of constituents in block copolymer. This study will be essential for future research activities regarding behaviors of polymeric materials under external fields.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.22 no.3
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• pp.399-407
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• 1998

The infrared reflection coatings with pigment can be used to protect the surfaces of combustible materials exposed to fire. To obtain high reflectivities in the infrared range (0.5-10.mu.m) important to fire, several dielectric pigments, such as titanium dioxide, iron oxide, and silicon, can be synthesized to polymer coatings. The theoretical analysis shows that the coating design with particles diameter in the 1.5 to 2.5.mu.m range and volume fraction in the 0.1 to 0.2 range is estimated to be optimal. In the analysis of the radiation, the dependent scattering, absorption by polymeric binder, and the internal interface reflection are considered. In addition, the temperature distribution in the semi-transparent coating layer and an opaque substrate (PMMA) is also presented.

• 전기의세계
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• v.25 no.1
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• pp.95-100
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• 1976

The main purpose of this paper is to study on the transient current due to the change of environmental temperature under no external field in the arrangement of M$_{1}$(metal)-P(polyver)-M$_{2}$(metal). The specimer of polymeric insulator sandwiched by two metal electrodes composes a parallel-plate condenser represented by Maxwell-model. The behaviors of short circuit current flowing in M-P-M arrangement are very complex and the analysis of its conduction mechanism appears to be much complicated. In this paper we can suggest that a contact potential difference as an energetic state exists in the thin film specimen both sides of which are contacted by two different metals having different cook functions. Futhermore the contact potential difference appears to be constant through the course of temperature change, however, the dielectric constant and caparitance of the specimen must be temperature dependent. Accordingly the charge difference induced on both sides of electrodes may be a cause for the shory circuited transient current flowing through the external circuit. It is also suggestive that the results of the observation must be considered in cases of insulation design of electrical machines and D.C. cable for high voltage use.

• Journal of the Korean Society for Nondestructive Testing
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• v.32 no.4
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• pp.393-400
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• 2012

In recent years, nano-structured thin film systems are often applied in industries such as MEMS/NEMS device, optical coating, semiconductor or like this. Thin films are used for many and varied purpose to provide resistance to abrasion, erosion, corrosion, or high temperature oxidation and also to provide special magnetic or dielectric properties. Quite a number of articles to evaluate the characterization of thin film structure such as film density, film grain size, film elastic properties, and film/substrate interface condition were reported. Among them, the evaluation of film adhesive to substrate has been of great interest. In this study, we fabricated the polymeric thin film system with different adhesive conditions to evaluate the adhesive condition of the thin film. The nano-structured thin film system was fabricated by spin coating method. And then V(z) curve technique was applied to evaluate adhesive condition of the interface by measuring the surface acoustic wave(SAW) velocity by scanning acoustic microscope(SAM). Furthermore, a nano-scratch technique was applied to the systems to obtain correlations between the velocity of the SAW propagating within the system including the interface and the shear adhesive force. The results show a good correlation between the SAW velocities measured by acoustic spectroscope and the critical load measured by the nano-scratch test. Consequently, V(z) curve method showed potentials for characterizing the adhesive conditions at the interface by acoustic microscope.

• Journal of the Korean Applied Science and Technology
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• v.29 no.2
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• pp.199-204
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• 2012

Organic thin-film transistors (OTFTs) have received considerable attention because their potential applications for nano-scale thin-film structures have been widely researched for large-scale integration industries, such as semiconductors and displays. However, research in developing n-type materials and devices has been relatively shortage than developing p-type materials. Therefore, we report on the fabrication of top-contact [6,6]-phenyl-C61-butyricacidmethylester (PCBM) TFTs by using three different solvent, o-dichlorobenzene, toluene and chloroform. An appropriate choice of solvent shows that the electrical characteristics of PCBM TFTs can be improved. Moreover, our PCBM TFTs with the cross-linked Poly(4-vinylphenol) dielectric layer exhibits the most pronounced improvements in terms of the field-effect mobility (${\sim}0.034cm^2/Vs$) and the on/off current ratio (${\sim}1.3{\times}10^5$) for our results. From these results, it can be concluded that solvent-modification of an organic semiconductor in PCBM TFTs is useful and can be extended to further investigations on the PCBM TFTs having polymeric gate dielectrics. It is expected that process optimizations using solution-processing of organic semiconductor materials will allow the development of the n-type organic TFTs for low-cost electronics and various electronic applications.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.2
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• pp.245-253
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• 2010

The reliability problems of flip chip packages subjected to temperature change during the packaging process mainly occur due to mismatches in the coefficients of thermal expansion as well as features with time-dependent material properties. Resin molding compounds like glass fiber reinforced epoxy composites used as the dielectric layer in printed circuit boards (PCB) strongly exhibit viscoelastic behavior, which causes their Young's moduli to not only be temperature-dependent but also time-dependent. In this study, the stress relaxation and creep tests were used to characterize the viscoelastic properties of the glass fiber reinforced epoxy composite. Using the viscoelastic properties, finite element analysis (FEA) was employed to simulate thermal loading in the pre-baking process and predict thermal warpage. Furthermore, the effect of viscoelastic features for the major polymeric material on the dielectric layer in the PCB (the glass fiber reinforced epoxy composite) was investigated using FEA.

• Korean Journal of Materials Research
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• v.18 no.12
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• pp.664-668
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• 2008

Vapor phase polymerization of a conductive polymer on a $SiO_2$ surface can offer an easy and convenient means to depositing pure and conductive polymer thin films. However, the vapor phase deposition is generally associated with very poor adhesion as well as difficulty when patterning the polymer thin film onto an oxide dielectric substrate. For a significant improvement of the patternability and adhesion of Poly(3-hexylthiophene) (P3HT) thin film to a $SiO_2$ surface, the substrate was pre-patterned with n-octadecyltrichlorosilane (OTS) molecules using a ${\mu}$-contact printing method. The negative patterns were then backfilled with each of three amino-functionalized silane self-assembled monolayers (SAMs) of (3-aminopropyl) trimethoxysilane (APS), N-(2-aminoethyl)-aminopropyltrimethoxysilane (EDA), and (3- trimethoxysilylpropyl)diethylenetriamine (DET). The quality and electrical properties of the patterned P3HT thin films were investigated with optical and atomic force microscopy and a four-point probe. The results exhibited excellent selective deposition and significantly improved adhesion of P3HT films to a $SiO_2$ surface. In addition, the conductivity of polymeric thin films was relatively high (${\sim}13.51\;S/cm$).

• Journal of the Korean Ceramic Society
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• v.39 no.11
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• pp.1113-1118
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• 2002

Nano sized $(Pb_{0.5}Ca_{0.5})(Fe_{0.5}Nb_{0.5})O_3$ (PCFN) powders with the stoichiometric composition and the uniform size distribution were successfully synthesized by the metal-citrate process through the calcination of the polymeric precursor which consisted of the metal ions and the organic network. The crystallization of the initial amorphous powders began at $400{\circ}$ and completed at $700{\circ}$. The pyrochlore phase was detected caused by the dissociation of PbO above $900{\circ}$. Single phase perovskite PCFN powders with 40 nm size and uniform shape were obtained through the calcination at $700{\circ}$.

• Polymer(Korea)
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• v.24 no.2
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• pp.259-267
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• 2000

Gel polymer electrolytes were prepared from poly(vinylidene fluoride-co-hexafluoro propylene)[P(VdF-co-HFP)] that had higher mechanical properties as well as higher dielectric constant ($\varepsilon$=8~13) than other polymeric matrix. Mechanical properties and ionic conductivities have been investigated as a function of blend ratio of electrolyte solution and polymer matrix. Ethylene carbonate (EC)/${\gamma}$-butyrolactone (${\gamma}$-BL) and lithium triflate (LiCF$_3$SO$_3$) were used as solvent and salt, respectively. The mechanical properties such as tensile strength, tensile modulus, compression modulus, and dynamic shear modulus were evaluated. The highest ionic conductivity was 1.09$\times$10$^{-3}$ S/cm for PVH40 containing 28.6 wt% of P(VdF-co-HFP) at $25^{\circ}C$. Tensile strength, tensile modulus and compression modulus were increased with P(VdF-co-HFP) content and abruptly changed between PVH70 and PVH80. Dynamic shear moduli showed a typical gel behavior and changed with shear strain.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.409-409
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• 2014

Recently hexagonal boron nitride (h-BN), III-V compound of boron and nitrogen with strong covalent $sp^2$ bond, is a 2 dimensional insulating material with a large direct band gap up to 6 eV. Its outstanding properties such as strong mechanical strength, high thermal conductivity, and chemical stability have been reported to be similar or superior to graphene. Because of these excellent properties, h-BN can potentially be used for variety of applications such as dielectric layer, deep UV optoelectronic device, and protective transparent substrate. Ultra flat and charge impurity-free surface of h-BN is also an ideal substrate to maintain electrical properties of 2 dimensional materials such as graphene. To synthesize a single or a few layered h-BN, chemical vapor deposition method (CVD) has been widely used by using an ammonia borane as a precursor. Ammonia borane decomposes into hydrogen (gas), monomeric aminoborane (solid), and borazine (gas) that is used for growing h-BN layer. However, very active monomeric aminoborane forms polymeric aminoborane nanoparticles that are white non-crystalline BN nanoparticles of 50~100 nm in diameter. The presence of these BN nanoparticles following the synthesis has been hampering the implementation of h-BN to various applications. Therefore, it is quite important to grow a clean and high quality h-BN layer free of BN particles without having to introduce complicated process steps. We have demonstrated a synthesis of a high quality h-BN monolayer free of BN nanoparticles in wafer-scale size of $7{\times}7cm^2$ by using CVD method incorporating a simple filter system. The measured results have shown that the filter can effectively remove BN nanoparticles by restricting them from reaching to Cu substrate. Layer thickness of about 0.48 nm measured by AFM, a Raman shift of $1,371{\sim}1,372cm^{-1}$ measured by micro Raman spectroscopy along with optical band gap of 6.06 eV estimated from UV-Vis Spectrophotometer confirm the formation of monolayer h-BN. Quantitative XPS analysis for the ratio of boron and nitrogen and CS-corrected HRTEM image of atomic resolution hexagonal lattices indicate a high quality stoichiometric h-BN. The method presented here provides a promising technique for the synthesis of high quality monolayer h-BN free of BN nanoparticles.