• Journal of the Korean Society for Precision Engineering
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• v.24 no.5
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• pp.82-88
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• 2007

This work is to fabricate a precise optical fiber array using polymer composite for optical interconnection. Optical fiber array has to satisfy low optical loss requirement less than 0.4 dB according to temperature change. For this purpose, design criteria for an optical fiber array was derived. The coefficient of thermal expansion of silica particulate epoxy composites was affected by volume fraction of silica particles. And also, elastic modulus of silica particulate epoxy composites was affected by volume fraction of silica particles. To obtain the coefficients of thermal expansion below $10{\times}10E-6/^{\circ}C$ and elastic modulus more than 20 GPa , we chose the volume fraction more than 76%. Using silica particulate epoxy composites with the volume fraction 76%, 8-channel optical fiber array with dimensional tolerances below $1\;{\mu}m$ was manufactured by transfer molding technique using dies with the uniquely-designed core pin and precisely-machined zirconia ceramic V block. These optical fiber arrays showed optical loss variations within 0.4 dB under thermal cycling test and high temperature test.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.1286-1289
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• 2004

A new thermal bimorph actuator for large out-of-plane displacement is designed, fabricated and tested. The deflecting beam is composed of polyimide, heater, and polyvinyl difluorides with tetrafluoroethylene(PVDF-TrFE). The large difference of coefficient of thermal expansion(CTE) of two polymer layers (polyimide and PVDF-TrFE) can generate a large deflection with relatively small temperature rising. Compared to the most conventional micro actuators based on MEMS(micro-electro mechanical system) technology, a large displacement, over 1 mm at 20 mW, could be achieved. The proposed actuator can find applications where a large vertical displacement is needed while keeping compact overall device size, such as a micro zooming lens.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1277-1282
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• 2008

Recently LCD panels have becom very important components for portable electronics. In the high density interconnection material, ACF's are used to connect the outer lead of the tape automated bonding to the transparent indium tin oxide electrodes of the LCD panel. ACF consists of an adhesive polymer matrix and randomly dispersed conductive balls. In this study, we analyzed Failure Mode / Mechanism of ACF which is identified Conductive ball Corrsion, Delamination, Crack and Polymer Expansion / Swelling. In ALT(Accelerated Life Test), we select primary stress factors as temperature and humidity. As time passes by, an increase of connection resistance was observed. In conclusion, we have found that high temperature / humidity affects the adhesion.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2000.11a
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• pp.17-21
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• 2000

Logarithmic electrical resistivity of the untreated or thin diameter carbon fiber composite increased suddenly to the infinity when the fiber fracture occurred by tensile electro-micromechanical test, whereas that of the ED or thick fiber composite increased relatively broadly up to the infinity. Electrical resistance of single-carbon fiber composite increased suddenly due to electrical disconnection by the fiber fracture in tensile electro-micromechanical test, whereas that of SFC increased stepwise due to the occurrence of the partial electrical contact with increasing the buckling or overlapping in compressive test. Electrical resistivity measurement can be very useful technique to evaluate interfacial properties and to monitor curing behavior of single-carbon fiber/epoxy composite under tensile/compressive loading.

• Bulletin of the Korean Chemical Society
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• v.12 no.6
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• pp.682-685
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• 1991

Solvent dependence of the static solution properties of a polymer chain was studied by static light scattering technique for polystyrene in three good solvents, toluene, tetrahydrofuran and $CCl_4$. The molecular parameters such as radius of gyration and second virial coefficients of polystyrene are found to be clearly larger in THF than the other two solvents and they are in the order of tetrahydrofuran > toluene > $CCl_4$. The radius of gyration shows the same order while the difference is smaller. Nontheless, the penetration functions are found to have a comparable value about 0.2, which confirms the universality of the penetration function in high expansion regime over different nature of solvents.

• Proceedings of the Polymer Society of Korea Conference
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• 2006.10a
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• pp.227-227
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• 2006

It was attempted to synthesize polyimides from PPMDA and 3FPPMDA with mDAPPO/pPDA in order to afford CTE of 17ppm and adhesion property of 80g/mm, besides high Tg (>$300^{\circ}C$), good thermal stability (>$500^{\circ}C$), low water absorption and good solubility. The polyimides were prepared via a conventional two-step process; preparation of poly(amic-acid), followed by solution imidization by refluxing in NMP with o-DCB and the molar ratio of mDAPPO/pPDA was varied. The polyimides were characterized by FT-IR, NMR, DSC and TGA. In addition, intrinsic viscosity, solubility and coefficient of thermal expansion (CTE) were also measured.

• Polymer(Korea)
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• v.25 no.6
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• pp.826-832
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• 2001

In this study, PPy/gold/mylar type electroactive bi-layer actuator was prepared by the electrochemical polymerization of pyrrole onto the gold/mylar film and the actuation characteristics were studied using bending beam method. Conducting polymer-based actuators undergo volumetric changes due to the movement of dopant ions into the film during the electrical oxidation process. The bilayer films exhibited different actuation characteristics depending on dopant ion size. It was observed that the relatively small dopant ion (i.e. toluene sulfonate) moved into the PPy film at oxidized state, so volume expanded to result in bending motion. In case of the film having large dopant ion (i.e. dodecylbenzenesulfonate), volume expansion was observed at reduced state. This is due to the incorporation of $Na^+$ counterion with water molecules, while the large dopant ion was fixed in the film due to the limited mobility during tile redox process.

• Transactions on Electrical and Electronic Materials
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• v.3 no.2
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• pp.32-37
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• 2002

This paper gives the basic mechanical properties of indium-tin-oxide (ITO) films on polymer substrates which are exposed to externally and thermally induced bending force. By using modified Storney formula including triple layer structure and bulge test measuring the conductive changes of patterned ITO islands as a function of bending curvature, the mechanical stability of ITO films on polymer substrates was intensively investigated. The numerical analyses and experimental results show thermally and externally induced mechanical stresses in the films are responsible for the difference of thermal expansion between the ITO film and the substrate, and leer substrate material and its thickness, respectively. Therefore, a gradually ramped heating process and an organic buffer layer were employed to improve the mechanical stability, and then, the effects of the buffer layer were also quantified in terms of conductivity-strain variations. As a result, it is uncovered that a buffer layer is also a critical factor determining the magnitude of mechanical stress and the layer with the Young's modulus lower than a specific value can contribute to relieving the mechanical stress of the films.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2002.10a
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• pp.261-264
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• 2002

Interfacial evaluation, damage sensing and cure monitoring of single carbon fiber/thermosetting composite with different curing processes was investigated using electro-micromechanical test. After curing, residual stress was monitored by measurement of electrical resistance (ER) and then it was compared to correlate with various curing processes. In thermal curing, curing shrinkage appeared significantly by matrix shrinkage and residual stress due to the difference in thermal expansion coefficient (TEC). The change in electrical resistance (ΔR) on thermal curing was higher than that on ultraviolet (UV) curing. For thermal curing, apparent modulus was the highest and reaching time until same strain was faster. So far thermal curing shows strong durability on the IFSS after boiling test.

• Proceedings of the Korea Technical Association of the Pulp and Paper Industry Conference
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• 2007.11a
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• pp.93-102
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• 2007

Biocomposite was organized with biodegradable polymer and natural fiber that has potential to be used as replacement for glass fiber reinforced polymer composite with the benefits of low cost, low density, acceptable specific strength, biodegradability, etc. Until now, non-wood fibers have been used as reinforcements of biocomposite which are all plant-based fibers. The present study focused on investigating the fabrication and characterization of biocomposite reinforced with red algae fiber. The bleached red algae fiber(BRAF) showed very similar crystallinity to the cellulose. It has high stability against thermal degradation (maximum thermal decomposition temperature of 359.3$^{\circ}C$) and thermal expansion. Biocomposites reinforced with BRAF have been fabricated by a compression molding method and their mechanical and thermal properties have been studied. The storage modulus and the thermomechanical stability of PBS matrix are markedly improved with reinforcing the BRAF. These results support that the red algae fiber can be used as an excellent reinforcement of biocomposites as "green-composite" or "eco-composite".