• Journal of Surface Science and Engineering
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• v.39 no.4
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• pp.166-172
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• 2006

Metallized Polyimide films are extensively used as base materials in microelectronics, optical and automotive applications. However it is difficult to deposit metals on those because of their structural stabilities. In this work, polyimide films are modified by a wet process with alkalinemetalhydroxide and additives to introduce functional groups. The surface molecular structures of polyimide are investigated using X-ray photoelectron spectroscopy(XPS), fourier transform infrared reflection spectroscopy(FTIR-ATR), atomic force micro-scopic(AFM). XPS spectra and FTIR spectra show that the surface structure of polyimide is converted into potassium polyamate. AFM image and AFM cross-sectional analyses reveal the increased roughness on the modified surface of polyimide films. As a result, it is shown that the adhesion strength between polyimide surface and electroless nickel layer is increased by the nano-anchoring effect.

• Journal of Surface Science and Engineering
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• v.45 no.1
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• pp.8-14
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• 2012

The effects of the alkali surface modification process on the adhesion strength between electroless-plated Cu and polyimide films were investigated. The polyimide surfaces were effectively modified by alkali surface treatments from the hydrophobic to the hydrophilic states, and it was confirmed by the results of the contact angle measurement. The surface roughness increased by alkali surface treatments and the adhesion strength was proportional to the surface roughness. The adhesion strength of Cu/polyimide interface treated by KOH + EDA (Ethylenediamine) was 874 gf/cm which is better than that treated by KOH and KOH + $KMnO_4$. The results of XPS spectra revealed that the alkali treatment formed oxygen functional groups such as carboxyl and amide groups on the polyimide films which is closely related to the interfacial bonding mechanism between electroless-plated Cu and polyimide films. It could be suggested that the species and contents of functional group on polyimide films, surface roughness and contact angle were related with the adhesion strength of Cu/polyimide in combination.

• Journal of Surface Science and Engineering
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• v.26 no.2
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• pp.71-81
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• 1993

Thed effects of Ar or Oxygen RF plasma treatment on the adhesion behavior of Cr films to polyimide sub-strates have been investigated by using SEM, XRD, AES, and $90^{\circ}$peel test. By applying RF plasma treatment of the polyimide surface prior to metal deposition, the peel adhesion strength of Cu/Cr films sputtered onto the fully cured BPDA-PDA polyimide was highly increased from about 3g/mm to 90 ~ 100g/mm. Improved peel adhesion strength of Cr/polyimide interfaces due to RF plasma treatment was attributed to the contributions from surface cleaning, Cr-polyimide bonding at the interface, and force required for plastic deformation of the film. While the surface topology change of the polyimide caused by RF plasma treatment makes a little contri-bution to the improved adhesion.

• Korean Journal of Materials Research
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• v.9 no.1
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• pp.65-72
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• 1999

In order to minimize flexible printed circuit(FPC), which is used in computer, communication, medical facility, aviation space industry, it is required to improve the interfacial adhesion of polymide/epoxy or polyimide/polyimide consists of FPC. In this study, it was considered to improve the adhesion strength of polyimide/epoxy joint by introducing functional group on polyimide film and improving mechanical property of epoxy. Functional group on polyimide film was introduced by changing polyimide film surface to polyamic acid in KOH aqueous solution. The optimum conditions for surface modification were the concentration of 1M KOH and treatment time of 5min. Also, the optimum adhesion strength of polyimide/epoxy joint was obtained using rubber modified epoxy and polyamic acid as a base resin and curing agent of epoxy adhesive, respectively. The degree of surface modification of polyimide film examined with contact angle measurement of FTIR, thus modification of polyimide to polyamic acid was identified. Fracture surface of plymide/epoxy joint was analyzed by scanning electron microscopy, and modified polyamic acid reimidezed to polymide as increasing curing temperature.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11a
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• pp.337-340
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• 2001

The control of high pretilt angle for nematic liquid crystal (NLC) with negative dielectric anisotropy on the rubbed blending polyimide (homeotropic and homogeneous alignment) surface were studied. High NLC pretilt angle generated on the blending polyimide (homeotropic polyimide and SE-7492 surface was measured and the NLC pretilt angle increases with blending ratio and rubbing strength. However, the NLC pretilt angle generated on the blending polyimide (homeotropic polyimide and SE-150 surface was not varied. The high pretilt angle the NLC using blending polyimide surface can be achieved.

• Journal of Sensor Science and Technology
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• v.22 no.5
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• pp.357-363
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• 2013

An ultraviolet pulsed laser ablation of polyimide film coated with platinum has been used to enhance the sensitivity for the application as an electrochemical biosensor. Densely packed cones are formed on polyimide surface after UV irradiation which results in increase of surface area. In order to apply the sensitivity improvement of laser ablated polyimide film electrodes, the glucose oxidase modified biosensor was fabricated by using an encapsulation in the gel matrix through sol-gel transition of tetraethoxysliane on the surface of laser ablated polyimide film. The optimum conditions for glucose determination have been characterized with respect to the applied potential and pH. The linear range and detection limit of glucose detection were from 2.0 mM to 18.0 mM and 0.18 mM, respectively. The sensitivity of glucose biosensors fabricated with laser ablated polyimide film is about three times higher than that of plain polyimide film due to increase in surface area by laser ablation.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 1998.05a
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• pp.61-62
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• 1998

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11b
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• pp.337-340
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• 2001

The control of high pretilt angle far nematic liquid crystal (NLC) with negative dielectric anisotropy on the rubbed blending polyimide (homeotropic and homogeneous alignment) surface were studied. High NLC pretilt angle generated on the blending polyimide (homeotropic polyimide and SE-7492 surface was measured and the NLC pretilt angle increases with blending ratio and rubbing strength. However, the NLC pretilt angle generated on the blending polyimide (homeotropic polyimide and SE-150 surface was not varied. The high pretilt angle the NLC using blending polyimide surface can be acheived.

• Journal of Surface Science and Engineering
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• v.25 no.2
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• pp.90-96
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• 1992

Thed effects of sputter gas pressure and substrate surface micro-roughness on the microstructure and surface topography have been investigated in the Cu thin films sputter deposited onto polyimide substrates. The surface roughness of polyimide was controlled by oxygen rf plasma treatment. In the Cu film deposited at the pressure of 5 mtorr, the surface is smooth and the columnar structure is not visible regardless of polyimide surface more open boundaries. The polyimide surface roughness enhances these effects, These phenomena can be explained in therm of atomic shadowing effect.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.6
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• pp.547-551
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• 2006

We studied liquid crystal (LC) alignment with ion beam (IB) on polyimide and electro-optical characteristics of twisted nematic (TN)-liquid crystal display (LCD) on the polyimide surface using obliquely ion beam (IB) exposure with new IB type equipment. A good uniform alignment of the nematic liquid crystal (NLC) alignment with the ion beam exposure on the polyimide surface was observed. In addition, it can be achieved the good EO properties of the ion-beam-aligned TN-LCD on polyimide surface. Also, the EO characteristics of the ion-beam-aligned TN-LCD on a polyimide (PI) surface with ion beam exposure using new type IB equipment is same or more superior than ion-beam-aligned TN-LCD on a polyimide (PI) surface with ion beam exposure using Kaufman-type Ar ion gun.