• Carbon letters
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• v.11 no.2
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• pp.83-89
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• 2010

We prepared polycarbonate (PC)/poly(methyl methacrylate) (PMMA)/multiwall carbon nanotube (MWCNT) nanocomposites by co-rotating twin screw extruder at 533 K. Thermal analysis results indicate that the miscibility of PC and PMMA is enhanced by MWCNTs. Bead necklace-like morphology of PMMA-rich phase is observed in PC/PMMA/MWCNT nanocomposites with increasing PMMA weight fraction due to the bead necklace-like morphology. The tensile strength of PC/PMMA (75/25)/MWCNT (1 wt.%) nanocomposite is 3% higher than those of PC/PMMA (75/25) alloy. Suppression of die swell by MWCNT filler is observed in the melt flow of PC/PMMA/MWCNT nanocomposites during extrusion.

• Applied Chemistry for Engineering
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• v.26 no.1
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• pp.53-58
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• 2015

Polycarbonate (PC)/graphene oxide (GO) composites with 3 phr of GO were prepared by using a twin screw extruder at 240, 260, and $280^{\circ}C$ after mixing the solution with chloroform. It was confirmed by DSC and TGA that the glass transition temperature ($T_g$) of PC/GO composites were not changed and the thermal stability was the best in case of the extrusion temperature at $260^{\circ}C$. Thermo mechanical properties of PC/GO composites according to extrusion temperatures were measured by dynamic mechanical analysis (DMA). Storage moduli of PC/GO composites were higher than that of pure PC and there was no detectable changes at varying the extrusion temperature. Based on these results, the extrusion temperature of PC/GO composites was fixed at $260^{\circ}C$. The degree of the chemical reaction of PC/GO composites with respect to the GO reduction time was confirmed by the C-H stretching peak at $3000cm^{-1}$ and the degree of the chemical reaction was similar to that of GO when the reduction time was 1 h. A decrease in the complex viscosity as a function of the GO reduction time was detected by dynamic rheometer, which may be originated from the enhancement of GO dispersion by PC-GO reaction. The GO dispersion was confirmed by scanning electron microscope (SEM).

• Polymer(Korea)
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• v.38 no.4
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• pp.471-476
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• 2014

Polycarbonate (PC) and acrylonitrile-butadiene-styrene (ABS) blends were prepared using a high shear extruder to investigate their thermal decomposition and mechanical properties with shear rate and shear time. In this experiment, high shear rate, from 1000 to 3000 rpm, in blending process was applied for 10 to 40 sec, respectively. At high shear rate over than 2000 rpm, the initial decomposition temperature was dropped significantly compared to a compounded sample because of thermal decomposition of the blend by high shear. Consequently, high shear processing gave an important effect on the mechanical and thermal properties of the PC/ABS blend. In particular, elongation of the blend decreased significantly with shear rate.

• Korean Journal of Materials Research
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• v.19 no.8
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• pp.421-426
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• 2009

We report on the capacitively coupled O2 plasma etching of PMMA and polycarbonate (PC) with a diffusion pump. Plasma process variables were process pressure and CCP power at 5 sccm $O_2$ gas flow rate. Characterization was done in order to analyze etch rate, etch selectivity, surface roughness, and morphology using stylus surface profilometry and scanning electron microscopy. Self bias decreased with increase of process pressure in the range of 25$\sim$180 mTorr. We found an important result for optimum pressure for the highest etch rate of PMMA and PC, which was 60 mTorr. PMMA and PC had etch rates of 0.46 and 0.28 ${\mu}m$/min under pressure conditions, respectively. More specifically, etch rates of the materials increased when the pressure changed from 25 mTorr to 60 mTorr. However, they reduced when the pressure increased further after 60 mTorr. RMS roughnesses of the etched surfaces were in the range of 2.2$\sim$2.9 nm. Etch selectivity of PMMA to a photoresist was $\sim$1.5:1 and that of PC was $\sim$0.9:1. Etch rate constant was about 0.04 ${\mu}m$/minW and 0.02 ${\mu}m$/minW for PMMA and PC, respectively, with the CCP power change at 5 sccm $O_2$ and 40 mTorr process pressure. PC had more erosion on the etched sidewall than PMMA did. The OES data showed that the intensity of the oxygen atomic peak (777.196 nm) proportionally increased with the CCP power.

• Applied Chemistry for Engineering
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• v.26 no.2
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• pp.173-177
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• 2015

In this study, effects of both the grafted ABS-g-MAH and the added graphene oxide (GO) on the impact strength of polycarbonate (PC)/poly(acrylonitrile-butadiene-styrene) (ABS) blends were discussed. The PC/ABS blends and PC/ABS/GO composites were fabricated by using twin screw extruder with ABS-g-MAH as a compatibilizer. The ABS-g-MAH was prepared by melting extrusion of ABS and maleic anhydride (MAH) with DCP (dicumyl peroxide) as an initiator using twin screw extruder and the synthesis of ABS-g-MAH was confirmed by the presence of carbonyl group (C=O) peak at $1780cm^{-1}$ of FT-IR spectrum. According to the thermal, rheological, and impact properties of PC/ABS blends, 5 phr (parts per hundred resin) of compatibilizer was chosen as an optimum content for the PC/ABS/GO composites. It was observed that the thermal decomposition of ABS/PC/GO composites increased with GO contents, but there was no significant changes or a decrease in the impact strength. Also the composite fabricated by ABS/GO showed small increase in the impact strength. From the result of the dynamic rheometer to observe the processing properties, the complex viscosities of PC/ABS blend including the compatibilizer increased, but the complex viscosities of composites added GO were not changed.

• Korean Journal of Materials Research
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• v.30 no.12
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• pp.650-654
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• 2020

A combination of Polycarbonate (PC) material and Polymethylmethacrylate (PMMA), fabricated using an injection molding machine, has been investigated to determine its advantages, as studied in Ref. 1). This paper aims to investigate the optimization of PMMA/PC blend for both tensile yield strength and impact strength. Furthermore, interaction effects of process conditions on mechanical properties including tensile yield strength and impact strength of PMMA/PC blend by injection molding process are interpreted in this study. Tensile and impact specimens are designed following ASTM, type V, and are fabricated by injection molding process. The processing conditions such as melt temperature, mold temperature, packing pressure, and cooling time are applied; each factor has three levels. As a result, in comparison with optimization of separated responses, mechanical properties of PMMA/PC are found to decrease when optimizing both tensile and impact strengths simultaneously. The melt temperature is found to be the most significant interaction parameter with the mold temperature and packing pressure. In addition, there is more interaction between the mold temperature and cooling time. This investigation provides a useful understanding of the control of injection molding processing of polymer blends in optical application.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.11a
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• pp.281-282
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• 2005

The AZO thin film was prepared on flexible substrate by Facing Targets Sputtering method. The substrate used the Polycarbonate(PC), thickness 200$\mu$m. In particular, the AZO thin film was prepared at room temperature because the substrate is weak in heat. The structural, electrical, optical properties of the AZO thin film were investigated and the surface was observed by microscope.

• Journal of the Korean institute of surface engineering
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• v.41 no.1
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• pp.33-37
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• 2008

Polycarbonate has a high transmittance to light, low specific gravity, flexibility and cost-effectiveness that extends the application field of the polymer to bio-engineering, optics, electronic parts, etc. Moreover, electro plating of metallic film on PC could endow the parts the electromagnetic interference shielding capability. However, poor adhesion of copper on PC limited the wide usage in the industry. In this work, a composite(PC/ABS) and MmSH(Momentary mold Surface Heating) injection process were used to improve the plating characteristics; plating thickness, gloss and adhesion. Also plasma treatment and chemical treatment were employed for improving adhesion. Plating characteristics on PC/ABS were better than those on PC due to the anchoring effect of butadiene. MmSH injection process could ameliorate the gloss and coating adhesion. Also plating thickness and adhesion of PC and PC/ABS were increased by plasma treatment.

• The Korean Journal of Rheology
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• v.9 no.2
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• pp.53-59
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• 1997

열방성 액정고분자(LCP)와 polycarbonate(PC) poly(ether imide) (PEI) poly(PEEK), polysulfone(PSF), 그리고 polyarylsulfone(PAS)과의 블렌드에 대한 상용성을 연구하였다. 제조된 블렌드의 상거동에서 액정고분자가 PC-, PEI-, PEEK-, PSF-, 그리고 PAS-rich 상 에 녹아 들어가는 양이 PC, PEI, PEEK, PSF, 그리고 PAS가 액정 고분자 -rich상에 녹아들 어가는 양보다 많음을 알수 있었다. 측정된 블렌드의 유리전이온도 결과로부터 PC, PEI, PEEK와 액정고분자 사이의 상용성이 PSF, PAS와 액정 고분자 사이의 상용성에 비하여 더 좋음을 알수 있었다. 액정 고분자의 이방성을 고려하여 고분자-고분자 상호작용계수($\chi$12)를 결정하였으며, PC, PEI, PEEK, PSF, 그리고 PAS를 포함한 액정 고분자 블렌드에서 $\chi$12는 0.078-0.183으로 나타났다.

• Journal of the Korean Graphic Arts Communication Society
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• v.16 no.3
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• pp.43-60
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• 1998

The photosensitive properties and spectroscopic characteristics in the organic photoconductor(OPC) with carrier generation layer(CGL) of poly(vinylbutyral)(PVB) and polycarbonate(PC) doped with titanyl phthalocyanine(TiOPc) were investigated. The change of crystal structure of TiOPc dispersed with PVB and PC was shown by UV-visible reflective spectrum and FT-IR spectrum and mainly caused by the difference of solubility of solvent and the interaction between TiOPc and binder. The particle size of TiOPc dispersed with PVB measured by SEM was smaller than in PC. The crystal structure of TiOPc dispersed with PVB was amorphous type and in PC was $\alpha$type. It was found that the photosensitive properties of OPC were dependent on the change of absorbance and ionization potential of TiOPc occurred from the difference of crystal structure. In this work, the photosensitivity of OPC of TiOPc dispersed with PVB was better than PC due to the crystal type and the smaller particle size.