• Title/Summary/Keyword: polyamideimide

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Synthesis and characterization of silicone-containing polyamideimide and its gas separation

  • 이용범;심진기;이영무
    • Proceedings of the Membrane Society of Korea Conference
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    • 1997.10a
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    • pp.83-84
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    • 1997
  • 1. INTRODUCTION : Polyimides containing siloxane moiety(poly(imide siloxane), or polysiloxaneimide) have been synthesized because of their some merits over polyimide itseft. Polyimides have excellent thermal and mechanical properties but their poor solubility and processibility in their fullly imidized form give disadvantages in applications. Incorporation of siloxane units make it possible to increase solubility and processibility, and also impart impact resistance, low moisture uptake, low dielectric constant, thermo-oxidative resistance, good adhesion properties to substrate and etc.. Incorporation methods of siloxane groups into the polyimide was mainly copolymerization or terpolymerization between oligomeric dimethylsiloxane and aromatic dianhydride. A few methods of introducing siloxane units in functional groups of polyimide was reported. In our laboratory poly(amideimide siloxane) and poly(imide siloxane) were prepared and the study about their thermal kinetics was performed. In separation membrane area, polysiloxaneimides was utilized in pervaporation and gas separation. Polyimides in gas separation show high selectivity and very low permeability, and introduction of siloxane segments increase permeability with low decrease in selectivity. We aimed to introduce silicone segments into poly(amic acid) state and synthesize polymer partially imidized, and also show the gas separation characteristics of the synthesized polymer.

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Insulation Breakdown Characteristics of Inverter Surge Resistant Enameled Wire Prepared with Organic/Inorganic Hybrid Nanocomposite

  • Park, Jae-Jun;Shin, Seong-Sik;Lee, Jae-Young;Han, Se-Won;Kang, Dong-Pil
    • Transactions on Electrical and Electronic Materials
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    • v.16 no.4
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    • pp.190-193
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    • 2015
  • Insulation breakdown characteristics of an inverter surge resistant enameled wire were investigated in a twisted pair prepared with organic/inorganic hybrid nanocomposite. Organic polymer was polyesterimide-polyamideimide (EI/AI) and inorganic material was a nano-sized silica. The enamel thickness was 50 μm and the diameters of enameled copper wires were 0.75, 1.024, and 1.09 mm, respectively. There were many air gaps in a twisted pair. Therefore, when the voltage was applied to the twisted pair, enamel erosion took place in the air gap area because of partial discharge according to Paschen’s law. The insulation lifetime of the hybrid wire (HW) was 41,750 sec, which was 515.4 times more than the 81 sec of EI/AIW. In addition, the shape parameter of HW was 2.58, which was 3.4 times higher than 0.75 of EI/AIW.

Electrical and thermal properties of polyamideimide-colloid silica nanohybrid for magnetic enameled wire

  • Han, S.W.;Kang, D.P.
    • Journal of Ceramic Processing Research
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    • v.13 no.spc2
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    • pp.428-432
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    • 2012
  • Polyamidimide (PAI)-colloidal silica (CS) nanohybrid films were synthesized by an advanced sol-gel process. The synthesized PAI-CS hybrid films have a uniform and stable chemical bonding and there is no interfacial defects observed by TEM. The thermal degradation ratio of PAI-CS (10 wt%) hybrid films is delayed by 100 ℃ compared with pure PAI sample determined by on set temperature range in TGA. The dielectric constant of PAI-CS (10 wt%) hybrid films decreases with increasing CS content up to about 5 wt% but increases at higher CS content, which is not explained simply by effective medium therories (EMT). The duration time of PAI-CS (10 wt%) hybrid coil is 38 sec, which is very longer than that of pure PAI coil sample. The PAI-CS (10 wt%) hybrid film has a higher breakdown voltage resistance than the pure PAI film at surge environment and exhibits superior heat resistance. The PAI-CS (10 wt%) sample shows the advanced and stable thermal emission properties in transformer module compared with the pure PAI sample. This result illustrates that the advanced thermal conductivity and expansion properties of PAI-CS sample in the case of appropriate sol-gel processes brings the stable thermal emission in transformer system. Therefore, new PAI-CS hybrid samples with such stable thermal emission properties are expected to be used as a high functional coating application in ET, IT and electric power products.