• 반도체디스플레이기술학회지
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• 제19권1호
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• pp.93-96
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• 2020

Polyimide thin film was prepared by annealing the polyamic acid that was synthesized through co-deposition of diamine and dianhydride. The polyamic acid and polyimide thin film were characterized with FT-IR and HR FE-SEM. The average roughness of the film surface, evaluated with AFM, were 0.385 nm and 0.299 nm after co-deposition, and annealing at 120 ℃ respectively. OLED was passivated with the polyimide layer of 200 nm thickness. While the inorganic passivation layer enhances the WVTR of OLED, the organic passivation layer gives flexibility to the OLED. The in-situ passivation of OLED with organic thin film layer provides the leading technique to develop flexible OLED Display.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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• pp.672-676
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• 2009

Polymide is widely used alignment material of recent commercial LCD panel structure. Generally, polyimide alignment material is classified soluble polyimide type and polyamic acid type with their main bond structure of solution state. specially, compared to polyamic acid alignment layer, soluble polyimide type alignment layer have excellent reliability during long term LCD driving cause of their high imidazation ratio(%), high voltage holding ratio(%) and low ion density. The other side, this type alignment materials has significant DC image stickicng side effect for using in-plane switching mode lcd structure cause of their slow DC discharging property. we applied inorganic salt to usual soluble polyimide type alignment layer and found out this technique had good DC image sticking property without any loss of reliability property in inplane switching LCD cell structure. This approach leads excellent DC image sticking property with maintaining high reliability property this approach confirmed improves an image sticking and a reliability simultaneously from the horizontality aligned LCD mode whose relatively bad image sticking property.

• 대한전기학회논문지
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• 제45권3호
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• pp.380-385
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• 1996

Thin films of polyamic acid(PAA) were fabricated by vapor deposition polymerization(VDP) from pyromellitic dianhydride(PMDA) and 4,4'-diamino diphenyl ether(DDE). Thin films of polyimide(PI) were obtained by curing PAA, and their dielectric properties have been measured. The uniform thin films of PI formed by curing PAA at 300 .deg. C for 1 hr. which was confirmed by Fourier transform Infrared spectroscopy(FT-IR) absorption at 720, 1380, 1780c $m_{-1}$. Relative permittivity and tan .delta. were 3.9 and 0.008 at 10kHz, respectively. (author). 8 refs., 11 figs., 1 tab.1 tab.

• 한국세라믹학회지
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• 제39권11호
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• pp.1063-1068
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• 2002

Polyimide와 silica에 물리적 또는 화학적으로 결합된 Polyimide/silica(PI/silica) 혼성체들을 졸-겔법을 통하여 Polyamic Acid(PAA) 또는 end-capped PAA 용액에 tetraethoxysilane을 가수 분해 및 축 중합시켜서 제조하였다. PAA 용액은 dimethylacetamide 용액 내에서 pyromellitic dianhydride와 oxydianiline 단량체들을 개환 반응으로 합성하였다. End-capped PAA 용액은 PAA 용액에 3-aminopropyltriethoxysilane을 첨가하여 제조하였다. 적외선 분광기, 시차 열분석기, X-선 회절 분석기, 주사 전자현미경 및 인장 강도 시험기를 통하여 PI/silica 혼성체 시편들의 특성을 분석하였다. 혼성체 시편들의 물성은 PI와 silica간의 결합형 및 silica의 함량에 의해 영향을 받는다는 것을 확인하였다.

• 한국막학회:학술대회논문집
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• 한국막학회 1994년도 추계 총회 및 학술발표회
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• pp.56-57
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• 1994

Polyimides are one of the most important classes of highperformance polymers. Due to their excellent electriccal, thermal, and high-temperature mechanical properties. The polyimide and its derivatives have found many applications. But their uses are limited by their poor solubilities. In fact, most polyimides were processed in the form of their precursors, polyamic acid, which were subsequently converted to the imide structure.

• 한국섬유공학회:학술대회논문집
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• 한국섬유공학회 1995년도 추계 학술발표회
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• pp.117-118
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• 1995

• E2M - 전기 전자와 첨단 소재
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• 제11권10호
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• pp.60-65
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• 1998

Deposition conditions, surface morphology, and electrical properties of polyamic acid alkylamine salts (PAAS) Langmuir-Blodgett(LB) films have been investigated through a study of surface pressure-area $\pi$-A isotherms, AFM (atomic force microscopy), and current-voltage characteristics. To obtain the optimum conditions of film deposition, the $\pi$-A isotherms were examined by varying temperature, barrier moving speed, dipping speed, spreading amount of solution etc. The Z-type LB films were made at the surface pressure of 5 mN m-1 and 25 mN m-1 for the AFM study; the former surface pressure forms the gas phase and the latter one forms the solid phase. The LB film made in the gas phase show domains with a size of about 200 A diameter and 70 A height. However, the LB films made in the solid phase show a very smooth surface with 2 A surface roughness. In the current-voltage characteristics measured along the perpendicular direction of the films, ohmic conduction has been observed below 105 V cm-1 and the calculated electrical conductivity is about 10-13 S cm-1. Nonohmic conduction has been observed above = 10-11 V cm and the conduction mechanism can be explained by the Schottky effect.

• Applied Microscopy
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• 제25권1호
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• pp.130-138
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• 1995

TEM specimen preparation methods have been examined to characterize Cu oxide particles in the polyimide film. Polyimide films were prepared by coating polyamic acid onto Cu films which had been deposited on TEM-mask and glass substrates and Cu foil, followed by thermal curing. In case of TEM-mask, direct observation was possible without further preparation. In other cases, TEM specimen were made by separating polyimide film from the substrate. Polyimide films were removed from glass and Cu foil by dissolving glass in HF solution and Cu foil in $H_{2}SO_{4}$ solution. TEM-mask observation confirms that fine $Cu_{2}O$ particles precipitate in the polyimide as a result of reaction of polyamic acid with Cu. However $Cu_{2}O$ particle reacts with HF and $H_{2}SO_{4}$ solution during dissolving the substrate and interpretation could be misled. It is concluded characterization of $Cu_{2}O$ particle in polyimide using TEM-mask is better than other methods.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1997년도 하계학술대회 논문집 C
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• pp.1216-1218
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• 1997

Hydrolysis of BTDA-ODA: MPDA, PMDA-ODA, PIQ polyimides were investigated by FT-IR. The results showed that hydrolysis depends on structure of polyimide and that polyimide obtains hydrolytic stability by curing. Polyimide-aluminum interfaces were characterized by RAIR. It was concluded that imidization of the polyamic acid to polyimde was inhibited by interaction of acid groups with substrate to form aluminum carboxylate.

• 한국전기전자재료학회논문지
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• 제11권8호
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• pp.581-586
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• 1998

This paper describes athermally stimulated displacement current (TSDC) of arachidic acid(AA) and polyamic acid alkylamine salts(PAAS) Langmuir-Blodgett(LB) films, which is a precursor of polyimide(PI). The TSDC measurements of AA LB film were performed from temperature to about 11$0^{\circ}C$ at a rate of 0.2$^{\circ}C$/ｓ inside a vacuum chamber for a reference. And the TSDC measurements PAAS LB film were performed from room temperature to about 25$0^{\circ}C$ and temperature was increased at the same rate as that of AA LB film. They show that there are TSDC peaks at about 7$0^{\circ}C$ in the arachidic acid LB films, and at about 7$0^{\circ}C$ and 16$0^{\circ}C$ in the PAAs LB films. Results of these measurements indicate the one small peak at 7$0^{\circ}C$ is resulted from a softening of the alkyl group and the large peak at 16$0^{\circ}C$ is possibly due to dipole of C-O group in the PASS molecule. We have calculated the vertical component of the AA and PAAs L film out of the TSDC curves. It shows that the dipole moment of the AA LB film is about 70-mD at 7$0^{\circ}C$. And the dipole moment of PAAS LB film is about 040mD at 7$0^{\circ}C$ and about 200mD at 16$0^{\circ}C$ in the first measurement of TSDC. In the second measurement of TSDC of PASS LB film after cooling down to room temperature, the TSDC peaks are almost disappeared.