• The Journal of Advanced Prosthodontics
• /
• v.11 no.2
• /
• pp.81-87
• /
• 2019

PURPOSE. The purpose of this study was to evaluate the effects of various protocols and systems for finishing and polishing monolithic zirconia on surface topography, phase transformation, and bacterial adhesion. MATERIALS AND METHODS. Three hundred monolithic zirconia specimens were fabricated and then treated with three finishing and polishing systems (Jota [JO], Meisinger [ME], and Edenta [ED]) using four surface treatment protocols: coarse finishing alone (C); coarse finishing and medium polishing (CM); coarse finishing and fine polishing (CF); and coarse finishing, medium polishing, and fine polishing (CMF). Surface roughness, crystal phase transformation, and bacterial adhesion were evaluated using atomic force microscopy, X-ray diffraction, and streptococcal biofilm formation assay, respectively. One-way and two-way analysis of variance with Tukey post hoc tests were used to analyze the results (${\alpha}=.05$). RESULTS. In this study, the surface treatment protocols and systems had significant effects on the resulting roughness. The CMF protocol produced the lowest roughness values, followed by CM and CF. Use of the JO system produced the lowest roughness values and the smallest biofilm mass, while the ME system produced the smallest partial transformation ratio. The ED group exhibited the highest roughness values, biofilm mass, and partial transformation ratio. CONCLUSION. Stepwise surface treatment of monolithic zirconia, combined with careful polishing system selection, is essential to obtaining optimal microstructural and biological surface results.

• Journal of the Korean Society for Precision Engineering
• /
• v.16 no.9
• /
• pp.179-190
• /
• 1999

To automate the polishing process, a polishing robot with two axes which is attached to a machining center with three axes has been developed by our previous research. This automatic polishing robot is able to keep the polishing tool normal to the curved surface of die and is able to maintain a constant pneumatic pressure. Therefore, in the case of a curved surface die, the surface roughness to be polished by the system with five axes is improved superior than the surface by a three-axis machining center. However, because the polishing robot was big and heavy, a polishing workspace was limited and then it was difficult to attach the robot to machining center. In this study, the smaller and lighter polishing robot than the previous has been designed to improve defects due to the magnitude and weight of the robot. And the sliding mode control ins applied to polishing robot to improve the tracking performance. To obtain switching parameters of sliding mode control, the signal compression method is used. Code separation program to separate the date for a three-axis machining center and a two-axis polishing robot from a five-axis NC data is improved for users to check conveniently the separated trajectory and to handle many data by using the graphic user interface. To evaluate the polishing performance of the developed robot, the polishing experiment for shadow mask was carried out. The result shows the automatic polishing robot has a good trajectory tracking performance and obtains a good polished workpiece efficiently under recommended polishing conditions.

• Journal of the Korean Society for Precision Engineering
• /
• v.21 no.1
• /
• pp.109-115
• /
• 2004

Polishing process has been applied to get extremely fine surfaces, e.g., mirror surfaces such as optical mirrors, lens, molds and etc. Nowadays not only fine surface quality but also submicron order of dimensional accuracy is required for many applications. To meet the requirements polishing process should be provided with an active control of polishing pressure especially for automation of polishing process. In this paper a study on development of an active polishing pressure control system has been presented. A new type of tool assembly has been developed to facilitate the control. The tool is attached to an axis of a polishing machine with a coil spring and control of the polishing pressure is done by the position control of the axis, which needs no additional actuator. The polishing pressure is successfully measured by the measurement of the spring deformation. Control specifications were quantitatively considered by weighting functions and a controller was designed by using loop-shaping technique based on the no synthesis. Some experiments have been executed on a polishing machine with a PC-NC controller. It is shown that the results were coincident well with the theoretical analyses and satisfied the design specifications.

• Journal of the Korean Society for Precision Engineering
• /
• v.17 no.6
• /
• pp.162-168
• /
• 2000

The automatic die polishing machine by liquid honing has been developed and experimented on the surface of machined die. The goal of development in the automatic die polishing machine by liquid honing is to increase the accuracy and the productivity in die polishing. To reach this goal, the polishing machine consists of the automatic measuring device for contour of die, the nozzle and pumping system to spray the powder mixed with liquid, and the 3-axis guides. Before polishing, the measuring device with a semiconductor laser scans the surface of mould to get the data of contour. The data store a PC and use to control the nozzle head to move above a couple of centimeters on the machined surface of die. The experimental parameters are the spraying time, the pressure, the size of abrasive grain and the mixing ratio between abrasive grain and liquid. The surface roughness is measured on the polished die which are SKDl 1 and Al7075 machined by NC. The surface roughness indicates the values of Rmax 0.5${\mu}{\textrm}{m}$ for Al7075 and Rmax 1.4${\mu}{\textrm}{m}$ for SKDl 1. It reduces the polishing time significantly and reduces the monotonous work for labors. As the results, the liquid honing system is useful method to apply for the die polishing and the automatic die polishing machine using liquid honing shows that it's very effective processing ability.

• 제어로봇시스템학회:학술대회논문집
• /
• 1990.10a
• /
• pp.190-193
• /
• 1990

Die finishing (polishing and lapping) after NC machining is characterized as one bottleneck process for reducing lead time. For automation of this typical manual work, a flexible polishing tool system using industrial robot has been developed. This tool system has three principal functions in order to achieve reduction of waviness, 3 D.O.F. compliance and constant pressure structure. This polishing tool shows that adaptability to free form surface is increased and programmability to various areas of die surface is also acquired.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 1993.10a
• /
• pp.389-394
• /
• 1993

Die making process is classified into design,manufacturing,polishing,assembly, and performance test. Die polishing is not a machining process by cutting edge of tool, but it is finishing by relative cutting movement under the surface contact between grinding particles and workpiece, and this process comprised 30~40% of total manufacturing hours. However, die polishing process is still performed by the skilled workers. Now a days, it is very difficult to secure skilled workers due to the hardworking environment and this situation will be getting worse in the future which has great difficulty of dies and molds industries.This process has the common problem on the elimination of tedious manual polishing among the tool making industries. Therefore this study is aimed at the development of an automatic polishing attachment which could be attached onthe spindle of CNC machine tool and controlled by the NC program data created by CAD/CAM system. As a result, this study will contribute the realization of automatic fine polishing process and improvement of quality level of dies and molds.

• Journal of the Korean Society for Precision Engineering
• /
• v.29 no.3
• /
• pp.266-272
• /
• 2012

This paper has aims to share fundamental knowledge for magnetic abrasive polishing and to mainly introduce recent research results. In order to enhance a magnetic flux density for nonferrous materials, advanced magnetic abrasive polishing system which is called 2nd generation system was established by electro-magnet array table, and the effectiveness of the electromagnet array table was evaluated in real polishing experiments. To increase adhesiveness of the abrasives in high speed polishing, a silicone gel agent was proposed and carbon nanotube particles as new magnetic abrasives were applied in the magnetic abrasive polishing. In addition, a strategy for optimal step-over determination by heuristic algorithm was introduced for applying large size workpiece. Curved surfaces having a uniform radius were simulated and tested with installed electro-magnet array table.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
• /
• 2000.04a
• /
• pp.411-416
• /
• 2000

Cutting process has been automated by progress of CNC and CAD/CAM, but polishing process has been depended on only experiential knowledge of expert. To automate the polishing process, a polishing robot with w degrees of freedom which is attached to a machining center with 3 degrees of freedom has been developed. This automatic polishing robot is able to keep the polishing tool normal on the curved surface of die to improve a performance of polishing. Polishing task for a curved surface die demands repetitive operation and high precision, but conventional control algorithm can not cope with the problem of disturbance such as a change of load. In this research, a new sliding mode control algorithm is applied to the robot. The signal compression method is used to identify polishing robot system. to obtain an effect of 5 degrees of freedom motion, a synchronization between the machining center and polishing robot is accomplished by using M code of machining center. And also a trajectory for polishing the curved surface die by 5 degrees of freedom motion, a synchronization between the machining center and polishing robot is accomplished by using M code of machining center. And also a trajectory for polishing the curved surface die by 5 axes machining center is divided into data of two types for 3 axes machining center and 2 axes polishing robot. To evaluate polishing performance of the robot. various experiments are carried out.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
• /
• 2004.04a
• /
• pp.27-33
• /
• 2004

Electro-theological fluid is recently used for the micro polishing of 3-dimensional micro-aspherical lens. It's also used for polishing small area defects on the wide flat wafer. Since ER fluid shows a behavior of viscosity changing under certain electric fields. micro polishing efficiency may be enhanced for certain cases. In this paper, a perfluorinated carbonyl fluoride oil based ER fluids was used to improve surface polishing rate and submicron-scale accuracy. As the polishing electrodes, micro size cylindrical tools had been used for maximizing the electric field. An experimental device, which was applied for micro polishing a number of wafers of 4inches in size and other workpiece. was made on a precision polishing system. It consisted of a steel electrode. a wafer fixture. l0㎃ current and DC 5㎸ power supply unit, and a controller unit. From the Experiments. the ER fluid is applicable for micro polishing of small parts.

• Journal of the Semiconductor & Display Technology
• /
• v.13 no.1
• /
• pp.13-17
• /
• 2014

Since the semiconductor manufacturing requires the silicon wafers with extraordinary degree of surface flatness, the surface polishing of wafers from ingot cutting is an important process for deciding surface quality of wafers. The present study introduces the development of wafer polishing equipment and, especially, the wafer polishing head that employs the forced self-driving of installed silicon wafer as well as the wax wafer mounting technique. A series of wafer polishing tests have been carried out to investigate the effects of self-driving function in wafer polishing head. The test results for wafer planarization showed that the LLS counts and SBIR of polished wafer surfaces were generally improved by adopting the self-driven polishing head in wafer polishing stations.