• Proceedings of the Korean Society for Agricultural Machinery Conference
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• 1997.06c
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• pp.141-149
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• 1997

Structural characteristic of a rice polisher of small size was analyzed to improve its performance and to utilize such data in developing a rice polisher of large size. Spraying characteristic of nozzles which were used for rice polishing was evaluated by a machine vision system. Internal pressure of the polishing chamber was also measured according to outlet resistance, water spraying, and roller shaft speed. In addition, the performance of the polisher was analyzed based on whiteness and broken ratio according to operating conditions.

• Journal of the Korean Society for Precision Engineering
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• v.30 no.12
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• pp.1259-1264
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• 2013

This study has focused on the application of magnetic assisted polishing for ELID ground surface of aluminum oxide ceramics. Aluminum oxide ceramics has been widely used as advanced materials for electric, optic, mechanic, chemical usage and so on. In this study, ELID grinding and magnetic assisted polishing technology was adopted for high-effective manufacturing and high quality surface of ceramic parts. The characteristic of MAP machining have been evaluated by the value of surface roughness and surface profile before and after magnetic assisted polishing. As the results of experiments, the surface roughness after magnetic assisted polishing has shown a significant improvement and the surface roughness was more improved when the feed rate of tool became slow.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.11a
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• pp.360-361
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• 2005

Rapid progress in IC fabrication technology has strong demand in polishing of silicon wafer to meet the tight specification of nanotopography and surface roughness. One of the important issues in Si CMP is the stabilization of polishing pad. If a polishing pad is not stabilized before main Si wafer polishing process, good polishing result can not be expected. Therefore, new pad must be subjected into break-in process using dummy wafers for a certain period of time to enhance its performance. After the break-in process, the main Si wafer polishing process must be performed. In this study, the characteristics of break-in process were investigated in Si wafer polishing. Viscoelastic behavior, temperature variation of pad and friction were measured to evaluate the break-in phenomenon. Also, it is found that the characteristic of the break-in seems to be related to viscoelastic behavior of pad.

• Design & Manufacturing
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• v.11 no.2
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• pp.51-56
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• 2017

Nitinol, a shape memory alloy (SMA), is manufactured from titanium and nickel and it used in various fields such as electrical applications, micro sensors. It is also recommended as a material in medical for implant because it has excellent organic compatibility. Nitinol is intended to be inserted into the human body, products require a high-quality surface and low residual stress. To overcome this problems, explore electrolyte polishing (EP) is being explored that may be appropriate for use with nitinol. EP is a particularly useful machining method because, as a non contact machining method, it produces neither machining heat nor internal stress in the machined materials. Sandpaper polishing is also useful machining method because, as a contact machining method, it can easily good surface roughness in the machined materials. The electrolyte polishing (EP) process has an effect of improving the surface roughness as well as the film polishing process, but has a characteristic that the residual stress is hardly generated because the work hardened layer is not formed on the processed surface. The sandpaper polishing process has the effect of improving the surface roughness but the residual stress remains in the surface. We experimented with three conditions of polishing process. First condition is the conventional polishing. Second condition is the electrochemical polishing(EP). And Last condition is a mixing process with the conventional polishing and the EP. Surface roughness and residual stress of the nitinol before a polishing process were $0.474{\mu}mRa$, -45.38MPa. Surface roughness and residual stress of the nitinol after mixing process of the conventional polishing and the EP were $1.071{\mu}mRa$, -143.157MPa. Surface roughness and residual stress of the nitinol after conventional polishing were $0.385{\mu}mRa$ and -205.15MPa. Surface roughness and residual stress of sandpaper and EP nitinol were $1.071{\mu}mRa$, -143.157MPa. The result shows that the EP process is a residual stress free process that eliminates the residual stress on the surface while eliminating the deformed layer remaining on the surface through composite surface machining rather than single surface machining. The EP process can be used for biomaterials such as nitinol and be applied to polishing of wafers and various fields.

• Journal of Biosystems Engineering
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• v.23 no.3
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• pp.245-252
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• 1998

The structural characteristics of a small scale rice polisher was analyzed to improve its performance. Spraying characteristic of nozzles used for rice polishing was also analyzed by a machine vision system. The internal pressure of the polishing chamber was measured according to outlet resistance, water spraying, and roller shaft speed. In addition, the performance of the rice polisher was evaluated to improve it in the basis of internal pressure in polishing chamber, whiteness, and broken rice ratio of clean rice according to the operating conditions. Actual nozzle discharge rate and drop size were 125 cc/min and 86~97 ${\mu}{\textrm}{m}$, respectively. In the case of water spraying on rices, the internal pressure showed 4.9~9.8N/$\textrm{cm}^2$ increase. broken rice ratio decreased, and there was no difference in whiteness. The internal pressure inueased up to two times with the increase of the outlet resistance. Also, the pressure at the upper part of screen was one and half times as high as the pressure at the lower part. In the case of water spraying rate of 150 cc/min, the roller shaft speed of 850 rpm resulted in no difference in whiteness and decrease of 0.3% in broken rice ratio, comparing to the roller shaft speed of 950 rpm.

• Proceedings of the Korean Society for Agricultural Machinery Conference
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• 1998.06b
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• pp.206-216
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• 1998

The structural characteristics of small scale rice polisher was analyzed to improve its performance. Spraying characteristic of nozzles used for rice polishing was also analyzed by a machine vision system. The internal pressure of the polishing chamber was measured according to outlet resistance, water spraying , and roller shaft speed. In addition , the performance of the rice polisher was evaluated to improve it in the basis of internal pressure in polishing chamber, whiteness , and broken rice ratio of clean rice according to the operating conditions. Actual nozzle discharge rate and drop size were 125cc/min and 86.97㎛, respectively. In the case of water spraying on rices, the internal pressure showed 4.9-9.8N/㎠ increase, broken rice ration decreased , and there was no difference in whiteness . The internal pressure increased up to two time with the increase of the outlet resistance. Also, the pressure at the upper part of screen was one and half times as high as the pressure at the lower part. In the case of water spraying rate of 150 cc/min, the roller shaft speed of 850 rpm resulted in no difference in whiteness and decrease of 0.3%in broken rice ratio, comparing to the roller shaft speed of 950 rpm.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.21 no.4
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• pp.601-607
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• 2012

The magnetic abrasive polishing (MAP), for online monitoring with AE sensor attachment, was performed in this study. To predict the surface roughness after the magnetic abrasive polishing of NAK80, the signal data acquired from the AE sensor were analyzed. A dimensionless coefficient, which consisted of average of AErms and standard deviation of AE signal, was defined as a characteristic of the MAP and a prediction model was obtained using least square method. A neural network, which had multiple input parameters from AE signals and polishing conditions, was applied for predicting the surface roughness. As a result of this study, it was seen that there was very close correlation between the AE signal and the surface roughness in the MAP. And then on-line prediction of the surface roughness after the MAP of the NAK80 was possible by the developed prediction model.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.11a
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• pp.65-65
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• 2003

Chemical mechanical polishing (CMP) is one of the most important processes in recent ULSI (Ultra Large Scale Integrated Circuit) manufacturing technology. Recently, ceria slurries with surfactant have recently been used in STI-CMP,[1] became they have high oxide-to-nitride removal selectivity and widen the processing margin The role of the abrasives, however, on the effect of planarization on STI-CMP is not yet clear. In this study, we investigated how the crystal characteristic affects the planarization efficiency of wafer surface with controlling crystallite size and poly crystalline abrasive size independently.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.206-209
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• 2002

The fixed abrasive pad(FAP) has been introduced in chemical mechanical polishing(CMP) field recently. In comparison with the general CMP which uses the slurry including abrasives, FAP takes advantage of planarity. resulting from decreasing pattern selectivity and defects such as dishing due to the reduction of abrasive concentration especially. This paper introduces the manufacturing technique of $Al_2$O$_3$-FAP using hydrophilic polymers with swelling characteristic in water and explains the self.texturing phenomenon. It also focuses on the chemical effects on tungsten film and the FAP is evaluated on the removal rate as a function of chemicals such as oxidizer, catalyst, and acid. The removal rate is achieved up to 1000A1min as about 70 percents of the general one. In the future. the research has a plan of the advanced FAP and chemicals in tungsten CMP considering micro-scratch, life-time, and within wafer non-uniformity.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.13 no.1
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• pp.92-99
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• 2014

An aspherical lens, which resolves several problems with a spherical lens,typically serves asa key part of an optical system. Generally, an aspherical lens is fabricated using a diamond turning machine or by mean of injection molding. However, residual stress and/or tool marks can arise when using a commercial fabricating method such as DTM or injection molding. A polishing process, thus, is commonly used to obtain a high-precision aspherical lens. In this study, a polishing method using MR fluid was applied to minimize several problems, in this case residual stress and the creation of tool marks, during the cutting process. The MR polishing system was developed to polish aspherical lenses. A series of experiments were performed to obtain a very fine surface roughness. PMMA (the lens material for molding) was used as a workpiece, and the gap size, magnetic field intensity, wheel speed and feed rate were selected as the parameters in this study. Finally, a very fine surface roughness of Ra=2.12nm was obtained after MR polishing.