• Journal of the Korean Society for Precision Engineering
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• v.31 no.12
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• pp.1061-1066
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• 2014

Generally electrical circuits are fabricated as PCB(Printed Circuit Board) and mounted on a casing of the product. And it requires lots of other parts and some labor for assembly. Recently a molding technology is increasingly applied to embed simple circuits on a plastic casing. The technology is called as MID(Molded Interconnected Device). Therefore this paper introduces a new MID fabrication process by using direct 3D printing technology.

• Journal of the Korean Society for Precision Engineering
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• v.13 no.11
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• pp.32-37
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• 1996

Using the are ion plating(AIP) process, TiN coating was deposited onto high speed steel substrates. The effects of coating thickness, titanisum interlayer and shield on wear resisting capability of the coated tools were investigated. In order to promote good adhesion between the substrate and the TiN coating a thin Ti interlayer was deposited. A shield was set up also between Ti target and high speed steel substrates to prevent molten droplets from reaching the substrate. Three series of varying thickness of TiN coated layer were prepared with or without the Ti interlayer, and with or without the shield. The tools with the Ti layer and the shield showed longer tool lifes than those of other series of tools and the commercially available TiN coated HSS tools, by up to 70%.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2004.08a
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• pp.91-97
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• 2004

The drawbead is one of the most important factors in sheet metal forming for automotive parts. So clarifying the friction characteristics between sheets and drawbead is essential to improve the formability of sheet metal. Therefore in this study, drawbead friction test was performed at various bead materials(FC300, HC891, FCD550, HD700, HK600, HK700, SKD11) and surface treatment of beads(Base, induction hardening, Cr plating, ion nitriding, Toyoda diffusion process, TiCN, TiN, CrN). Circular shape bead has been used for the test. The results show that friction and drawing characteristics were mainly influenced by surface treatment.

• Journal of Welding and Joining
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• v.12 no.4
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• pp.110-116
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• 1994

This paper has been researched bondability of electronics devices, such as lead frame and the thick film of Ag/Pd on an alumina substrate by different heat sources. To obtain the bonds with high quality, it is very important to consist of different materials. Therefore, this paper clarifies not only heat mechanism of micro parallel gap resistance bonding method and pulse heat tip bonding method but also investigates selection of heat sources with micro-electronic materials for bonding. Finally, it is realized fluxless bonding process with filler metal such as plating layers.

• Journal of the Korean Society of Safety
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• v.12 no.4
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• pp.93-101
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• 1997

A modified procedure for electroplating wastewater treatment using formaldehyde and hydrogen peroxide can destroy free cyanide. The representative diagram which is quite sensitive on reaction temperature is showed for this kinds of treatment. Principally free cyanide and some kinds of cyanide complex should be treated first, and then toxic heavy metals can be removed because cyanide component will be inhibited to remove other pollutants, if it is not destroyed perfectly. Formaldehyde and hydrogen peroxide are added in controlled amounts to cyanide treatment tank. Reasonable amounts of these chemicals are (HCHO/CN)=0.9 and ($H_2O_2/CN$)=1.1 in molar ratios, it is also variable on reaction temperature. Of course, actual treatment processes depending on plating material and chemical are good applicable, also to systematize operation manual for treating electroplating wastewater process, further works are desirable.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1999.10a
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• pp.307-314
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• 1999

By using AIP(Arc Ion Plating) of a physical vapor deposition for the first time in Korea a ceramic tool whose surface is coated single layeredly with TiN is developed. In addition, cutting resistance appearing in the process of finishing cut of hardened carbon tool steel, STC3 is studied. The principal and radial components of cutting resistance in those cutting conditions appear to be the same or similar, and the feed component is relatively small. The feed component is found to be in proportion to cutting width, and the radial component in proportion to cutting thickness. Owing to coating the cutting resistance of a TiN coated ceramic tool increases compared with that of a general ceramic tool.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.256-259
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• 2008

An micro-probe tip must be manufactured using thin film to evaluate integrity of the semiconductor with narrow distance between pads. In this study, fatigue tests were performed for BeCu thin film which is used in micro-probe tip of semiconductor test machine. The thin film was manufactured by electro plating process, and the specimens were fabricated by wire-cut electric discharge method to make hour glass type specimen of $5000{\mu}m$ width, $29200{\mu}m$ length and $30{\mu}m$ thickness. The fatigue test of load control with 10Hz frequency was performed, in ambient environment. The fatigue cycles were tension-tension with mean stress, at stress ratio, R=0.1.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1994.11a
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• pp.206-209
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• 1994

This paper has been researched bondability of electronic devices, such as lead frame and thick film of Ag/Pd on an alumina substrate by different heat sources. To obtain the bonds with high quality, it is very important to control both the thermal distribution of the bonds and it stability, because electronics components is consist of different materials. Therefore, this paper clarifies not only heat mechanism of micro parallel gap resistance bonding method and pulse heat tip bonding method but also investigates selection of heat sources with micro-electronic materials for bonding. Finally, it is realzed fluxless bonding process with filler metal such as plating layers.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.11a
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• pp.284-284
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• 2015

반도체 Ball Grid Array(BGA)에 사용되던 종래의 Solder Ball은 Sn96.3 Ag3.0 Cu0.7의 용융솔더를 이용하여 제작하고 있다. 이는 SMT Reflow공정에서 BGA Ball의 퍼짐현상으로 인해 원래의 Ball Height에 영향을 미쳐 접합불량의 원인이 되고 있다. 이러한 문제를 해결하기 위해 Copper Core Ball위에 SnAgCu 삼원합금도금공정을 이용해 문제점을 해결하고자 했으며, 본 실험을 통해 구현한 CCSB를 이용해 SMT Reflow를 진행한 결과 종래의 BGA Ball보다 우수한 효과를 확인할 수 있었다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2014.11a
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• pp.127-128
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• 2014

현재 기술 산업에서 PET위 무전해 도금을 실행하기 위해 다양한 전처리 공정과 Catalyst가 소개되고 있다. 그 중에서 가장 일반적으로 사용되고 있는 Catalyst는 Palladium으로서 Tin과 산화 환원 반응으로 Electroless Copper Deposition 단계에서 구리 도금의 Target으로 작용하고 있다. 하지만 상대적으로 Palladium은 생산 비용이 높으며 Tin은 쉽게 산화되는 문제점이 남아 있다. 이를 대체하기 위한 대안 공정으로서 Palladium 대신 Silver를 이용하여 Catalyst로서의 역할을 하는 공정이다. 이전에 PET위 전처리 공정으로 Ultra Violet을 사용하여 표면을 개질 시키는 방법을 연구했으며, 그 후 Potassium Permanganate와 Silver Catalyst의 Mechanism을 연구 했다. PET 표면 개질을 거치면서 화학 구조가 바뀌어 표면에 Carbon Carbon Double Bond를 형성한다. 이때 Permanganate ion이 새로이 형성된 이중 결합과 반응하여 두 개의 extra-OH functional group을 생성함과 동시에 $MnO_2$를 만들어 표면에 흡착 시킨다. $MnO_2$는 전위차에 의해 Silver Ion과 Redox Reaction을 일으키며 실질적인 Catalyst 역할을 하게 된다. Silver Catalyst는 무전해 구리 도금 용액 안에서 Copper의 Target으로 작용한다.