• Title/Summary/Keyword: plating process

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Behavior of Tin and Palladium for Electroless Plating on bariumtitanate ceramics.(Part 1:Study with Electron Spertroscopy for Chemical Analysis) (티탄산바륨세라믹의 무전해도금을 위한 Sn 및 Pb 촉매의 거동 (제1부: Electron Spertroscopy for Chemical Analysis에 의한 연구))

  • 박광자
    • Journal of the Korean institute of surface engineering
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    • v.23 no.3
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    • pp.144-149
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    • 1990
  • X-ray phtoelectron spectroscopy has been used to obtain information on the behavior of the Pb catalysis and Sn sensitizer on the bariumtitanate ceramic substrate. SnF2 sensitization and PbCl2 activation process are used are used to prepare nonconductive substrate for electroless plating. This method of surface preparation is compared to Pd-Sn mixed solu tions and Ag pretreatment process. In all the case, the bonding energy is about 487.5eV for Sn and 336.5~337.5eV for Pb.

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A Study on the Pd-Ni Alloy Hydrogen Membrane using the Porous Nickel Metal Support (다공성 Ni 금속 지지체를 사용한 Pd-Ni 합금 수소 분리막 연구)

  • Kim Dong-Won;Um Ki-Youn;Kim Sang-Ho;Park Jong-Su
    • Journal of the Korean institute of surface engineering
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    • v.37 no.5
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    • pp.289-295
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    • 2004
  • A dense palladium-nikel (Pd-Ni) alloy composite membrane has been fabricated on microporous nickel support mixed with submicron/micron nickel powder instead of mesoporous stainless steel support. Plasma treatment process is introduced as pre-treatment process instead of HCI activation. Pd-Ni alloy composite membrane prepared by electro plating was fairly a uniform and dense surface morphology. The membrane was characterized by permeation experiments with hydrogen and nitrogen gases at temperature 773 K and pressure 2.2 psi. The results showed that hydrogen ($H_2$) permeance was 27 ml/$\textrm{cm}^2$ㆍatmㆍmin and hydrogen/ nitrogen ($_H2$$N_2$) selectivity was 8 at 773 K.

Improvement of surface defects by pre-treatment process capability upgrade in plating process (도금공정 전처리 성능개선을 통한 표면결함 개선)

  • O, Min-Yeong
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2015.11a
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    • pp.193-193
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    • 2015
  • 도금공정에 있어서 전처리는 제품품질을 확보하는데 중요한 단계이다. 전처리 공정의 주요인자중 처리액의 온도, 처리시간, 교반력, 오염도를 개선함으로써 제품의 산화막 및 오염물질을 효과적으로 제거할 수 있었다.

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The Volar Plating of Fracture of the Coronoid Process - Report of Two Cases - (구상돌기 골절에서 내측 접근법을 통한 전방 금속판 고정술 - 2예 보고 -)

  • Jung, Gu-Hee;Cho, Chul-Hyun;Jang, Jae-Ho;Kim, Jae-Do
    • Clinics in Shoulder and Elbow
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    • v.13 no.2
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    • pp.260-265
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    • 2010
  • Purpose: To report the clinical results of two cases of coronoid process fractures that were treated with volar plating through a medial approach. Materials and Methods: Two fractures of the coronoid process that needed to be fixed were managed with open reduction and internal fixation through a medial approach using 2.4 mm locking compression plates (Compact Hand set$^{(R)}$, Synthes, Switzerland). The patients were followed up for 14 months and 17 months and were evaluated using the Mayo Elbow Performance Score (MEPS). Results: The MEPS was 95 for Case 1 and 100 for Case 2. Active elbow joint motions were $5^{\circ}-120^{\circ}$ (Case 1) and $0^{\circ}-130^{\circ}$ (Case 2). Supination and pronation fully recovered. Conclusion: Satisfactory results can be obtained in cases of coronoid process fractures because volar plating through a medial approach allows sound fixation and early mobilization of the elbow joint.

Antioxidation Behavior of Submicron-sized Cu Particles with Ag Coating (서브 마이크론급 구리 입자의 은도금 공정에 따른 내산화성 강화 연구)

  • Choi, Eun Byeol;Lee, Jong-Hyun
    • Journal of the Microelectronics and Packaging Society
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    • v.23 no.3
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    • pp.51-56
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    • 2016
  • To fabricate a copper (Cu)-based fine conductive filler having antioxidation property, submicron silver (Ag)-coated Cu particles were fabricated and their antioxidation property was evaluated. After synthesizing the Cu particles of $0.705{\mu}m$ in average diameter by a wet-reduction process, Ag-coated Cu particles were fabricated by successive Ag plating using ethylene grycol solvent. Main process parameters in the Ag plating were the concentration of reductant (ascorbic acid), the injection rate of Ag precursor solution, and the stirring rate in mixed solution. Thus, Ag plating characteristics and the formation of separate fine pure Ag phase were observed with different combinations of process parameters. As a result, formation of the separate pure Ag phase and aggregation between Ag-coated Cu particles could be suppressed by optimization of the process parameters. The Ag-coated Cu particles which were fabricated using optimal conditions showed slight aggregation, but excellent antioxidation property. For example, the particles indicated the weight gain not exceeding 0.1% until $225^{\circ}C$ when they were heated in air at the rate of $10^{\circ}C/min$ and no weight gain until 75 min when they were heated in air at $150^{\circ}C$.