• Transactions of the Korean Society of Mechanical Engineers
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• v.18 no.4
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• pp.977-985
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• 1994

New computer-aided calibration methods for the hot-wire and split film probes are presented. The proposed modified king's law takes into account instantaneous flow angle as well as the variation of calibration coefficients due to the total velocity magnitude change. It is found that the look-up table method has many advantages with respect to the accuracy on data and reducing run time for calibration over other conventional methods. In order to investigate the local sensitivity of the static calibration, a dynamic calibration procedure is also carried out.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.2
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• pp.53-57
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• 2014

Thin glass (< 100 microns) is a promising material from which advanced interposers for high density electrical interconnects for 2.5D chip packaging can be produced. But thin glass is extremely brittle, so mechanical micromachining to create through glass vias (TGVs) is particularly challenging. In this article we show how laser processing using deep UV excimer lasers at a wavelength of 193 nm provides a viable solution capable of drilling dense patterns of TGVs with high hole counts. Based on mask illumination, this method supports parallel drilling of up over 1,000 through vias in 30 to $100{\mu}m$ thin glass sheets. (We also briefly discuss that ultrafast lasers are an excellent alternative for laser drilling of TGVs at lower pattern densities.) We present data showing that this process can deliver the requisite hole quality and can readily achieve future-proof TGV diameters as small $10{\mu}m$ together with a corresponding reduction in pitch size.

• Journal of the Korean Society for Nondestructive Testing
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• v.25 no.6
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• pp.459-466
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• 2005

The scanning laser source (SLS) technique has been proposed recently as an effective way to investigate small surface-breaking defects, By monitoring the amplitude and frequency changes of the ultrasound generated as the SLS scans over a defect, the SLS technique has provided enhanced signal-to-noise performance compared to the traditional pitch-catch or pulse-echo ultrasonic methods, An extension of the SLS approach to map defects in microdevices is proposed by bringing both the generator and the receiver to the near-field scattering region of the defects, To facilitate near-field ultrasound measurement, silicon microcantilever probes are fabricated using microfabrication technique and their acoustical characteristics are investigated, Then, both the laser-generated ultrasonic source and the microcantilever probe are used to monitor near-field scattering by a surface-breaking defect.

• Journal of Advanced Marine Engineering and Technology
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• v.26 no.1
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• pp.83-89
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• 2002

In the present study, heat transfer characteristics of oil flow over offset strip fins were predicted by the numerical methods. Oil flow in the plate-fin passage was idealized by 2 dimensions. The flow patterns and heat transfer characteristics were predicted in details. Numerical results shows that the average convective heat transfer coefficients are almost independent on the raws of fins and affected by fin pitches. At the rear face of fin, there exists minimum point of heat transfer coefficients where stream are separated from the fin surfaces. The convective heat transfer coefficients were effected by separation bubbies which appeared at the wake region of offset strip fins.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1553-1555
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• 2008

Super-hydrophobic treated Polyimide film was used as a flexible substrate for developing a new method of metallization. Hydrophilic patterns were fabricated by IN irradiation through shadow mask. Patterned super-hydrophobic substrate was dipped into a bath containing silver nano ink Silver ink was only coated on hydrophilic patterned area. Metal lines of $600{\mu}m$ pitch were fabricated successfully. However, their thickness was too thin to serve as interconnection. To overcome this problem, iterative dipping was conducted. After repeating five times, the thickness of silver metal lines were increased to over than $2{\mu}$. After heat treatment of silver lines, their resistivities were reduced to order of $30{\mu}{\Omega}$-cm the similar level of values reported in other literatures. So, a new method of metallization has high potential for application of RFID antenna and flexible electronics substrates.

• Proceedings of the KSME Conference
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• 2003.11a
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• pp.598-603
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• 2003

A CFD analysis has been performed to investigate turbulent heat transfer in a triangular rod bundle with a pitch-to-diameter ratio(P/D) of 1.06. Anisotropic turbulence models predicted the turbulence-driven secondary flow in the triangular subchannel and the distributions of time mean velocity and temperature showing significantly improved agreement with the measurements over the linear standard ${\kappa}-{\varepsilon}$. The anisotropic turbulence models predicted turbulence structure in large flow region fairly well but could not predict the very high turbulent intensity of azimuthal velocity observed in narrow flow region(gap).

• Korean Journal of Materials Research
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• v.17 no.7
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• pp.347-351
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• 2007

Vertical interconnect technology called 3D stacking has been a major focus of the next generation of IC industries. 3D stacked devices in the vertical dimension give several important advantages over conventional two-dimensional scaling. The most eminent advantage is its performance improvement. Vertical device stacking enhances a performance such as inter-die bandwidth improvements, RC delay mitigation and geometrical routing and placement advantages. At present memory stacking options are of great interest to many industries and research institutes. However, these options are more focused on a form factor reduction rather than the high performance improvements. In order to improve a stacked device performance significantly vertical interconnect technology with wafer level stacking needs to be much more progressed with reduction in inter-wafer pitch and increases in the number of stacked layers. Even though 3D wafer level stacking technology offers many opportunities both in the short term and long term, the full performance benefits of 3D wafer level stacking require technological developments beyond simply the wafer stacking technology itself.

• Transactions of the Society of Information Storage Systems
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• v.1 no.1
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• pp.67-72
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• 2005

This study proposes a design methodology to determine the optimum configurations of the optical flying head (OFH) for near-field recording systems. Since the OFH requires stricter static and dynamic characteristics of slider air-bearings within an optical tilt tolerance over the entire recording band, an optimum design to keep the focusing and tracking ability stable is essential. The desired flying characteristics considered in this study are to minimize the variation in flying height between the SIL and the disk from a target value, satisfying the restriction of the minimum flying height, to keep the pitch and roll angles within an optical tilt tolerance, and to ensure a higher air-bearing stiffness. Simulation results demonstrate the effectiveness of the proposed design methodology by showing that the static and dynamic flying characteristics of the optimally designed OFH are enhanced in comparison with those of the initial. The gap between the SIL and the disk can be kept at less than 100 nm even if the optical tilt tolerance of the SIL is considered.

• 제어로봇시스템학회:학술대회논문집
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• 2000.10a
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• pp.92-92
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• 2000

Helicopter offer the signigicant advantage over traditional air vehicles, in that the provide extended maneuverability, such as vertical climb, hovering, longitudinal and lateral flight, hovering turns and bank turns. But helicopter have the strong cross couplings and nonlinearities for each lateral, longitudinal and rotational motion mutually. However, it is possible to ignore this couplings for the hovering condition, so using this properties we can control the attitude of helicopter. That is, by implementing the dynamic of each rotational axis(roll, pitch, yaw) of independent mutually, 3-DOF(degree of Freedom) attitude control for the helicopter is possible. In this paper, we identify decoupled input-coutput relations of each three rotational axis about the helicopter mounted on the 3-DOF gimbal by experiment, and on these basis implement 3-DOF attitude controller using the PID control method.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.05a
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• pp.442-446
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• 1999

Melting behavior and bridge phenomenon of solder paste, which is essential for surface mount technology in packaging, were investigated. solder paste of Sn-37%Pb was printed on Sn-coated Cu-pattern of PCB, and heated over melting point. Melting behavior of the paste was observed using CCD-camera. In order to modelize the melting and agglomeration phenomena of the paste, two solder balls of 0.76mm diameter were used. As experimental results, the paste start to melt from the margin of the printed shape. The hight of the melted paste decreased from 270 $\mu$m to 200 $\mu$m firstly, and finally recovered to 250 $\mu$m. During the melting procedure, pores were evolved from the molten paste. Bridge Phenomenon of the molten Paste depends upon the pitch of the pattern.