• 한국표면공학회지
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• 제21권3호
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• pp.114-129
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• 1988

The principles of the physical vapour deposition processes(PVC); evaporation, sputting, and ion plating are presented and compared with each other with respect to coating properties, deposition rate and process control. The significance of coating sources and vacuum equipment for hard materials coating is discussed.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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• pp.729-730
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• 2006

The research involves the development of a powder metallurgical route for producing good quality TiAl targets for making physical vapour deposition (PVD) coatings. Mixtures of elemental titanium and aluminium powders were mechanically milled using a novel discus milling technique under various conditions. Hot isotropic pressing (HIP) was then employed for consolidation of the mechanically alloyed powders. A cathodic arc vapour deposition process was applied to produce a TiAlN coating. Microstructural examination was conducted on the target material and PVD coatings, using X-ray diffractometry (XRD), X-ray photoelectron spectrometry (XPS) and scanning electron microscopy (SEM). It has been found that combining mechanical alloying and HIP enable us to produce fairly good quality of TiAl based target. The PVD coatings obtained from the TiAl target showed very high microhardness values.

• The Korean Journal of Ceramics
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• 제2권4호
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• pp.177-180
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• 1996

Considerable progress in the development of CVD techniques for the deposition of diamond films has been achieved recently. Despite the polycrystalline structure of this material, its physical properties are now approaching those of natural type IIa diamond crystals. This paper will given some insight into the current status of CVD diamond thechnology with emphasis on optical and thermal applications. The role of process gas impurities like nitrogen will be discussed.

• 한국진공학회지
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• 제8권3A호
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• pp.194-200
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• 1999

In this paper studied was the piezoelectric properties of the $\beta$-PVDF organic thin films prepared by physical vapour deposition method. The molecular orientation of organic thin films was controlled by the application of an electric field and variation of substrate temperature during the evaporation process. Optimum conditions of manufacturing $\beta$-PVDF organic thin film by physical vapor deposition method is to keep at the substrate temperature of $80^{\circ}C$, at the applied electric field of 142.8 kV/cm. The voltage output coefficient increased from 1.39 to 7.04V increasing the force moment.

• Nuclear Engineering and Technology
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• 제52권3호
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• pp.597-609
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• 2020

Accident Tolerant Fuels have been widely studied since the Fukushima-Daiichi accident in 2011 as one of the options on how to further enhance the safety of nuclear power plants. Deposition of protective coatings on nuclear fuel claddings has been considered as a near-term concept that will reduce the high-temperature oxidation rate and enhance accidental tolerance of the cladding while providing additional benefits during normal operation and transients. This study focuses on experimental testing of Zr-based alloys coated with Cr-based coatings using Physical Vapour Deposition. The results of long-term corrosion tests, as well as tests simulating postulated accidents, are presented. Zr-1%Nb alloy used as nuclear fuel cladding serves as a substrate and Cr, CrN, Cr_xN_y layers are deposited by unbalanced magnetron sputtering and reactive magnetron sputtering. The deposition procedures are optimized in order to improve coating properties. Coated as well as reference uncoated samples were experimentally tested. The presented results include standard long-term corrosion tests at 360℃ in WWER water chemistry, burst (creep) tests and mainly single and double-sided high-temperature steam oxidation tests between 1000 and 1400℃ related to postulated Loss-of-coolant accident and Design extension conditions. Coated and reference samples were characterized pre- and post-testing using mechanical testing (microhardness, ring compression test), Thermal Evolved Gas Analysis analysis (hydrogen, oxygen concentration), optical microscopy, scanning electron microscopy (EDS, WDS, EBSD) and X-ray diffraction.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2012년도 춘계학술발표회 논문집
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• pp.277-277
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• 2012

New concept of coating process, which is called Electro Magnetic Levitation-Physical Vapour deposition (EML-PVD) was developed and investigated. Zinc coating was performed and succeeded for the first time on the steel strip (Cold-rolled Steel) in a continuos pilot line using the EML-PVD process which is specialized in the high deposition rate and high vapor yield. EML-PVD will be expected to be the next generation coating technology to be applied to the steel industry.

• Journal of Advanced Marine Engineering and Technology
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• 제18권2호
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• pp.54-63
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• 1994

Mg thin films were prepared on SPCC(cold-rolled steel) substrates by vasuum evapoaration and ion-plating. The influence of argon gas pressure and substrates bias voltage on the crystal orientation and morphology of the film was determined by using X-ray diffraction and scanning electron micrography (SEM), respectively. And the effect of crystal orientation and morphology of the Mg thin films on corrosion behavior was estimated by measuring the anodic polarization curves in deaerated 3% NaCl solution. The crystal orientation of the Mg films deposited at high argon gas pressure exhibited a (002) preferred orientation, regardless of the substrate bias voltage. Film morphology changed from a columnar to a granular structure with the increase of argon gas pressure. The morphology of the films depended not only on argon gas pressure but also bias voltage ; i.e., the effect of increasing bias voltage was similar to that of decreasing argon gas pressure. The influences of argon gas pressure and bias voltage were explained by applying the adsorption inhibitor theory and the sputter theory. And also, this showed that the corrosion resistance of the Mg thin films can be changed by controlling the crystal orientaton and morphology.

• 한국표면공학회지
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• 제33권5호
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• pp.319-328
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• 2000

Silver is known to have such characteristics as low shear strength, good transfer-film forming tendency, and good corrosion resistance. Silver thin films have been prepared by ion plating of physical vapour deposition (PVD) using both argon gas pressure and bias voltage of processing condition. After the silver films were prepared, the properties in them were examined by gas pressure and bias voltage of substrate. Their morphology and crystal orientation were investigated by scanning electron microscopy (SEM) and X-ray diffractor. The properties of film were, also, studied to relate with morphology, X-ray diffraction pattern, and friction coefficient at vacuum ambient. The friction coefficient was stabilized remarkably on deposited films with increasing argon pressure for deposition. Also, the effect of increasing of the bias voltage for deposition resulted in lower friction coefficient and stability in $1.7$\times$10^{-4}$ torr. On the contrary, behavior of friction coefficient was stabilized on deposited films with decreasing the bias voltage in $1.7$\times$10^{-5}$ torr for deposition.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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• pp.257-257
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• 2016

최근에 메모리의 초고속화, 고집적화 및 초절전화가 요구되면서 resistive random access memory (ReRAM), ferroelectric RAM (FeRAM), phase change RAM (PRAM)등과 같은 차세대 메모리 기술이 활발히 연구되고 있다. 다양한 메모리 중에서 특히 resistive random access memory (ReRAM)는 빠른 동작 속도, 낮은 동작 전압, 대용량화와 비휘발성 등의 장점을 가진다. ReRAM 소자는 절연막의 저항 스위칭(resistance switching) 현상을 이용하여 동작하기 때문에 SiOx, AlOx, TaOx, ZrOx, NiOx, TiOx, 그리고 HfOx 등과 같은 금속 산화물에 대한 연구들이 활발하게 이루어지고 있다. 이와 같이 다양한 산화물 중에서 AlOx는 ReRAM의 절연막으로 적용되었을 때, 우수한 저항변화특성과 안정성을 가진다. 하지만, AlOx 박막을 형성하기 위하여 기존에 많이 사용되어지던 PVD (physical vapour deposition) 또는 CVD (chemical vapour deposition) 방법에서는 두께가 균일하고 막질이 우수한 박막을 얻을 수 있지만 고가의 진공장비 사용 및 대면적 공정이 곤란하다는 문제점이 있다. 한편, 용액 공정 방법은 공정과정이 간단하여 경제적이고 대면적화가 가능하며 저온에서 공정이 이루어지는 장점으로 많은 관심을 받고 있다. 본 연구에서는 sputtering 방법과 용액 공정 방법으로 형성한 AlOx 기반의 ReRAM에서 메모리 특성을 비교 및 평가하였다. 먼저, p-type Si 기판 위에 습식산화를 통하여 SiO2 300 nm를 성장시킨 후, electron beam evaporation으로 하부 전극을 형성하기 위하여 Ti와 Pt를 각각 10 nm와 100 nm의 두께로 증착하였다. 이후, 제작된 AlOx 용액을 spin coating 방법으로 1000 rpm 10 초, 6000 rpm 30 초의 조건으로 증착하였다. Solvent 및 불순물 제거를 위하여 $180^{\circ}C$의 온도에서 10 분 동안 열처리를 진행하였고, 상부 전극을 형성하기 위해 shadow mask를 이용하여 각각 50 nm, 100 nm 두께의 Ti와 Al을 electron beam evaporation 방법으로 증착하였다. 측정 결과, 용액 공정 방법으로 형성한 AlOx 기반의 ReRAM에서는 기존의 sputtering 방법으로 제작된 ReRAM에 비해서 저항 분포가 균일하지는 않았지만, 103 cycle 이상의 우수한 endurance 특성을 나타냈다. 또한, 1 V 내외로 동작 전압이 낮았으며 104 초 동안의 retention 측정에서도 메모리 특성이 일정하게 유지되었다. 결론적으로, 간단한 용액 공정 방법은 ReRAM 소자 제작에 많이 이용될 것으로 기대된다.

• 한국산학기술학회논문지
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• 제1권1호
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• pp.37-42
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• 2000

유기금속 화학기상증착기술에 의해 폴리이미드 기판과 질화티탄 기판 위에 구리박막을 형성하였다. 구리박막을 화학기상증착기술에 의해 형성하면 종래의 물리적증착기술에 비하여 증착속도가 빠르고 층덮힘 성질이 좋아 산업체의 제품생산 응용에서 많은 장점이 있다. 이 장점은 제품의 생산성과 신뢰성에 영향을 미친다. 기판의 온도와 구리전구체 증기압력 조건을 변화시키며 반복실험을 실시하였으며, 시편에 따라서는 전기적 성질 향상을 위하여 후속 열처리를 수행하였다. 형성된 구리박막의 미세구조는 전자현미경으로 관찰하였으며, 전기비저항은 4점 프로브를 이용하여 측정하였다. 질화티탄을 기판으로 사용한 경우 구리박막에서는 섭씨 180도의 기판온도에서 만들어진 시편에서 가장 좋은 전기적 성질이 측정되었다. 한편, 폴리이미드 기판을 사용한 경우, 기상과 액상의 혼합상태 전구체를 이용하여 250 nm/min의 매우 높은 증착속도를 얻을 수 있었다.