• 한국정밀공학회지
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• 제17권2호
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• pp.130-136
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• 2000

Generally, the build-up printed circuit board manufactured by the sequential process with etching, plating, drilling etc. requires many types of equipments and lead time. Etching process is suitable for mass production, however, it is not adequate for manufacturing prototype in the developing stage. In this study, we introduce a screen printing technology to prototyping a build-up printed circuit board. As for the material, photo/thermal curable resin and conductive paste are used for the formation of dielectric and conductor. The build-up structure is made by subsequent processes such as the formation of liquid resin thin layer, the solidification by UV/IR light, and via filling with conductive paste. By use of photo curable resin, productivity is greatly enhanced compared with thermal curable resin. Finally, the basic concept and the possibility of build-up printed circuit board prototyping are proposed in comparison with to the conventional process.

• International Journal of Precision Engineering and Manufacturing
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• 제4권4호
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• pp.51-56
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• 2003

Generally, the build-up printed circuit board manufactured by a sequential process involving etching, plating, drilling, etc, which requires many types of equipments and long lead time. Etching process is suitable for mass production, however, it is not adequate for manufacturing a prototype in the development stage. In this study, we introduce a screen printing technology for prototyping a build-up printed circuit board. As for the material, photo/thermal curable resin and conductive paste are used for the formation of dielectric and conductor. The build-up structure is made by subsequent processes such as formation of a liquid resin thin layer, solidification by a UV/IR light, and via hole filling with a conductive paste. By use of photo curable resin, productivity is greatly enhanced compared with thermal curable resin. Finally, the basic concept and the possibility of build-up printed circuit board prototyping are proposed in comparison with the conventional process.

• 한국염색가공학회지
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• 제29권1호
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• pp.37-44
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• 2017

An issue of major concern in the utilization of laminated composites based epoxy resin is associated with the occurrence of delaminations or interlaminar cracks, which may be related to manufacturing defects or are induced in service by low-velocity impacts. A strong interfacial filament/brittle epoxy resin bonding can, however, be combined with the high fracture toughness of weak interfacial bonding, when the filaments are arranged to have alternate sections of shear stress. To improve this drawback of the epoxy resin, UV-thermal dual curable resin were developed. This paper presents UV-thermal dual curable resin which were prepared using epoxy acrylate oligomer, photoinitiators, a thermal-curing agent and thermoset epoxy resin. The UV curing behaviors and characteristics of UV-thermal dual curable epoxy resin were investigated using Photo-DSC, DMA and FTIR-ATR spectroscopy. The mechanical properties of UV-thermal dual curable epoxy resin impregnated CF prepreg by UV curable resin content were measured with Tensile, Flextural, ILSS and Sharpy impact test. The obtained results showed that UV curable resin content improves the epoxy toughness.

• 마이크로전자및패키징학회지
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• 제6권4호
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• pp.15-22
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• 1999

일반적으로 빌드업 다층 인쇄회로기판은 에칭, 도금등의 습식공정에 의해 제작이 이루어지므로 많은 장비와 많은 시간이 필요하게 된다. 이러한 습식공정은 양산에는 적합하지만 개발단계에서는 그리 적합하지 않은 방법이다. 본 연구에서는 스크린 인쇄기술을 도입하여 빌드업 다층 인쇄회로기판을 제작하여 보았다. 절연성 재료로는 광경화성수지 또는 열경화성수지를 사용하였으며 전도성 재료로는 전도성 페이스트를 사용하였다. 층간의 전기적 연결을 담당하는 비아와 회로를 형성하기 위해 스크린 인쇄공정을 통해 전도성 페이스트를 인쇄 하였다. 이러한 방법을 통해 제품의 개발 단계에서 기존의 빌드업 다층 인쇄회로기판 제작 공정과 비교하여 좀더 효율적인 방법을 제시하였다.

• 한국표면공학회지
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• 제55권3호
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• pp.173-179
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• 2022

This study presents a roll-to-roll process which is capable of Ag nanowire (AgNW) transfer from polyethylene terephthalate (PET) film to polycarbonate (PC) film. We developed a roll-to-roll machine that consists of two film suppliers, a coater of photo-curable resin, a film laminator, an ultraviolet (UV) exposure unit, and a film winder to facilitate large-area electrode transfer between different flexible substates. Using the process, optimal fabrication condition was investigated by parametric experiments in terms of the UV exposure time, number of thermal cycling, and exposure time of high temperature and humidity. A fabricated AgNW on PC film showed sheet resistance of 52 Ω/sq and optical transmittance of approximately 80 % over a range of visible light.

• 마이크로전자및패키징학회지
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• 제12권4호통권37호
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• pp.275-280
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• 2005

나노 임프린트 (NIL)와 포토 리소그라피를 접목시킨 combined nanoimprint and photolithography (CNP) 기술을 이용하여 나노 미세 패턴을 형성하였다. 일반적인 UV-NIL 스탬프의 양각 패턴 위에 Cr 금속막을 입힌 hybrid mask mold (HMM)을 E-beam writing과 plasma etching으로 제작하였다. HMM 전면에는 친수성 물질인 $SiO_2$를 코팅하여 점착방지막 역할의 self-assembled monolayer(SAM) 형성을 용이하게 함으로써 HMM과 transfer layer의 분리를 용이하게 하여 패턴 손상을 억제하였다. 또한, transfer layer에는 일반적인 monomer resin 대신에 건식 에칭에 대한 저항력이 높은 negative PR을 사용하였다. Photo-mask 역할을 하는 HMM의 Cr 금속막이 UV를 차단하여 잔류하게 되는 PR의 비경화층(unexpected residual layer)은 간단한 현상 공정으로 제거하여 PR 잔류층이 없는 나노 미세 패턴을 transfer layer에 형성하였다.