• 제목/요약/키워드: patterning process

검색결과 445건 처리시간 0.046초

국부적 양극산화 기술 동향 (Technological Trends in a local anodization)

  • 강광모;최수민;나윤채
    • 한국표면공학회지
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    • 제56권2호
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    • pp.115-124
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    • 2023
  • Anodization is an electrochemical process that electrochemically converts a metal surface into an oxide layer, resulting in enhanced corrosion resistance, wear resistance, and improved aesthetic appearance. Local anodization, also known as selective anodization, is a modified process that enables specific regions or patterns on the metal surface to undergo anodization instead of the entire surface. Several methods have been attempted to produce oxide layers via localized anodic oxidation, such as using a mask or pre-patterned substrate. However, these methods are often intricate, time-consuming, and costly. Conversely, the direct writing or patterning approach is a more straightforward and efficient way to fabricate the oxide layers. This review paper intends to enhance our comprehension of local anodization and its potential applications in various fields, including the development of nanotechnologies. The application of anodization is promising in surface engineering, where the anodic oxide layer serves as a protective coating for metals or modifies the surface properties of materials. Furthermore, anodic oxidation can create micro- and nano-scale patterns on metal surfaces. Overall, the development of efficient and cost-effective anodic oxidation methods is essential for the advancement of various industries and technologies.

Maskless 방식을 이용한 PCB 생산시스템의 진동 해석 (VIBRATION ANALYSIS OF PCB MANUFACTURING SYSTEM USING MASKLESS EXPOSURE METHOD)

  • 장원혁;이재문;조명우;김종수;이철희
    • 한국소음진동공학회:학술대회논문집
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    • 한국소음진동공학회 2009년도 추계학술대회 논문집
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    • pp.421-426
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    • 2009
  • This paper presents vibration analysis of maskless exposure module in Printed Circuit Board (PCB) manufacturing system. In order to complete exposure process in PCB, masking type module has been widely used in electronics industries. However, masking process confronts some limitations of application due to higher production cost for masking as well as lower printing resolution. Therefore, maskless exposure module is started to be in the spotlight for flexible production system to meet the needs of fabrication in variable patterns at low cost. Since maskless exposure process adopts direct patterning to PCB, vibration problems become more critical compared to conventional masking type process. Moreover, movements of exposure engine as well as stage generate vibration sources in the system. Thus, it is imperative to analyze the vibration characteristics for the maskless exposure module to improve the quality and accuracy of PCB. In this study, vibration analysis using the Finite Element Analysis is conducted to identify the critical structural parts deteriorating vibration performance. Also, Experimental investigations are conducted by single/dual encoder measurement process under the operating module speed. Measurement points of vibration are selected by three places, which are base of stage, exposure engine and top of stage, to check the effect of vibration from the exposure engine. Comparisons between analysis results and experimental measurement are conducted to confirm the accuracy of analysis results including the developed FE model. Finally, this studies show feasibility of optimal design using the developed FE analysis model.

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Maskless 방식을 이용한 PCB생산시스템의 진동 해석 (Vibration Analysis of PCB Manufacturing System Using Maskless Exposure Method)

  • 장원혁;이재문;조명우;김종수;이철희
    • 한국소음진동공학회논문집
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    • 제19권12호
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    • pp.1322-1328
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    • 2009
  • This paper presents vibration analysis of maskless exposure module in printed circuit board(PCB) manufacturing system. In order to complete exposure process in PCB, masking type module has been widely used in electronics industries. However, masking process confronts some limitations of application due to higher production cost for masking as well as lower printing resolution. Therefore, maskless exposure module is started to be in the spotlight for flexible production system to meet the needs of fabrication in variable patterns at low cost. Since maskless exposure process adopts direct patterning to PCB, vibration problems become more critical compared to conventional masking type process. Moreover, movements of exposure engine as well as stage generate vibration sources in the system. Thus, it is imperative to analyze the vibration characteristics for the maskless exposure module to improve the quality and accuracy of PCB. In this study, vibration analysis using the finite element analysis is conducted to identify the critical structural parts deteriorating vibration performance. Also, Experimental investigations are conducted by single/dual encoder measurement process under the operating module speed. Measurement points of vibration are selected by three places, which are base of stage, exposure engine and top of stage, to check the effect of vibration from the exposure engine. Comparisons between analysis results and experimental measurement are conducted to confirm the accuracy of analysis results including the developed FE model. Finally, this studies show feasibility of optimal design using the developed FE analysis model.

로이유리의 전도성 금속박막을 이용한 발열유리 제작에 관한 연구 (A study on the fabrication of heatable glass using conductive metal thin film on Low-e glass)

  • 오재곤
    • 한국산학기술학회논문지
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    • 제19권1호
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    • pp.105-112
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    • 2018
  • 본 논문은 로이유리(Low emissivity glass) 표면에 증착되어 있는 금속박막의 전도 특성을 이용하여 발열유리(Heatable glass)를 제작하는 방법에 대해 제안한다. 로이유리의 발열량은 로이유리 표면저항에 의한 주울(Joule) 열에 의존하므로 소재의 표면저항을 측정함으로써 예측 및 설계가 가능하다. 본 연구에서는 저방사층이 11nm인 소프트로이유리 시료에 각 50mm 간격으로 은(Ag) 전극을 형성시키고, 4단자법으로 면저항을 측정하여 로이유리의 소비전력과 발열량을 예측한 후에, 제작 및 실험을 통해 발열성능을 확인하였다. 기존의 발열유리 제작방법은 크게 두 가지로 일반유리(Normal glass)에 니크롬(Nichrome) 열선을 삽입하는 방법과, 일반유리에 전도성 투명박막을 증착하는 방법이 있다. 니크롬 열선 삽입 방식은 발열성능은 우수하나 유리 고유의 투명성을 저해하고, 전도성 투명박막을 증착하는 방법은 투명성은 양호하나 공정이 복잡하여 실용성이 저하된다. 본 논문에서는 주로 건축물의 단열효과 향상을 위해 사용되는 로이유리를 이용하여 로이유리 전면에 코팅되어 있는 전도성 금속박막에 레이저 빔을 조사하여 원하는 발열성능을 가지는 발열유리를 제작하는 방법을 제안한다. 제안된 방법은 기존의 니크롬 열선을 삽입하는 방법에 비해 투명성이 양호하고, 전도성 투명박막을 증착하는 방법에 비해 제작과정이 보다 수월함을 확인하였다. 아울러, 레이저를 조사하여 로이유리의 표면 박막을 패터닝(Patterning) 하는 형태에 따른 발열특성의 비교와 로이유리에 적합한 레이저 출력조건을 제시하고자 한다.

열 및 불산 처리를 통한 탄소나노튜브의 전자 방출 특성의 향상 연구 (Study on enhanced electron emission current of carbon nanotube by thermal and HF treatments)

  • 김기서;유제황;이창석;임한얼;안정선;장진;박규창
    • 한국진공학회지
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    • 제17권2호
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    • pp.90-95
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    • 2008
  • 본 연구에서는 열 및 불산을 이용한 후처리 공정이 레지스트층을 이용하여 제작된 탄소나노튜브의 전자 방출 특성에 미치는 영향에 대하여 연구하였다. 전자 방출 전류는 초기에 $8V/{\mu}m$의 전계에서 $4.2{\mu}A/cm^2$의 전류에서 열 및 불산 처리 시 각각 $7.5mA/cm^2$$79mA/cm^2$로 향상되었다. 하지만 열 및 불산 처리를 동시에 실시한 경우 전류 밀도는 $426mA/cm^2$$656mA/cm^2$로 향상된 전자 방출 특성을 얻을 수 있었다. 전자 방출 특성은 처리 순서에 따라 증가하는 양이 다르게 나타났으며, 가장 우수한 전자 방출 특성은 열 처리를 먼저 시행 후, 불산 처리를 하는 공정에서 나타났다. 이는 열 처리에 의한 탄소나노튜브의 결정성의 증가와 이후 불산 처리에 의한 불소 결합의 증가에 기인함을 알 수 있었다. 강한 불소 결합은 탄소나노튜브 에미터의 전자 방출 특성의 향상에 크게 기여를 하였다.

Diamond-like carbon 코팅기술을 사용한 UV-임프린트 스탬프 제작 (Fabrication of UV imprint stamp using diamond-like carbon coating technology)

  • 정준호;김기돈;심영석;최대근;최준혁;이응숙;임태우;박상후;양동열;차남구;박진구
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2005년도 추계학술대회 논문집
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    • pp.167-170
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    • 2005
  • The two-dimensional (2D) and three-dimensional (3D) diamond-like carbon (DLC) stamps for ultraviolet nanoimprint lithography (UV-NIL) were fabricated using two kinds of methods, which were a DLC coating process followed by the focused ion beam (FIB) lithography and the two-photon polymerization (TPP) patterning followed by nano-scale thick DLC coating. We fabricated 70 nm deep lines with a width of 100 nm and 70 nm deep lines with a width of 150 nm on 100 nm thick DLC layers coated on quartz substrates using the FIB lithography. 200 nm wide lines, 3D rings with a diameter of $1.35\;{\mu}m$ and a height of $1.97\;{\mu}m$, and a 3D cone with a bottom diameter of $2.88\;{\mu}m$ and a height of $1.97\;{\mu}m$ were successfully fabricated using the TPP patterning and DLC coating process. The wafers were successfully printed on an UV-NIL using the DLC stamp. We could see the excellent correlation between the dimensions of features of stamp and the corresponding imprinted features.

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Microcontact Printing of Biotin for Selective Immobilization of Streptavidin-fused Proteins and SPR Analysis

  • Lee, Sang-Yup;Park, Jong-Pil;Lee, Seok-Jae;Park, Tae-Jung;Lee, Kyung-Bok;Park, Insung S.;Kim, Min-Gon;Chung, Bong-Hyun
    • Biotechnology and Bioprocess Engineering:BBE
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    • 제9권2호
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    • pp.137-142
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    • 2004
  • In this study, a simple procedure is described for patterning biotin on a glass substrate and then selectively immobilizing proteins of interest onto the biotin-patterned surface. Microcontact printing (CP) was used to generate the micropattern of biotin and to demonstrate the selective immobilization of proteins by using enhanced green fluorescent protein (EGFP) as a model protein, of which the C-terminus was fused to a core streptavidin (cSA) gene of Streptomyces avidinii. Confocal fluorescence microscopy was used to visualize the pattern of the immobilized protein (EGFP-cSA), and surface plasmon resonance was used to characterize biological activity of the immobilized EGFP-cSA. The results suggest that this strategy, which consists of a combination of $\mu$CP and cSA-fused proteins. is an effective way for fabricating biologically active substrates that are suitable for a wide variety of applications. one such being the use in protein-protein assays.

스크린 인쇄법의 공정 조건이 전극 패턴 균일성에 미치는 영향 (Effects of Process Conditions on Electrode Patterning by Screen Printing Method)

  • 이나영;김동철;여동훈;이주성;윤상옥;신효순;이준형
    • 한국전기전자재료학회논문지
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    • 제33권5호
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    • pp.355-359
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    • 2020
  • In this study, image analysis and surface roughness measurements using an optical microscope are presented as a method to quantitatively evaluate the results of screen printing. Using this method, the squeegee speed, which is the printing process condition, and the printability of the electrode according to the screen mesh were evaluated. Increasing the squeegee speed in the printing process acts as a process element that increases the line width precision of the printed electrode and lowers the surface roughness of the printed surface. Furthermore, the edge roughness, which indicates the clarity of printing, was not significantly affected by the speed of the squeegee during printing. The print thickness increases in proportion to the squeegee speed, but is largely dependent on the screen thickness.

AMOLED 제조공정에 사용되는 Fine Metal Mask 용 얇은 Invar 합금의 진동자를 이용한 펨토초 레이저 응용 홀 드릴링 (Application of femtosecond laser hole drilling with vibration for thin Invar alloy using fine metal mask in AMOLED manufacturing process)

  • 최원석;김훈영;신영관;최준하;장원석;김재구;조성학;최두선
    • Design & Manufacturing
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    • 제14권3호
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    • pp.44-49
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    • 2020
  • One of display trends today is development of high pixel density. To get high PPI, a small size of pixel must be developed. RGB pixel is arranged by evaporation process which determines pixel size. Normally, a fine metal mask (FMM; Invar alloy) has been used for evaporation process and it has advantages such as good strength, and low thermal expansion coefficient at low temperature. A FMM has been manufactured by chemical etching which has limitation to controlling the pattern shape and size. One of alternative method for patterning FMM is laser micromachining. Femtosecond laser is normally considered to improve those disadvantages for laser micromachining process due to such short pulse duration. In this paper, a femtosecond laser drilling for thickness of 16 ㎛ FMM is examined. Additionally, we introduce experimental results for controlling taper angle of hole by vibration module adapted in laser system. We used Ti:Sapphire based femtosecond laser with attenuating optics, co-axial illumination, vision system, 3-axis linear stage and vibration module. By controlling vibration amplitude, entrance and exit diameters are controllable. Using vibrating objective lens, we can control taper angle when femtosecond laser hole drilling by moving focusing point. The larger amplitude of vibration we control, the smaller taper angle will be carried out.

진공 압력차이법에 의한 나노 정밀도를 가지는 폴리디메틸실록산 형상복제 (Fabrication Process of a Nano-precision Polydimethylsiloxane Replica using Vacuum Pressure-Difference Technique)

  • 박상후;임태우;양동열;공홍진;이광섭
    • 폴리머
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    • 제28권4호
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    • pp.305-313
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    • 2004
  • 본 연구는 나노 복화공정을 이용하여 마이크로 혹은 나노공정에 응용이 가능한 형상모형 제작공정 개발과 폴리디메틸실록산 (polydimethylsiloxane)를 이용하여 만들어진 형상모형의 몰드로 나노급 정밀도의 폴리디메틸실록산 형상을 복제하는 공정에 관한 것이다. 본 연구에서 제안한 나노 복화공정은 복잡한 형상모형 (pattern)이나 2차원 형상을 CAD 파일 없이 비트맵 그림파일을 이용하여 직접적으로 200nm 정밀도를 가지는 형상으로 만들 수 있다. 형상모형은 펨토초 레이저를 이용하여 이광자 흡수 중합법으로 제작하기 때문에 형상의 정밀도는 레이저 범의 회절한계 이하로 얻을 수 있다. 이렇게 제작된 마스터 형상모형은 본 연구에서 제안한 진공압력차이법으로 폴리디메틸실록산 몰드를 제작하여 기존의 제작방법에 비하여 정밀한 제작이 가능함을 보였으며 또한 제작된 몰드를 이용하여 양각의 플리디메틸실록산 스탬프를 제작하였다.