• Journal of the Korean Society for Precision Engineering
• /
• v.22 no.1
• /
• pp.199-206
• /
• 2005

Mask manufacturing is a high COC and COO process in developing of semiconductor devices because of mask production tool with high resolution. Direct writing has been thought to be the one of the patterning method to cope with development or small-lot production of the device. This study consists two categories. One is the additional process of the direct and maskless patterning generation using SLA for easy and convenient application and the other is a removal process using wet-etching process. In this study, cured status of epoxy pattern is most important parameter because of the beer-lambert law according to the diffusion of UV light. In order to improve the contact force between patterns and substrate, prime process was performed and to remove the semi-cured resin which makes a bad effects to the pattern, spin cleaning process using TPM was also performed. At a removal process, contact force between photo-curable resin as an etching mask and Si wafer is important parameter.

• Journal of Sensor Science and Technology
• /
• v.14 no.6
• /
• pp.423-429
• /
• 2005

In this paper, we proposed the fabrication process of the stable e-beam evaporation and the patterning of metals layer on the polydimethylsiloxane (PDMS) substrate. The metal layer was deposited under the various deposition rate, and its effect to the electrical and mechanical properties (e.g.: adhesion-strength of metal layer) was investigated. The influence of surface roughness to the adhesion-strength was also examined via the tape test. Here, we varied the roughness by changing the reactive ion etching (RIE) duration. The electrode patterning was performed through the conventional photolithography and chemical etching process after e-beam deposition of $200{\AA}$ Ti and $1000{\AA}$ Au. As a result, the adhesion strength of metal layer on the PDMS surface was greatly improved by the oxygen plasma treatment. The e-beam evaporation on the PDMS surface is known to create the wavy topography. Here, we found that such wavy patterns do not effect to the electrical and mechanical properties. In conclusion, the metal patterns with minimum $20{\mu}m$ line width was produced well via the our fabrication process, and its electrical conductance was almost similar to the that of metal patterns on the silicon or glass substrates.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2003.07a
• /
• pp.381-384
• /
• 2003

Photosensitive electordes(Ag and Black) are widely used in the patterning of both address and bus electrodes on the rear and front panel of plasma display panel (PDP). As the need for high resolution(>XGA) and large area(>60 inches) PDP is increased, basic understanding of each component of formulation on the photolithographic process of patterning electrodes are required in order to increase the yield in the production of PDP. In this work, the materials and amount of necessary components of photosensitive electrode paste and their effect on the photolithographic process of patterning electrodes were studied.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.14 no.2
• /
• pp.158-162
• /
• 2001

In this report, a new process for patterning of YBaCuO thin films, ICP(inductively coupled plasma) method, is described by comparing with existing wet etching method. Two 100㎛ wide and 2mm long YBaCuO striplines on LaAlO$_3$ substrates have been fabricated using two patterning techniques. And the properties were compared with the critical temperature and the SEM photography. Then, the critical temperatures of two samples were about 88 K, but the cross section of sample using ICP method was shaper than that using the wet etching method. ICP method can be used as a good etching technique process for patterning of YBaCuO superconductor.

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 2005.09a
• /
• pp.54-58
• /
• 2005

Femtosecond laser is the latest generation pulsed laser delivering shortest pulses. Any solid materials can be machined by it. Femtosecond laser micromachining allows highest precision and minimal heat influence within the workpiece. But due to the complex physical phenomena between the laser beam and the workpiece materials, it is very difficult to determine the optimal process conditions in the femtosecond laser micromachining. In this study, a method to simulate the femtosecond laser micromachining process was proposed. And femtosecond laser micro patterning processes of chromium thin film are simulated by the proposed method using a commercial FE code, LS-Dyna. Simulation results were compared with those of experiments.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2009.10a
• /
• pp.755-757
• /
• 2009

We developed a novel patterning method of organic light emitting materials using a laser-inscribed sacrificial layer for fabricating high-resolution pixels in organic light emitting displays (OLEDs). Our patterning process is capable of achieving high spatial resolution of about 10 ${\mu}m$. Moreover, it has no detrimental effect on the electrical properties of organic materials. This patterning approach is expected to be applicable for patterning and integrating a wide range of organic materials for organic electronic and optoelectronic devices.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2007.06a
• /
• pp.76-76
• /
• 2007

Several kinds of photo-chromic polymers containing push-pull structure were synthesized and investigated on optical patterning by photo-induced surface relief gratings (SRG) technique. The azobenzene segment was introduced as a functional group for a photo-triggered tran-cis isomerization. Consequently, we have fabricated micro-size regular pattern by one-step process without photo-mask.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2003.05c
• /
• pp.116-119
• /
• 2003

Self-patterning of thin films using photosensitive sol solution has advantages such as simple manufacturing process compared to photoresist/dry etching process. In this study, ferroelectric $Sr_{0.9}Bi_{2.1}Ta_2O_9$(SBT) and $La_{0.5}Sr_{0.5}CoO_3$(LSCO)thin films have been prepared by spin coating method using photosensitive sol solution. $Sr(OC_2H5)_2$, $Bi(TMHD)_3$ and $Ta(OC_2H)_5)_5$ were used as starting materials for SBT solution and $La(OCH_2CH_2OCH_3)_3$, $Sr(OC_2H_5)_2$, $CO(OCH_2CH_2OCH_3)_2$ were used for LSCO solution. Solubility difference by UV irradiation on LSCO thin film allows to obtain a fine patterning due to M-O-M bond formation. The lowest resistivity($4{\times}10^{-3}{\Omega}cm$) of LSCO thin films was obtained by annealing at $740^{\circ}C$.

• Journal of the Korean Ceramic Society
• /
• v.40 no.2
• /
• pp.153-158
• /
• 2003

Self-patterning of thin films using photosensitive sol solution has advantages such as simple manufacturing process compared to photoresist/dry etching process. In this study,$La_{0.5}SR_{0.5}CoO_3$(LSCO) thin films as an electrode material for ferroelectric memories have been prepared by spin coating method using photosensitive sol solution. La-2methoxyethoxide, Sr-ethoxide, Co-2methoxyethoxide were used as starting materials. As UV exposure time to the LSCO gel thin film increased, the UV absorption peak intensity of metal${beta}$-diketonate decreased due to reduced solubility by M(metal)-O-M bond formation. Solubility difference by UV irradiation on LSCO gel thin film allows to obtain a fine patterning of thin film. The LSCO thin films annealed over$680{\circ}C$ in air showed perovskite phase and the lowest resistivity$(4{ imes}10^{-3}{Omega}cm)$ of the thin films were obtained by annealing at$740{\circ}C$.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2006.10a
• /
• pp.509-510
• /
• 2006