• Journal of Electrical Engineering and Technology
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• 제13권1호
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• pp.400-405
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• 2018

This paper presents a compact ultra-wideband (UWB) flexible monopole antenna design on a paper substrate. The proposed antenna is made of iterations of a circular slot inside an octagonal metallic patch. This fractal-based geometry has been deployed to achieve compactness along with improved bandwidth, measured reflection coefficient -10 dB bandwidth ranging from 2.7 to 15.8 GHz. The overall size of the antenna is $26mm{\times}19mm{\times}0.5mm$, which makes it a compact one. The substrate used is paper and the main features like environment friendly, flexibility, green electronics applications and low cost of fabrication are the key factors for the proposed antenna. The aforementioned UWB prototype is suitable for many wireless communication systems such as WiMAX, WiFi, RFID and WSN applications. Antenna has been tested for the effect of bending by placing it over a curved surface of a very small radius of 10 mm.

• KSII Transactions on Internet and Information Systems (TIIS)
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• 제10권9호
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• pp.4023-4043
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• 2016

Network virtualization has been regarded as a core attribute of the Future Internet. In a network virtualization environment (NVE), multiple heterogeneous virtual networks can coexist on a shared substrate network. Thus, a substrate network failure may affect multiple virtual networks. In this case, it is increasingly critical to provide survivability for the virtual networks against the substrate network failures. Previous research focused on mechanisms that ensure the resilience of the virtual network. However, the resource efficiency is still important to make the mapping scheme practical. In this paper, we study the survivable virtual network embedding mechanisms against substrate link and node failure from the perspective of improving the resource efficiency. For substrate link survivability, we propose a load-balancing and re-configuration strategy to improve the acceptance ratio and bandwidth utilization ratio. For substrate node survivability, we develop a minimum cost heuristic based on a divided network model and a backup resource cost model, which can both satisfy the location constraints of virtual node and increase the sharing degree of the backup resources. Simulations are conducted to evaluate the performance of the solutions. The proposed load balancing and re-configuration strategy for substrate link survivability outperforms other approaches in terms of acceptance ratio and bandwidth utilization ratio. And the proposed minimum cost heuristic for substrate node survivability gets a good performance in term of acceptance ratio.

• 한국분무공학회지
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• 제11권2호
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• pp.59-68
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• 2006

Experimental results of the metal powder production with internal mixing, internal impinging and the atomizer coupled with substrate design are presented in this paper. In a test with internal mixing atomizer, mean powder size was decreased from $37{\mu}m\;to\;23{\mu}m$ for Pb65Sn35 alloy as the gas-to-melt mass ratio was increased from 0.04 to 0.17. The particle size further reduces to $16.01{\mu}m$ as the orifice area is increased to $24mm^2$. The micrograph of the metal powder indicates that very fine and spherical metal powder has been produced by this process. In a test program using the internal impinging atomizers, the mean particle size of the metal powder was decreased from $22{\mu}m\;to\;12{\mu}m$ as the gas-to-melt-mass ratio increased from 0.05 to 0.22. The test results of an atomizer coupled with a substrate indicates that the deposition rate of the molten spray on the substrate is controlled by the diameter of the substrate, the height of the substrate ring and the distance of the substrate from the outlet of the atomizer. This in rum determines the powder production rate of the spraying processes. Experimental results indicate that the deposition rate of the spray forming material decreases as the distance between the substrate and the atomizer increases. For example, the deposition rate decreases from 48% to 19% as the substrate is placed at a distance from 20cm to 40cm. On the other hand, the metal powder production rate and its particle size increases as the subsrate is placed far away from the atomizer. The production of metal powder with mean particle size as low as $3.13{\mu}m$ has been achieved, a level which is not achievable by the conventional gas atomization processes.

• 마이크로전자및패키징학회지
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• 제20권4호
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• pp.59-63
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• 2013

In this paper, the impact of the copper densities of substrate layers on IC package warpage is studied experimentally and numerically. The substrate strips used in this study contained two metal layers, with the metal densities and patterns of these two layers varied to determine their impacts. Eight legs of substrate strips were prepared. Leg 1 to leg 5 were prepared with a HD (high density) type of strip and leg 6 to leg 8 were prepared with UHD (ultra high density) type of strip. The top copper metal layer was designed to feature meshed patterns and the bottom copper layer was designed to feature circular patterns. In order to consider the process factors, the warpage of the substrate bottom was measured step by step with the following manufacturing process: (a) bare substrate, (b) die attach, (c) applying mold compound (d) and post reflow. Furthermore, after the post reflow step, the substrate strips were diced to obtain unit packages and the warpage of the unit packages was measured to check the warpage trends and differences. The experimental results showed that the warpage trend is related to the copper densities. In addition to the experiments, a Finite Element Modeling (FEM) was used to simulate the warpage. The nonlinear material properties of mold compound, die attach, solder mask, and substrate core were included in the simulation. Through experiment and simulation, some observations were concluded.

• 한국전자파학회논문지
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• 제19권11호
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• pp.1265-1271
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• 2008

본 논문에서는 FR4와 같은 저가의 고손실 기판을 이용하여 금속 부착형 태그 안테나를 설계하는 새로운 방법을 제안한다. 제안한 설계 방법은 유전 손실(dielectric loss)에 따른 기판 손실(substrate loss)을 크게 감소시킴으로써, 태그 안테나의 복사 효율(radiation efficiency)을 기존의 평면 역 F 안테나(planar inverted-F antenna: PIFA)에 비하여 2배 이상 향상시킨다. 본 논문에서는 제안한 방법에 따른 안테나의 등가 회로 모델을 정립하고 이를 체계적으로 분석하였으며, 시제품을 제작 및 측정하여 제안한 방법의 우수성을 입증하였다.

• 한국진공학회지
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• 제8권3A호
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• pp.194-200
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• 1999

In this paper studied was the piezoelectric properties of the $\beta$-PVDF organic thin films prepared by physical vapour deposition method. The molecular orientation of organic thin films was controlled by the application of an electric field and variation of substrate temperature during the evaporation process. Optimum conditions of manufacturing $\beta$-PVDF organic thin film by physical vapor deposition method is to keep at the substrate temperature of $80^{\circ}C$, at the applied electric field of 142.8 kV/cm. The voltage output coefficient increased from 1.39 to 7.04V increasing the force moment.

• 산업기술연구
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• 제39권1호
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• pp.33-39
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• 2019

This paper addresses effects of nanoscale structures on structural colors of micropatterned transparent substrate by light diffraction. Structural colors is widely investigated because they present colors without any chemical pigments. Typically structural colors is presented by diffraction of light on a micropatterned surface or by multiple interference of light on a surface containing a periodic or quasi-periodic nano-structures. In this paper, each structural colors induced by quasi-periodic nano-structures, periodic micro-structures, and nano/micro dual structures is measured in order to investigate effects of nanoscale and microscale structures on structural colors in the transparent substrate. Using pre-fabricated pattern mold and hot-embossing process, nanoscale and microscale structures are replicated on the transparent PMMA(Poly methyl methacrylate) substrate. Nanoscale and microscale pattern molds are prepared by anodic oxidation process of aluminum sheet and by reactive ion etching process of silicon wafer, respectively. Structural colors are captured by digital camera, and their optical transmittance spectrum are measured by UV/visible spectrometer. From experimental results, we found that nano-structures provide monotonic colors by multiple interference, and micro-structures induce iridescent colors by diffraction of light. Structural colors is permanent and unchangeable, thus it can be used in various application field such as security, color filter and so on.

• 펄프종이기술
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• 제33권2호
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• pp.81-86
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• 2001

The functions of food packaging are not only prevention from physical damage and loss during carrying and transportation, but also extension of shelf-life by adding antimicrobial substrate in packaging materials. Consumption of active packaging is gradually increasing. With different dosage of potassium sorbate(P.S.), the food preservative agent, antimicrobial papers were made by internal and external application of starch. The antimicrobial action of the paper was analyzed by the halo test and the shake flask method. The mechanical properties and strength were also measured. Antimicrobial papers adding P.S. showed higher values in tensile index than adding starch. The antimicrobial paper using starch showed similar microbe decreasing rate as that using P.S. Though microbe decreasing rate was 21.9%, it showed possibility to make antimicrobial paper using food preservative.

• 한국해양공학회지
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• 제15권3호
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• pp.69-74
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• 2001

This paper was to investigate of a adhesiveness for the plasma sprayed coating materials did salt spray by acoustic emission method in tensile loadings. The powders used for the coating were nickel aluminum composite powder Ni-4.5wt.%Al and titanium dioxide powder $TiO_2$. These powders were coated on a carbon steel S45C by plasma spray method. The result solution was a 5% NaCl and the slat spray times were 2, 5 and 10 hours respectively. The salt solution penetrated into the surface of the substrate through pore of the coating layer built in the process of plasma spay. Corrosion productions formed on the surface of substrate. The adhesiveness between the substrate and the coating layer is weaken by corrosion and the exfoliation initiated chiefly at the corrosion surface of the substrate. The AE events and energy of the corroded coating specimens decreased as the salt spray times increased.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 춘계학술대회 논문집 전자세라믹스 센서 및 박막재료 반도체재료 일렉트렛트 및 응용기술
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• pp.126-129
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• 2000

This paper describes on the fabrication of a SOI substrate by SDB technology and electrochemical etch-stop. The surface of the thinned SDB SOI substrate is more uniform than that of grinding or polishing by mechanical method, and this process was found to be very accurate method for SOI thickness control. During electrochemical etch-stop, leakage current versus voltage curves were measured for analysis of the open current potential (OCP) point, the passivation potential (PP) point and anodic passivation potential. The surface roughness and the controlled thickness selectivity of the fabricated a SDB SOI substrate were evaluated by using AFM and SEM, respectively.