• Title/Summary/Keyword: panel size

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An Experimental Study on Thermal Resistance of Large-scale Specimen Using KS F 2278 (KS F 2278을 적용한 대면적 시료 열관류율 시험 실측에 관한 연구)

  • Moon, Jae-Sik;Lee, Won-Gyun;Kim, Young-Bong;Cho, Byoung Young;No, Sang-Tae
    • Proceedings of the Korean Institute of Building Construction Conference
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    • 2018.05a
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    • pp.306-307
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    • 2018
  • In Korea, The thermal resistance test of window sets is performed according to KS F 2278 standard, and is performed only on a specimen size of 2000 × 2000 (mm). In this study, a standard panel measuring 4000 × 3000 (mm) size was used to measure the heat flux in each part of the specimen, and to calculate the resistance to heat transfer And to seize whether the KS F 2278 standard is applicable to large Specimen.

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LCD 팬널의 임프린트 공정을 위한 접촉 평평도 증진 연구

  • Gang Yun-Seok;Jang Si-Yeol;Im Hong-Jae;Sin Dong-Hun;Jeong Jae-Il
    • Proceedings of the Korean Society Of Semiconductor Equipment Technology
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    • 2006.05a
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    • pp.269-272
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    • 2006
  • Surface contacts between mold and target should be in parallel for the imprinting mechanism. However, the size of contacting area makes it difficult for both mating surfaces to be in all contact because of precision level of the imprinting machine and the waviness of mold and target. The gripping force for both mold and target with the vacuum chuck is also major effect to interrupt the full contact, which must be avoided in imprinting mechanism. In this study, the preliminary study for the causes of non-uniformity of contacting surfaces such as mold and target is performed with $470{\times}370mm^2$ LCD panel size.

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Recent Progress on Voltage Drop Compensation in Top Emission Organic Light Emitting Diodes (OLED)

  • Jeong, Byoung-Seong
    • Journal of the Semiconductor & Display Technology
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    • v.19 no.1
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    • pp.49-54
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    • 2020
  • The voltage drop due to the thin cathode film at the large size top emission OLED panel was successfully compensated with making electrical contact between thin cathode and anode auxiliary electrode by 355nm wavelength of laser. It was found that the luminance uniformity dramatically increased from around 15% to more than 80% through this electrical compensation between thin cathode and anode auxiliary electrode. Moreover, the removing process for EL materials on the anode auxiliary electrode process by laser was very reliable and stable. Therefore, it is thought that the EL removal method using laser to make electrical contacts is very appropriate to mass production for such a large size top emission OLEDs to obtain high uniformity of luminance.

Large Size Plastic Display for Outdoor Application

  • Roh, Nam-Seok;Hwang, Tae-Hyung;Lee, Woo-Jae;Hong, Wang-Su;Kim, Sung-Jin;Kim, Sang-Il;Shin, Peter
    • 한국정보디스플레이학회:학술대회논문집
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    • 2007.08a
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    • pp.255-256
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    • 2007
  • A A4 size black and white reflective plastic display was developed for out door application. For document readability, high resolution of 180ppi plastic TFT backplane and high reflectance electrophoretic front panel sheet was used. Preparation of display was held near $100^{\circ}C$ process on PEN substrate.

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Development of Transparent Dielectric Paste for PDP

  • Kim, Hyung-Jong;Kyoung Joo;Auh, Ken-Ho
    • Proceedings of the Korea Association of Crystal Growth Conference
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    • 1998.09a
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    • pp.79-83
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    • 1998
  • Plasma display panel is a potential candidate for HDTV, due to the fact hat the expansion of screen size is much easier using thick film technology. In this study, transparent dielectric materials using lead borosilicate glasses is developed, which satisfy the requirements of dielectrics for PDP. Paste is made of this glass composition. The paste has thixotropic behavior suitable for screen printing. The paste shows more thixotropic behavior as the particle size decrease. After firing, cross sectional area was analyzed by SEM. The void of fired thick film was removed using bimodal particle system. The dielectric showed good adhesion characteristics.

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Mechanical Machining of Prism pattern (프리즘 패턴의 기계적 절삭 가공)

  • Yoo Y. E.;Hong S. M.;Je T. J.;Choi D. S.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2005.09a
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    • pp.110-113
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    • 2005
  • In recent, various shapes of pattern in micron or nano scale are adapted in many applications due to their good mechanical or optical properties. Light guide panel (LGP) of the LCD is one of important applications for micro pattern and micro prism shape is one of the typical patterns. Many applications have the patterns on their surface and the size of the pattern keep decreasing down to the order of micron or even under micron. On the other hand, the area to be patterned keeps enlarging. These two trends in patterned products require tooling micro patterns on large surface, which has still many technical problems to be solved mainly due to pattern size and the tooling area. In this study, we fabricate prism shape of patterns using diamond cutting tool on some metal core and plastic core like PMMA Some of cutting conditions are investigated including cutting force, cutting depth and speed for different core materials.

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Large grain을 가지는 LTPS TFT의 Gate bias stress에 따른 소자의 특성 변화 분석

  • Yu, Gyeong-Yeol;Lee, Won-Baek;Jeong, U-Won;Park, Seung-Man;Lee, Jun-Sin
    • Proceedings of the Korean Vacuum Society Conference
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    • 2010.02a
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    • pp.429-429
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    • 2010
  • TFT 제조 방법 중 LTPS (Low Temperature Polycrystalline Silicon)는 저온과 저비용 등의 이점으로 인하여 flat panel display 제작에 널리 사용된다. 이동도와 전류 점멸비 등에서 이점을 가지는 ELA(Excimer Laser Annealing)가 널리 사용되고 있지만, 이 방법은 uniformity 등의 문제점을 가지고 있다. 이를 극복하기 위한 방법으로 MICC(Metal Induced Capping Crystallization)이 사용되고 있다. 이 방법은 $SiN_x$, $SiO_2$, SiON등의 capping layer를 diffusion barrier로 위치시키고, Ni 등의 금속을 capping layer에 도핑 한 뒤, 다시 한번 열처리를 통하여 a-Si에 Ni을 확산시키킨다. a-Si 층에 도달한 Ni들이 seed로 작용하여 Grain size가 매우 큰 film을 제작할 수 있다. 채널의 grain size가 클 경우 grain boundary에 의한 캐리어 scattering을 줄일 수 있기 때문에 MIC 방법을 사용하였음에도 ELA에 버금가는 소자의 성능과 안정성을 얻을 수있었다. 본 연구에서는 large grain TFT의 Gate bias stress에 따른 소자의 안정성 측정 및 분석에 목표를 두었다.

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Determinants of Corporate Social Responsibility Provision

  • JOHAN, Suwinto
    • The Journal of Asian Finance, Economics and Business
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    • v.8 no.1
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    • pp.891-899
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    • 2021
  • The United Nations' Millennium Development Goals (MDG) has become a goal to create a sustainable life. The MDGs' target was to be achieved in 2015, but it missed that date. The MDGs' target has turned into a Sustainable Development Goals (SDGs) to be achieved by 2030 The SDGs require financial support from companies. Funds are one of the resources to implement the SDGs. Government and private companies need to cooperate in achieving the SDGs target. The company has a responsibility to implement corporate social responsibility. The company's corporate social responsibility is part of the implementation of sustainable development in the SDGs. One of the essential industries that have responsibility for SDGs is the financial industry. This study aims to examine the determinant of corporate social responsibility funds in financial institutions in ASEAN countries. This study uses panel data to test the determinant variables on CSF provision. This study uses 45 sustainable development reports from 2015-2019. The total number of banks in the sample came from three countries, namely, Indonesia, Malaysia, and Thailand. This study concludes that firm size, profitability, efficiency, and the age of the CEO are variables that influence the size of corporate social responsibility funds.

A Study on the Design of the Stern Stow Net (선미식 안강망 어구의 설계에 관한 연구)

  • 김진건
    • Journal of the Korean Society of Fisheries and Ocean Technology
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    • v.35 no.4
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    • pp.343-352
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    • 1999
  • Because stow net being used in now is doing throwing net and hauling net through a ship's side, the work is very complicated and the fishing boat needs many seamen and it could cause a loss of lives and ship in stormy weather. We are now using small mesh size 36~500mm and it even catches young fish, so we call it the fishing gear of resource reduction type.Therefore we must make manpower reduction in automatic operation, safe operation of throwing net and hauling net in the stern and the stern-typed stow net of resource management using large mesh. And we performed three-typed model tests to examine the fishing gear. The obtained results are as follows;1. The fishing gear being used in the ship's side type stow net has inappropriate standard and arrangement of the net, resistance increase of the fishing gear and frequent breakdown of the net.2. To supplement the fault of A-typed stow net, we schemed fishing gear developed as both B-type(12-seamed net) and C-types(8-seamed net) of the stern-typed stow net. 3. In model tests, C-typed model net(mesh size 40~1,600mm) was proved good fishing gear because the resistance in accordance with the flowing speed was comparatively small and it's mouth area was broad. 4. A-typed stow net had the spreading device attached to side panel of the net, but the stern-typed stow net had the spreading device consisted of 4 lines far behind about 6m from side panel of the net mouth. In the flowing speed 2knot, the spreading condition of fishing gear was proved batter than the former.

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COG (Chip On Glass) Bonding Technology for Flat Panel Display Using Induction Heating Body in AC Magnetic Field (교류자기장에 의한 유도가열체를 이용한 평판 디스플레이용 COG (Chip On Glass) 접속기술)

  • Lee Yoon-Hee;Lee Kwang-Yong;Oh Tae-Sung
    • Journal of the Microelectronics and Packaging Society
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    • v.12 no.4 s.37
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    • pp.315-321
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    • 2005
  • Chip-on-glass technology to attach IC chip directly on the glass substrate of flat panel display was studied by using induction heating body in AC magnetic field. With applying magnetic field of 230 Oe at 14 kHz, the temperature of an induction heating body made with Cu electrodeposited film of 5 mm${\times}$5 mm size and $600{\mu}m$ thickness reached to $250^{\circ}C$ within 60 seconds. However, the temperature of the glass substrate was maintained below $100^{\circ}C$ at a distance larger than 2 mm from the Cu induction heating body. COG bonding was successfully accomplished with reflow of Sn-3.5Ag solder bumps by applying magnetic field of 230 Oe at 14 kHz for 120 seconds to a Cu induction heating body of 5mm${\times}$5mm size and $600{\mu}m$ thickness.

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