Processing and Electrical Properties of COG(Chip on Glass) Bonding Using Fine-pitch Sn-In Solder Bumps (미세피치 Sn-In 솔더범프를 이용한 COG(Chip on Glass) 본딩공정 및 전기적 특성)
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- Proceedings of the International Microelectronics And Packaging Society Conference
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- 2003.11a
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- pp.103-105
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- 2003