• Wind and Structures
• /
• 제36권1호
• /
• pp.41-60
• /
• 2023

The effect of cladding panel size on the size reduction factor (SRF) of extreme area-averaging wind pressure (EAWP) on the facades of a high-rise building is often ignored in previous studies. Based on wind tunnel tests, this study investigated the horizontal and vertical correlations of wind pressure on the facade claddings of square-section high-rise buildings. Then, the influencing parameters on the SRF of the EAWP on the cladding panels were analyzed, which were the panel area, panel width, panel length and building width. The results show clear regional distinctions in the correlation of wind pressures on the building facades and the rules of the horizontal and vertical correlations are remarkably different, which causes the cladding size ratio to impact the SRF significantly. Therefore, this study suggests the use of the non-dimensional comprehensive size parameter b^𝜶h^1-𝜶/B (𝜶 is the fitting parameter) determined by the cladding panel horizontal size b, cladding panel vertical size h and the building width B rather than the cladding panel area to describe the variation of the EAWP. Finally, some empirical formula for the SRF of the EAWP on the cladding of a high-rise building is proposed with the nondimensional comprehensive size parameter.

• 한국건축시공학회:학술대회논문집
• /
• 한국건축시공학회 2014년도 추계 학술논문 발표대회
• /
• pp.144-145
• /
• 2014

In the cement,that is the main materials of the panel, as to the cofired process, more than 1,300 enormous energies is consumed, in addition the greenhouse gas generated in the process of producing the cement occupies 6.3% of the country whole emission quantity. And the carbon dioxide of about 0.8 ton is the cement ejected in 1 production. Accordingly, the panel utilizing the industrial byproduct is developed. Accordingly, this research is the experiment which makes the individual size into the environment-friendly inorganic binder panel and by using the blast furnace slag, which is the industrial byproduct with the cement substitute material red mud, silica fume, and etc. looks at the dry shrinkage. The length variation in which the panel which is 450 with the dry shrinkage result of measurement, thickness 12mm, and size 450mm is the smallest was shown.

• International Journal of Air-Conditioning and Refrigeration
• /
• 제9권2호
• /
• pp.69-76
• /
• 2001

The purpose of this research is to investigate the thermal performance of embossing surface sandwich panel and flat surface sandwich panel. To do this research, thermal performances in summer season at the six points of embossing surface sandwich panel and flat surface sandwich panel are investigated focusing on the temperature. Three kinds of embossing surface sandwich panel and one kind of flat surface sandwich panel are used for this research. At the same size of sandwich panel, the average temperature differences of flat surface sandwich panel between average temperature at the 0.5 mm below copper plate and average outside air temperature and surface temperature are higher than those of embossing surface sandwich panel. The average heat transfer rate of flat surface sandwich panel in higher than that of embossing surface sandwich panel. More study will be needed about the size of diameter and height of embossing, and materials of embossing surface sandwich panel.

• 설비공학논문집
• /
• 제12권10호
• /
• pp.917-924
• /
• 2000

The purpose of this research is to investigate the thermal performance of embossing surface sandwich panel and flat surface sandwich panel during the summer. To do this research, thermal performances in summer season at the six points of embossing surface sandwich panel and flat surface sandwich panel are investigated focusing on the temperature. Three kinds of embossing surface sandwich panel and one kind of flat surface sandwich panel are used for this research. At the same size of sandwich panel, the average temperature differences of flat surface sandwich panel between average temperature at the 0.5 mm below copper plate and average outside air temperature and surface temperature are higher than those of embossing surface sandwich panel. The average heat transfer rate of flat surface sandwich panel is higher than that of embossing surface sandwich panel. More study will be needed about the size of diameter and height of embossing, and materials of embossing surface sandwich panel.

• 대한기계학회:학술대회논문집
• /
• 대한기계학회 2001년도 춘계학술대회논문집C
• /
• pp.610-615
• /
• 2001

In the interest of improved automotive fuel economy, one solution is reducing vehicle weight. Achieving significant weight reductions will normally require reducing the panel thickness or using alternative materials such as aluminum alloy sheet. These changes will affect the dent resistance of the panel. In this study, the correlation between panel size, curvature, thickness, material properties and dent resistance is investigated. A parametric approach is adopted, utilizing a "design software" tool incorporating empirical equations to predict denting and panel stiffness for simplified panels. The developed design program can be used to minimize panel thickness or compare different materials, while maintaining adequate panel performance.

• 설비공학논문집
• /
• 제18권12호
• /
• pp.1033-1038
• /
• 2006

We carried out the experiments on particle deposition onto the cleanroom wall panels. And then we investigated the particle deposition characteristic coefficients for electrostatic voltages and particle size. It was found that there is little difference in characteristics of the particle deposition between the steel panel and the anti-static coating panel. In case of that the particle size is under $1.0{\mu}m$, the particle deposition characteristic coefficient becomes larger as the electrostatic voltage induced to the cleanroom wall panel is increasing. Where in case of that the particle size is over $3.0{\mu}m$, the particle deposition characteristic coefficients do not show any differences with the electrostatic voltages. It is due to that the electrostatic force is the major particle transport mechanism for submicron particles, while the gravitational settling is the major particle transport mechanism for overmicron particles when the electro-static voltages are induced to the cleanroom wall panel.

• 한국공작기계학회논문집
• /
• 제15권6호
• /
• pp.88-96
• /
• 2006

The objective of this research works is to develop back panel dies of PDP TV with a large size. In order to design the geometry of the dies and an initial size of blank optimally, the finite element analysis has been carried out using AUTOFORM V4.2. The conner radius of the upper trimming area and the distance from the outer line of the blank holder to the outer line of the blank have been selected as design parameters to remove the wrinkling of the trimming area. The results of the analyses have been shown that a feasible product without wrinkles and skid lines can be obtained when the conner radius ranges from 6mm to 8mm and the distance lines in the range of 40-60mm. From the proposed design of the dies and an initial blank size, the final die set of the back panel has been successfully manufactured.

• 한국복합재료학회:학술대회논문집
• /
• 한국복합재료학회 2002년도 추계학술발표대회 논문집
• /
• pp.241-244
• /
• 2002

Recently, the size of glass panel is increased to $1250 mm{\times}1100 mm{\times}0.7 mm$, whose mass is 2.65 kg, which requires much stiffer robot structure. In addition to the high stiffness, the robot hands and wrists for glass panel handling should have miller surface finishing of its outer surface to prevent particles and dusts from adhering on the surface. The maximum height of the robot structure should not be larger than 1500 mm because other automated guided vehicles (AGV) and transfer equipments have been designed within this size limit. The difference of maximum deflections of the four ends of the hands before and after loading the glass panel should be less than 2.0 mm. In this work, the robot hands and wrists for handling large glass panel displays were designed based on the axiomatic design using the finite element method along with optimization routine.

• 대한전기학회논문지:전기물성ㆍ응용부문C
• /
• 제48권12호
• /
• pp.768-772
• /
• 1999

A new TFT-LCD panel with air-bridge type gate to data line inter-crossing has been proposed and its characteristics have been measured. The proposed structure has air-gap between gate and data line inter-crossing. This air-bridge TFT-LCD panel has very small capacitance between gate and data line. The new panes structure achieves 9 times fast signal propagation compared with conventional panel, which enables to have enough design margin for 20-inch diagonal and larger size UXGA panel. We have examined thermal and mechanical durability of new panel to verify applicability for commercial AMLCD production. After TEOS and polyimide passivation, this panel withstood a thermal stress at $250^{\circ}C$ and a mechanical stress during the rubbing process.

• 한국가구학회지
• /
• 제21권6호
• /
• pp.449-458
• /
• 2010

본 연구는 중밀도섬유판(MDF)의보드두께에 따른 수평밀도분포(HDD: horizontal density distribution)를 조사하기 위해 수행하였다. 생산공장에서 제조된 보드두께가 다른 5 종류 즉 2 mm, 4.5 mm, 9 mm, 18 mm 및 30 mm의 원판을 두 가지 다른 시편크기 즉 $500{\times}500\;mm$와 $120{\times}120\;mm$로 제작하여 수평밀도분포를 측정하였다. 전체적으로MDF의 밀도는 보드두께가 증가할수록 감소하는 경향을 보였으며, 가장 얇은 보드두께의 MDF가 가장높은 밀도를 나타내었다. 수평밀도분포의 변이는 작은 크기 즉 $120{\times}120\;mm$의 시편에서 큰 차이를 보여 MDF의 보드두께가 수평밀도분포에 큰 영향을 미치는 것으로 나타났으며 보드두께가 클수록 감소하는 경향을 나타내었다. 또 보드두께가 적을수록 수평밀도분포의 밀도분포는 컸으나 보드두께가 클수록 밀도범위가 좁게 나타났다. 수평밀도분포의 변이계수(COV)는 보드두께가 증가함에 따라 감소하는 경향을 보였다. 요약하면 MDF 보드두께는 수평밀도분포에 매우 큰 영향을 미치며시편의 크기 또한 상당한 영향을 미치는 것으로 나타났다.