• 제목/요약/키워드: pad

검색결과 2,602건 처리시간 0.028초

다목적 기능을 가진 수목보호패드의 성능 연구 (Performance Research of a Multi Functional Tree Protection Pad)

  • 정용조;이경연
    • 한국환경복원기술학회지
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    • 제21권1호
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    • pp.133-143
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    • 2018
  • In spite of the growing importance of landscaping trees, the rate of flawed and withered trees damaged by pest, disease, drought or frost is increasing. In order to evaluate the performance of the Tree Protective Pad, which are developed to reduce the failure ratio in landscape planting, the tree protective pad for 'digging', 'pest controlling', and 'insulating' are tested based on the five functional criteria; moisturizing effect, wither preventive effect, pest and disease control, thermal effect, tensile strength, and environmental performance. The result of this study is as follows. The moisturizing effect of the tree protective pad for digging is found to be outstanding. According to the result of testing the pad on trees, in particular, it is better than jute tape in wither preventive effect, which means it is expected to prevent flaw and wilt from planting during the improper seasons like summertime. The experiment of installing the protective tree pad for pest controlling to the trunk of Quercus mongolica shows that preventive effect of the pad from diseases and insects is superior, and it also has economical effect by reducing the use of agricultural chemicals. The comparative test of the pad for insulating and jute tape proves that the temperature of the pad is about $2^{\circ}C$ higher than outside. The rate of tensile strength and biodegradation of the pad exceeds the optimal level, so it is revealed that the pad may be the work efficient and environment-friendly product. Likewise, by timely irrigating trees, the tree protective pad economically prevents trees from pest, disease,drought or frost, which may be caused by improper seasonal or delayed planting. As a means of reducing the flaw and facilitating the growth of trees, the exceptional performance of the pad is expected to effectively used in landscape planting and management.

상부패드의 형상 변경을 통한 'Anti-fluttering 틸팅패드 저널베어링' 개발 (Development of Anti-fluttering Tilting Pad Journal Bearing with the Shape Modification of Upper Pad)

  • 양승헌;나운학;박희주;김재실
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2005년도 춘계학술대회 논문집
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    • pp.796-805
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    • 2005
  • The tilting pad journal bearings have been widely used to support high pressure/high rotating turbine rotors owing to their inherent dynamic stability characteristics. However, fatigue damages in the upper unloaded pads and the break of locking pins etc. by pad fluttering are continuously taken place in the actual steam turbines. The purpose of this paper is to develop a new bearing model that can prevent bearing problems effectively by pad fluttering in a tilting pad journal bearing. A new bearing model which has a wedged groove is suggested from the studies of fluttering mechanism performed by previously research works. The fluttering characteristics of the upper unloaded pad are studied experimentally in order to verify the reliability of a new bearing model. It can be known that the phenomenon of pad fluttering nearly does not occurred in the new bearing model under the various experimental conditions. And it is observed that any kinds of bearing failures by pad fluttering does not detect in the application of acture steam turbines.

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Cu 용 슬러리 환경에서의 보호성 코팅이 융착 CMP 패드 컨니셔너에 미치는 영향 (Effect on protective coating of vacuum brazed CMP pad conditioner using in Cu-slurry)

  • 송민석;지원호
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2005년도 춘계학술대회 논문집
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    • pp.434-437
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    • 2005
  • Chemical Mechanical Polishing (CMP) has become an essential step in the overall semiconductor wafer fabrication technology. In general, CMP is a surface planarization method in which a silicon wafer is rotated against a polishing pad in the presence of slurry under pressure. The polishing pad, generally a polyurethane-based material, consists of polymeric foam cell walls, which aid in removal of the reaction products at the wafer interface. It has been found that the material removal rate of any polishing pad decreases due to the so-called 'pad glazing' after several wafer lots have been processed. Therefore, the pad restoration and conditioning has become essential in CMP processes to keep the urethane polishing pad at the proper friction coefficient and to allow effective slurry transport to the wafer surface. Diamond pad conditioner employs a single layer of brazed bonded diamond crystals. Due to the corrosive nature of the polishing slurry required in low pH metal CMP such as copper, it is essential to minimize the possibility of chemical interaction between very low pH slurry (pH <2) and the bond alloy. In this paper, we report an exceptional protective coated conditioner for in-situ pad conditioning in low pH Cu CMP process. The protective Cr-coated conditioner has been tested in slurry with pH levels as low as 1.5 without bond degradation.

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상부패드의 형상 변경을 통한 'Anti-fluttering 틸팅패드 저널베어링' 개발 (Development of Anti-fluttering Tilting Pad Journal Bearing with the Shape Modification of Upper Pad)

  • 양승헌;나운학;박희주;김재실
    • 한국유체기계학회 논문집
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    • 제8권5호
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    • pp.35-45
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    • 2005
  • The tilting pad journal bearings have been widely used to support high pressure/high rotating turbine rotors owing to their inherent dynamic stability characteristics. However, fatigue damages in the upper unloaded pads and the break of locking pins etc. by pad fluttering are continuously taken place in the actual steam turbines. The purpose of this paper is to develop a new bearing model that can prevent bearing problems effectively by pad fluttering in a tilting pad journal bearing. A new bearing model which has a wedged groove is suggested from the studies of fluttering mechanism performed by previously research works. The fluttering characteristics of the upper unloaded pad are studied experimentally in order to verify the reliability of a new bearing model. It can be known that the phenomenon of pad fluttering nearly does not occurred in the new bearing model under the various experimental conditions. And it is observed that any kinds of bearing failures by pad fluttering does not detect in the application of acture steam turbines.

SMD의 패드 정렬이 PCB 전송 특성에 미치는 영향 (Effects on PCB Transmission Characteristics by SMD Pad Alignment)

  • 김창균;이성수
    • 전기전자학회논문지
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    • 제22권3호
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    • pp.874-877
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    • 2018
  • 인쇄 회로 기판(PCB: printed circuit board)에는 다수의 표면 실장 부품(SMD: surface mount device)이 장착되어 상호 연결되며, 이들을 연결하는 배선의 전송 특성이 나빠지면 시스템의 성능이 감소하게 된다. PCB와 SMD를 연결하는 패드는 PCB 전송 특성에 큰 영향을 미치기 때문에 패드의 위치도 최적화되어야 한다. 본 논문에서는 패드 정렬이 PCB 전송 특성에 미치는 영향을 시뮬레이션 하였다. 주파수가 비교적 낮은 경우에는 패드 정렬이 PCB 전송 특성에 큰 영향을 미치지 않지만 주파수가 높아지거나 패드 크기가 커질수록 패드 정렬에 따른 영향이 커진다. 따라서 목표 주파수와 패드 크기에 따라 세심하게 패드 정렬을 선택할 필요가 있다. 특히 12~18 GHz의 Ku-밴드 주파수 대역에서는 기존의 중앙 정렬 패드보다 제안하는 측면 정렬 패드가 전체적으로 유리하다.

열 파이프용 수평 축열조에서의 열 입력이 축열에 미치는 영향 (An Effect of Heat Input on Thermal Storage for Horizontal Thermal Storage Tank with Heat pipe)

  • 최우석;박이동;김철주;황영규
    • 한국에너지공학회:학술대회논문집
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    • 한국에너지공학회 1995년도 춘계학술발표회 초록집
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    • pp.69-76
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    • 1995
  • The horizontal thermal storage tank with heat pipe which is suitable for the sensible heat storage system is able to store a hot water from the heat source such as heating pad efficiently and to supply a hot water to load rapidly. Therefore Arrangement of heating pad affects thermal flow and thermal storage efficiency. So, if effective arrangement is decided for condition of constant number of heating pad, the more rapid thermal flow effect and higher thermal storage efficiency is obtainable by active heat transfer. In this experiments, number of heating pad is ranged from three, five and nine, and when number of heating pad is constant, arrangement are two types of concentration-type and dispersion-type. As a result, for the case of concentration-type of heating pad, strong entrainment take place in horizontal thermal storage tank with heat pipe by active heat transfer and in the constant number of heating pad, the concentration-type has the higher efficiency with about 5∼6% than the dispersion-type. Therefore, when heating pad is equipted to horizontal thermal storage tank with heat pipe, concentration-type of heating pad is an efficient design in constant number. of heating pad.

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Evaluation of the Aging Life of the Rubber Pad in Power Window Switch

  • Kang, Yong Kyu;Choi, Byung Ik;Woo, Chang Su;Kim, Wan Doo
    • Elastomers and Composites
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    • 제54권4호
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    • pp.351-358
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    • 2019
  • To evaluate the aging of a rubber pad in power window switch which is the part of a vehicle, the accelerated thermal aging test of rubber pad material is performed. Finite element analysis was performed using the nonlinear material constants of the rubber pad to calculate the operating force, and the Arrhenius relationship was derived from the aging temperature and time. The aging test was performed at 150, 180, 210, or 240 ℃ for 1 to 60 days. When the operating force of the rubber pad is changed by 10% from the initial value, the service life is expected to be 113 years, which is much longer than the life of the vehicle. This indicates that the aging life of the rubber pad is sufficiently safe and the operating force of the rubber pad during the life of the vehicle (20 years) was decreased by approximately 8.4%. By examining the correlation between the shear elastic modulus and operating force calculated from finite element analysis under each aging test condition, the changes in the operating force of the rubber pad and the shear elastic modulus showed good linear relationship. The aging life could be predicted by the change in shear elastic modulus and a process for predicting the aging life of automotive power window switch rubber pad parts is described herein.

접촉 면적을 제어할 수 있는 CMP 패드 제작 방법 및 성능 평가에 관한 연구 (A study on manufacture and evaluation of CMP pad controllable contact area)

  • 최재영;김형재;정영석;박재홍;키노시타마사하루;정해도
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.1
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    • pp.247-251
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    • 2004
  • Chemical-Mechanical Polishing(CMP) especially is becoming one of the most important ULSI processes for the 0.25m generation and beyond. And there are many elements affecting CMP performance such as slurry, pad, process parameters and pad conditioning. Among these elements the CMP pad is considered one of the most important because of its change. But the surface of the pad has irregular pores, so there is non-uniformity of slurry flow and of contact area between wafer and the pad, and glazing occurs on the surface of the pad. So we make CMP pad with micro structure using micro molding method. This paper introduces the basic concept and fabrication technique of CMP pad with micro-structure and the characteristic of polishing. Experimental results demonstrate the removal rate, uniformity, and time vs. removal rate.

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패드 마모 균일성 향상을 위한 CMP 컨디셔닝 시스템 설계 변수 연구 (Design Variables of Chemical-Mechanical Polishing Conditioning System to Improve Pad Wear Uniformity)

  • 박병훈;박범영;전언찬;이현섭
    • Tribology and Lubricants
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    • 제38권1호
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    • pp.1-7
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    • 2022
  • Chemical-mechanical polishing (CMP) process is a semiconductor process that planarizes a wafer surface using mechanical friction between a polishing pad and a substrate surface during a specific chemical reaction. During the CMP process, polishing pad conditioning is applied to prevent the rapid degradation of the polishing quality caused by polishing pad glazing through repeated material removal processes. However, during the conditioning process, uneven wear on the polishing pad is inevitable because the disk on which diamond particles are electrodeposited is used. Therefore, the abrasion of the polishing pad should be considered not only for the variables during the conditioning process but also when designing the CMP conditioning system. In this study, three design variables of the conditioning system were analyzed, and the effect on the pad wear profile during conditioning was investigated. The three design variables considered in this study were the length of the conditioner arm, diameter of the conditioner disk, and distance between centers. The Taguchi method was used for the experimental design. The effect of the three design variables on pad wear and uniformity was assessed, and new variables used in conditioning system design were proposed.

평행라인 피봇식 추력베어링의 동특성 해석 (Dynamic Characteristics of Parallel tine Pivoted Pad Thrust Bearing)

  • 이경우;김종수;제양규
    • 한국윤활학회:학술대회논문집
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    • 한국윤활학회 1999년도 제29회 춘계학술대회
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    • pp.111-118
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    • 1999
  • In this paper, linearized dynamic characteristics of parallel line pivoted pad thrust bearing(hereinafter refer to PLP thrust bearing) was analyzed by perturbation method with inlet pressure. Inlet pressure and excitation frequency irfluence dynamic characteristics of PLP thrust bearing at all operating condition, such as angular pivot position, mass of pad. Therefore, the characteristics is have to analyzed with inlet pressure, excitation frequency, mass of pad and thickness of pad. Otherwise, the analysis is able to estimate the characteristics over or under.

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