• Journal of the Korean Society of Environmental Restoration Technology
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• v.21 no.1
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• pp.133-143
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• 2018

In spite of the growing importance of landscaping trees, the rate of flawed and withered trees damaged by pest, disease, drought or frost is increasing. In order to evaluate the performance of the Tree Protective Pad, which are developed to reduce the failure ratio in landscape planting, the tree protective pad for 'digging', 'pest controlling', and 'insulating' are tested based on the five functional criteria; moisturizing effect, wither preventive effect, pest and disease control, thermal effect, tensile strength, and environmental performance. The result of this study is as follows. The moisturizing effect of the tree protective pad for digging is found to be outstanding. According to the result of testing the pad on trees, in particular, it is better than jute tape in wither preventive effect, which means it is expected to prevent flaw and wilt from planting during the improper seasons like summertime. The experiment of installing the protective tree pad for pest controlling to the trunk of Quercus mongolica shows that preventive effect of the pad from diseases and insects is superior, and it also has economical effect by reducing the use of agricultural chemicals. The comparative test of the pad for insulating and jute tape proves that the temperature of the pad is about $2^{\circ}C$ higher than outside. The rate of tensile strength and biodegradation of the pad exceeds the optimal level, so it is revealed that the pad may be the work efficient and environment-friendly product. Likewise, by timely irrigating trees, the tree protective pad economically prevents trees from pest, disease,drought or frost, which may be caused by improper seasonal or delayed planting. As a means of reducing the flaw and facilitating the growth of trees, the exceptional performance of the pad is expected to effectively used in landscape planting and management.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.796-805
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• 2005

The tilting pad journal bearings have been widely used to support high pressure/high rotating turbine rotors owing to their inherent dynamic stability characteristics. However, fatigue damages in the upper unloaded pads and the break of locking pins etc. by pad fluttering are continuously taken place in the actual steam turbines. The purpose of this paper is to develop a new bearing model that can prevent bearing problems effectively by pad fluttering in a tilting pad journal bearing. A new bearing model which has a wedged groove is suggested from the studies of fluttering mechanism performed by previously research works. The fluttering characteristics of the upper unloaded pad are studied experimentally in order to verify the reliability of a new bearing model. It can be known that the phenomenon of pad fluttering nearly does not occurred in the new bearing model under the various experimental conditions. And it is observed that any kinds of bearing failures by pad fluttering does not detect in the application of acture steam turbines.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.434-437
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• 2005

Chemical Mechanical Polishing (CMP) has become an essential step in the overall semiconductor wafer fabrication technology. In general, CMP is a surface planarization method in which a silicon wafer is rotated against a polishing pad in the presence of slurry under pressure. The polishing pad, generally a polyurethane-based material, consists of polymeric foam cell walls, which aid in removal of the reaction products at the wafer interface. It has been found that the material removal rate of any polishing pad decreases due to the so-called 'pad glazing' after several wafer lots have been processed. Therefore, the pad restoration and conditioning has become essential in CMP processes to keep the urethane polishing pad at the proper friction coefficient and to allow effective slurry transport to the wafer surface. Diamond pad conditioner employs a single layer of brazed bonded diamond crystals. Due to the corrosive nature of the polishing slurry required in low pH metal CMP such as copper, it is essential to minimize the possibility of chemical interaction between very low pH slurry (pH <2) and the bond alloy. In this paper, we report an exceptional protective coated conditioner for in-situ pad conditioning in low pH Cu CMP process. The protective Cr-coated conditioner has been tested in slurry with pH levels as low as 1.5 without bond degradation.

• The KSFM Journal of Fluid Machinery
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• v.8 no.5 s.32
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• pp.35-45
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• 2005

The tilting pad journal bearings have been widely used to support high pressure/high rotating turbine rotors owing to their inherent dynamic stability characteristics. However, fatigue damages in the upper unloaded pads and the break of locking pins etc. by pad fluttering are continuously taken place in the actual steam turbines. The purpose of this paper is to develop a new bearing model that can prevent bearing problems effectively by pad fluttering in a tilting pad journal bearing. A new bearing model which has a wedged groove is suggested from the studies of fluttering mechanism performed by previously research works. The fluttering characteristics of the upper unloaded pad are studied experimentally in order to verify the reliability of a new bearing model. It can be known that the phenomenon of pad fluttering nearly does not occurred in the new bearing model under the various experimental conditions. And it is observed that any kinds of bearing failures by pad fluttering does not detect in the application of acture steam turbines.

• Journal of IKEEE
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• v.22 no.3
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• pp.874-877
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• 2018

Many SMDs (surface mount device) are mounted and mutually connected on a PCB (printed circuit board). System performance degrades when their transmission characteristics are bad. Pads connecting a PCB and SMDs affects PCB transmission characteristics significantly, so pad should be properly aligned to optimize impedance matching. In this paper, effects on PCB transmission characteristics are simulated by pad alignment. When frequency is relatively low, pad alignment seldom affect PCB transmission characteristics, but it affects more and more when frequency or pad size becomes larger. Therefore, pad alignment should be carefully chosen based on target frequency and pad size. Especially, the proposed edge-aligned pad is generally more advantageous over the conventional centered-aligned pad in 12~16 GHz Ku-band frequency.

• Proceedings of the Korea Society for Energy Engineering kosee Conference
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• 1995.05a
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• pp.69-76
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• 1995

The horizontal thermal storage tank with heat pipe which is suitable for the sensible heat storage system is able to store a hot water from the heat source such as heating pad efficiently and to supply a hot water to load rapidly. Therefore Arrangement of heating pad affects thermal flow and thermal storage efficiency. So, if effective arrangement is decided for condition of constant number of heating pad, the more rapid thermal flow effect and higher thermal storage efficiency is obtainable by active heat transfer. In this experiments, number of heating pad is ranged from three, five and nine, and when number of heating pad is constant, arrangement are two types of concentration-type and dispersion-type. As a result, for the case of concentration-type of heating pad, strong entrainment take place in horizontal thermal storage tank with heat pipe by active heat transfer and in the constant number of heating pad, the concentration-type has the higher efficiency with about 5∼6% than the dispersion-type. Therefore, when heating pad is equipted to horizontal thermal storage tank with heat pipe, concentration-type of heating pad is an efficient design in constant number. of heating pad.

• Elastomers and Composites
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• v.54 no.4
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• pp.351-358
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• 2019

To evaluate the aging of a rubber pad in power window switch which is the part of a vehicle, the accelerated thermal aging test of rubber pad material is performed. Finite element analysis was performed using the nonlinear material constants of the rubber pad to calculate the operating force, and the Arrhenius relationship was derived from the aging temperature and time. The aging test was performed at 150, 180, 210, or 240 ℃ for 1 to 60 days. When the operating force of the rubber pad is changed by 10% from the initial value, the service life is expected to be 113 years, which is much longer than the life of the vehicle. This indicates that the aging life of the rubber pad is sufficiently safe and the operating force of the rubber pad during the life of the vehicle (20 years) was decreased by approximately 8.4%. By examining the correlation between the shear elastic modulus and operating force calculated from finite element analysis under each aging test condition, the changes in the operating force of the rubber pad and the shear elastic modulus showed good linear relationship. The aging life could be predicted by the change in shear elastic modulus and a process for predicting the aging life of automotive power window switch rubber pad parts is described herein.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07a
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• pp.247-251
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• 2004

Chemical-Mechanical Polishing(CMP) especially is becoming one of the most important ULSI processes for the 0.25m generation and beyond. And there are many elements affecting CMP performance such as slurry, pad, process parameters and pad conditioning. Among these elements the CMP pad is considered one of the most important because of its change. But the surface of the pad has irregular pores, so there is non-uniformity of slurry flow and of contact area between wafer and the pad, and glazing occurs on the surface of the pad. So we make CMP pad with micro structure using micro molding method. This paper introduces the basic concept and fabrication technique of CMP pad with micro-structure and the characteristic of polishing. Experimental results demonstrate the removal rate, uniformity, and time vs. removal rate.

• Tribology and Lubricants
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• v.38 no.1
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• pp.1-7
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• 2022

Chemical-mechanical polishing (CMP) process is a semiconductor process that planarizes a wafer surface using mechanical friction between a polishing pad and a substrate surface during a specific chemical reaction. During the CMP process, polishing pad conditioning is applied to prevent the rapid degradation of the polishing quality caused by polishing pad glazing through repeated material removal processes. However, during the conditioning process, uneven wear on the polishing pad is inevitable because the disk on which diamond particles are electrodeposited is used. Therefore, the abrasion of the polishing pad should be considered not only for the variables during the conditioning process but also when designing the CMP conditioning system. In this study, three design variables of the conditioning system were analyzed, and the effect on the pad wear profile during conditioning was investigated. The three design variables considered in this study were the length of the conditioner arm, diameter of the conditioner disk, and distance between centers. The Taguchi method was used for the experimental design. The effect of the three design variables on pad wear and uniformity was assessed, and new variables used in conditioning system design were proposed.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 1999.06a
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• pp.111-118
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• 1999

In this paper, linearized dynamic characteristics of parallel line pivoted pad thrust bearing(hereinafter refer to PLP thrust bearing) was analyzed by perturbation method with inlet pressure. Inlet pressure and excitation frequency irfluence dynamic characteristics of PLP thrust bearing at all operating condition, such as angular pivot position, mass of pad. Therefore, the characteristics is have to analyzed with inlet pressure, excitation frequency, mass of pad and thickness of pad. Otherwise, the analysis is able to estimate the characteristics over or under.