Search | Korea Science

Bauer, Charles E.
- Proceedings of the International Microelectronics And Packaging Society Conference
- /
- 2001.04a
- /
- pp.1-7
- /
- 2001
This paper presents product level considerations for multichip packaging as a cost effective alternative to single chip packaging in the design and manufacture of mobile telephony products. Important aspects include component functionality and complexity, acquisition and logistics costs, product modularity and integration. Multichip packaging offers unique solutions and significant system level cost savings in many applications including RF modules, digital matrix functions and product options such as security, data storage, voice recognition, etc.
PDF

Zuo, Li;Seog, Eun-Ju;Lee, Jun-Ho;Rhim, Jong-Whan
- Journal of Korea Technical Association of The Pulp and Paper Industry
- /
- v.38 no.5 s.118
- /
- pp.66-73
- /
- 2006
The effects of active packaging on the surface stiffness, mass, volume, density and weight changes of fresh as well as stored eggplant were studied at 11 and $25^{\circ}C$ for 10 days with active packaging material Type 1 and 2 and control. Mass, volume, and surface stiffness of eggplant decreased linearly throughout the storage period regardless of storage conditions; while the mass density showed a reverse trend in the ease of $11^{\circ}C$ storage. Reduction rate of mass, mass density and weight was observed minimum at $25^{\circ}C$ storage temperature with active packaging Type 1. The weight of eggplant decreased at a higher rate in the initial 4 days compared to that in the later period of storage regardless of storage temperature and type of packaging.
PDF KSCI