• Food Science and Preservation
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• v.10 no.4
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• pp.574-583
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• 2003

There have been a lot of research efforts on development of active food packaging structures and materials in the form of plastic films and containers, along with investigating novel polymers and bioactive compounds for packaging purpose, in order to improve storage stability and safety of foods during distribution and sale. Recently, great interests focus on antimicrobial package films, as an active packaging system, made from synthetic plastic polymer% and natural biopolymers containing various antimicrobial substances for food packaging applications. In this active system, substances are slowly released onto the food surface. However, antimicrobial activity as well as physical properties of the films can be significantly influenced by several factors such as polymer matrix, antimicrobial compounds, and interactions between polymers and compounds. Thus, this study reviews present status of antimicrobial food packaging films in overall performance aspects including types of polymers and active substances, test for antimicrobial activity, and changes in mechanical and antimicrobial properties by preparation method.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.23 no.1
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• pp.9-15
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• 2017

To identify applicability for packaging material of polyvinyl alcohol (PVA)/boric acid (BA) coating solution with highly-enhanced water vapor and oxygen barrier properties, the PET/PVA-BA/OPP multi-layer films were prepared through comma coating and lamination process. The oxygen and water vapor permeabilities, and tensile strength of as-prepared multi-layer films were investigated before and after pressure cooker test (PCT). Although oxygen and water vapor permeabilites, and mechanical properties of PET/PVA-BA/OPP multi-layer films was decreased after PCT, their properties were highly enhanced as increase of BA contents in PVA matrix. This is strongly related with enhanced cross-linking density in PVA-BA layer. In storage test of seasoned-laver, the PET/PVA-BA/OPP multi-layer films were comparatively effective to suppress the increase in peroxide value originating from oxidation of seasoned-laver. Comparing the commercially available PP/Al-metallized PP for seasoned-laver packaging, however, PET/PVA-BA/OPP multi-layer films did not show any advantage in water activity. This is due to higher water vapor permeation properties of as-prepared multi-layer films. Therefore, further studies are required to enhance the water vapor permeation in PET/PVA-BA/OPP multi-layer films.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.20 no.2
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• pp.41-49
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• 2014

This study illustrates the synthesis of gelatin based zinc oxide nanoparticle (ZnONPs) incorporated nanocomposite films using different concentrations of ZnONPs. The ZnONPs were oval in shape and the size ranged from 100- 200 nm. The nanocomposite films were characterized by UV-visible, FE-SEM, FT-IR, and XRD. The concentrations of ZnONPs greatly influenced the properties of nanocomposite films. The absorption peaks around 360 nm increased with the increasing concentrations of ZnONPs. The surface color of film did not change while transmittance at 280 nm was greatly reduced with increase in the concentration of ZnONPs. FTIR spectra showed the interaction of ZnONPs with gelatin. XRD data demonstrated the crystalline nature of ZnONPs. The thermostability, char content, water contact angle, water vapor permeability, moisture content, and elongation at break of nanocomposite films increased, whereas, tensile strength and modulus decreased with increase in the concentrations of ZnONPs. The gelatin/ZnONPs nanocomposite films showed profound antibacterial activity against both Gram-positive and Gram-negative food-borne pathogenic bacteria. The gelatin/$ZnONP^{1.5}$ nanocomposite film showed the best UV barrier and antimicrobial properties among the tested-films, which indicated a high potential for use as an active food packaging films with environmentally-friendly nature.

• Food Science and Preservation
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• v.13 no.1
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• pp.8-12
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• 2006

The effects of packaging treatments with either low density polyethylene (LDPE) or polypropylene (PP) films on the quality of leaf lettuce were evaluated. It was also stored within a plastic bag (LDPE and PP films) with 4 pelf orated holes (6mm diameter). Changes in weight loss, color difference, anthocyanin, chlorophyll, water content, and general appearance (shape of lettuce) ware investigated Total weight of leaf lettuce packaged within non-pelf orated films decreased slowly over the storage periods at 5 and $20^{\circ}C$. The weight loss of leaf lettuce showed no significant difference between non-pelf orated and perforated films at $20^{\circ}C$. General appearance in leaf lettuce stored at $20^{\circ}C$ was not significantly affected by packaging treatments with LDPE and PP films. The shelf life of non-packaged leaf lettuce at $5^{\circ}C$ was 8 days, whereas packaging treatments with LDPE and PP films showed freshness in leaf lettuce for 30 days of storage. Total chlorophyll and water contents of leaf lettuce packaged within pelf orated and non-pelf orated films decreased gradually during storage. However, no remarkable changes in color difference, levels of chlorophyll and anthocyanin, and water contents were observed in leaf lettuce packaged within perforated and non-pelf orated films. In this experiment, leaf lettuce packaged within LDPE or PP films without any punching holes at $5^{\circ}C$ was the most desirable for extending the quality. These results suggest that non-pelf orated packaging treatment in combination with low storage temperature could be effective in prolonging the shelf life of leaf lettuce

• The monthly packaging world
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• s.178
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• pp.88-95
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• 2008

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.04a
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• pp.65-91
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• 2003

• The monthly packaging world
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• s.148
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• pp.104-107
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• 2005

• The monthly packaging world
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• s.129
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• pp.98-102
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• 2004

• Journal of the Microelectronics and Packaging Society
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• v.9 no.3
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• pp.1-6
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• 2002

A low temperature process technology of copper thin films has been developed by a chemical vapor deposition technology for multi-level metallzations in ULSI fabrication. The copper films were deposited on TiN/Si substrates in helium atmosphere with the substrate temperature between $130^{\circ}C$ and $250^{\circ}C$. In order to get more reliable metallizations, effects on the post-annealing treatment to the electrical properties of the copper films have been investigated. The Cu films were annealed at the $5 \times10^{-6}$ Torr vacuum condition and the electrical resistivity and the nano-structures were measured for the Cu films. The electrical resistivity of Cu films shown to be reduced by the post-annealing. The electrical resistivity of 2.0 $\mu \Omega \cdot \textrm{cm}$ was obtained for the sample deposited at the substrate temperature of $180^{\circ}C$ after vacuum annealed at $300^{\circ}C$. The resistivity variations of the films was not exactly matched with the size of the nano-structures of the copper grains, but more depended on the contamination of the copper films.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.180-182
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• 2002

Copper thin films are prepared by a chemical vapor deposition technology for multi-level metallzations in ULSI fabrication. The copper films were deposited on TiN/Si substrates in helium atmosphere with the substrate temperature between $120^{\circ}C$ and $300^{\circ}C$. In order to get more reliable metallizations, effects on the post-annealing treatment to the electrical properties of the copper films have been investigated. The Cu films were annealed at the $5\times$10^{-6}$ Torr vacuum condition, and the electrical resistivity and the nano-structures were measured for the Cu films. The electrical resistivity of Cu films shown to be reduced by the post-annealing. The electrical resistivity of 2.2 $\mu$$\Omega$.cm was obtained for the sample deposited at the substrate temperature of $180^{\circ}C$ after vacuum annealed at $300^{\circ}C$. The resistivity variations of the films was not exactly matched with the size of the nato-structures of the copper grains, but more depended on the deposition temperature of the copper films.